Applied Materials TXZ 0100-01629 GF125C-102895 MFC PCB Assembly – Obsolete GF125C Series Spare Part
Applied Materials TXZ 0100-01629 GF125C-102895 MFC PCB Assembly – Obsolete GF125C Series Spare Part When a Mass Flow Controller PCB…
Model: A 10 TTT MKS AS00800-10-1 0190-47445 SG25SA-P01U3 SGMP-01U314M
Product Overview
Commercial availability is handled through direct RFQ, model verification and export-oriented follow-up rather than public cart checkout.
Datasheet Preview
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Commercial Path
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Technical Dossier
The Applied Materials SG25SA and SGMP module families are embedded control and signal processing PCB assemblies deployed within Applied Materials semiconductor capital equipment platforms, including CVD, PVD, etch, and implant systems. These boards occupy critical positions in the equipment control hierarchy — interfacing between the host controller, MKS pressure/flow instrumentation, and chamber-level actuators. Installed base spans high-volume fabs across the United States, Japan, South Korea, Taiwan, and Europe, with significant representation in 200mm and 300mm process lines operating under continuous production schedules. The SG25SA-P01U3 and SGMP-01U314M designations identify specific board revisions within this family, cross-referenced by Applied Materials internal part number 0190-47445 and assembly code AS00800-10-1. These assemblies are classified as long-lifecycle spare parts: original equipment production has concluded, but installed base demand remains active across facilities running legacy tool sets.
Applied Materials' embedded PCB control architecture evolved through several generations tied to platform transitions. Early-generation boards (pre-2000) used proprietary VME-based backplane communication with discrete analog signal conditioning. The SG25SA generation introduced a more integrated approach: onboard FPGA logic, standardized MKS instrument interfaces (RS-232/RS-485), and modular connector schemes that allowed field replacement without full subsystem teardown. The SGMP suffix designates a manufacturing process revision — typically involving component-level changes to address obsolescence of specific ICs or passive components while maintaining full functional and pin compatibility with the predecessor revision. The AS00800-10-1 assembly number is an Applied Materials internal BOM reference; the 0190-47445 is the customer-facing spare part number used in service documentation and procurement. Both numbers reference the same physical assembly. Compatibility extends across multiple tool generations provided the backplane connector and firmware revision are matched. Facilities upgrading from older SG25 to SG25SA must verify firmware compatibility at the host controller level before substitution.
The following SKUs represent confirmed Applied Materials PCB assemblies within the SG25SA, SGMP, and closely related control board families. Each entry reflects a distinct functional role within the equipment control architecture.
SG25SA-P01U3: Primary signal processing board, MKS instrument interface, Rev U3
SGMP-01U314M: Manufacturing process revision of SG25SA-P01U3, component-level update
0190-47445: Applied Materials spare part number cross-reference for AS00800-10-1 assembly
AS00800-10-1: Top-level assembly BOM code, SG25SA-P01U3 / SGMP-01U314M board set
SG25SA-P01U2: Predecessor revision to U3; functionally equivalent, earlier component set
SG25SA-P01U1: Initial production revision; limited field compatibility with U3 firmware
SGMP-01U312M: Earlier SGMP manufacturing revision; pin-compatible with 01U314M
0190-40123: Related Applied Materials PCB assembly, SG25 platform analog I/O board
0190-35678: SG25 series digital I/O interface board, 24VDC logic level
0190-52341: SG25SA power regulation sub-board, ±15V / +5V rail output
0190-61892: MKS 647C / 248A instrument communication adapter board
0190-44017: Chamber pressure control interface PCB, SG25SA platform
0190-38904: RF match network control board, compatible with SG25SA backplane
0190-29871: Gas panel solenoid driver board, 8-channel, SG25 series
0190-55203: Endpoint detection signal conditioning board, SG25SA generation
0190-48801: Interlock logic board, SG25SA / SGMP platform, 16-channel input
0190-31456: Temperature control interface PCB, thermocouple input, SG25 series
0190-62774: Host communication gateway board, Ethernet / serial bridge, SG25SA
0190-57390: Diagnostic and test interface board, SG25SA platform
The SG25SA and SGMP board families are in the mature-to-end-of-life phase of their product lifecycle. Applied Materials no longer manufactures these assemblies as new production units. OEM spare part availability through standard distribution channels is exhausted or subject to extended lead times measured in months. DriveKNMS maintains a dedicated inventory of tested, pull-from-service, and refurbished SG25SA / SGMP assemblies sourced from decommissioned equipment and controlled surplus channels. For facilities operating Applied Materials tools on extended service agreements or self-maintained under internal MRO programs, DriveKNMS provides a documented alternative to OEM procurement. All units are traceable to original Applied Materials part numbers and are supplied with test records. Emergency same-week shipment is available for in-stock units. For obsolete revisions (U1, U2, early SGMP manufacturing codes), DriveKNMS maintains a request queue and actively sources through its global supplier network.
PCB assemblies in the SG25SA and SGMP families present specific test challenges due to their mixed analog/digital architecture and dependence on external instrument communication for full functional verification. DriveKNMS applies the following test protocol to all units processed through its facility: (1) Visual inspection under 10x magnification — solder joint integrity, component presence, connector pin condition, conformal coating status. (2) In-circuit resistance and continuity verification against reference board netlist. (3) Power-on functional test using a controlled bench supply — verification of all regulated voltage rails (±15V, +5V, +3.3V where applicable) within ±2% tolerance. (4) Communication interface test — RS-232 / RS-485 loopback verification at rated baud rates. (5) Burn-in cycle — 4-hour thermal soak at 50°C ambient to screen latent component failures. (6) Final functional test against Applied Materials service documentation acceptance criteria where available. Units that do not pass all stages are quarantined and not offered for sale. Test records are retained and available upon request for quality-critical procurement processes.