ALSTOM MVAJ105RA0802A Protection Relay – MiCOM Series
ALSTOM MVAJ105RA0802A Protection Relay: Supply Continuity Strategy for a Discontinued Critical Component The ALSTOM MVAJ105RA0802A is a numerical protection relay…
Model: 250D 30 T 190H, 237207 TD325X2-3W AP3550SM 0040-20006
Product Overview
Commercial availability is handled through direct RFQ, model verification and export-oriented follow-up rather than public cart checkout.
Datasheet Preview
Use attached product manuals when available. If the manual is not public yet, request the full file directly through RFQ.
Commercial Path
Product pages on DRIVEKNMS are designed to verify model, brand and series first, then move the buyer into one clean quotation path.
Technical Dossier
The TOKYO SEIMITSU TD325X2-3W (AP3550SM / 0040-20006) rough grinding wheel is a critical consumable in semiconductor wafer dicing and precision metrology equipment. As TOKYO SEIMITSU progressively transitions its consumable lineup, procurement managers sourcing this specific geometry — 250mm diameter, 30mm thickness, 190mm bore — face a narrowing supply window. This page is designed to give you the factual procurement intelligence you need: real stock status, lead time expectations, and a clear-eyed TCO comparison before you commit to a purchase or a substitute.
| Brand | TOKYO SEIMITSU (東京精密) |
| Part Number | 237207 / TD325X2-3W / AP3550SM / 0040-20006 |
| Wheel Diameter (D) | 250 mm |
| Thickness (T) | 30 mm |
| Bore (H) | 190 mm |
| Application | Rough Grinding – Semiconductor Wafer / Precision Substrate |
| Compatible Equipment | TOKYO SEIMITSU Accretech Grinder Series (confirm with your machine model) |
| Origin | Japan |
| Inventory Status | Limited Stock – Sourced via Authorized Distribution Network |
| Lead Time | 3–10 business days (subject to current stock confirmation); expedited options available |
| MOQ | 1 piece; volume pricing available for orders of 3+ units |
| Warranty | 12 months from shipment date |
Procurement decisions on precision grinding consumables are rarely just about unit price. The real cost driver is unplanned downtime. A single grinding wheel failure on a semiconductor back-grinding line can halt wafer output for 12–48 hours — a cost that dwarfs the price of maintaining a safety stock of 2–3 wheels.
Spare Parts Turnover Rate: For high-utilization grinding equipment running two or more shifts, the TD325X2-3W wheel typically requires replacement every 800–1,200 wafer cycles depending on substrate hardness and coolant conditions. Procurement managers should calculate their annual consumption rate and negotiate blanket orders accordingly to lock in pricing and priority allocation.
Total Cost of Ownership (TCO) Factors to Evaluate:
Q: What are your payment terms?
A: Standard terms are 100% T/T in advance for first-time orders. For established accounts, we offer Net 30 on approved credit. LC at sight is available for orders above USD 10,000.
Q: What is your warranty policy if the part is defective on arrival?
A: DOA (Dead on Arrival) claims must be submitted within 7 days of receipt with photographic evidence. We will arrange replacement or full refund at our cost, including return freight.
Q: Do you offer volume discounts?
A: Yes. Orders of 3–5 units receive a 5% discount; 6–10 units receive 8%; 10+ units are subject to individual negotiation. Contact us for a formal quotation.
Q: Can you source alternative/compatible grinding wheels if this exact part is unavailable?
A: Yes. Our technical team can identify dimensionally equivalent wheels from alternative manufacturers. We will provide a compatibility assessment and clearly disclose the brand and specification differences before you commit.
Q: What is your return policy?
A: Unused, unopened items in original packaging may be returned within 30 days for a refund minus a 10% restocking fee. Custom-sourced or special-order items are non-returnable unless defective.