RADISYS SBCP Series Modules: SBCP5150

Technical Dossier

Product Details And Specifications

RADISYS SBCP Series: Comprehensive Module Range and Technical Overview

The RADISYS SBCP series represents a line of single-board computer and processor modules deployed across heavy industrial environments including petrochemical refineries, nuclear power generation facilities, offshore platforms, and continuous-process chemical plants. These boards serve as the computational backbone of distributed control systems (DCS) and programmable automation controllers (PAC) where long-term platform stability, deterministic processing, and backplane compatibility are non-negotiable operational requirements. The SBCP architecture was designed for carrier-grade embedded computing, conforming to CompactPCI and proprietary RADISYS backplane standards, and has accumulated significant installed base across North American and European industrial sites operating under IEC 61511 and ISA-84 functional safety frameworks.

The Evolution of SBCP Architecture

The SBCP series traces its lineage to RADISYS's embedded computing platforms of the late 1990s, when the company established itself as a supplier of OEM processor boards for industrial and telecommunications infrastructure. Early SBCP variants were built around Intel x86 architecture (Pentium III / Celeron class), operating within CompactPCI 2.0 mechanical and electrical standards. These boards interfaced with RADISYS ENP (Embedded Network Processor) and EPC (Embedded PC) chassis families, providing a standardized slot-based architecture that allowed field replacement without full system shutdown in hot-swap-capable configurations.

As the series matured through the 2000s, successive SBCP revisions incorporated faster FSB speeds, expanded onboard SDRAM and Flash storage, dual Ethernet ports for redundant network paths, and enhanced BIOS/firmware supporting WatchDog timers and remote management. The SBCP5150 specifically represents a mid-generation release optimized for real-time OS environments including VxWorks, QNX, and embedded Linux distributions. Compatibility with legacy RADISYS chassis (EPC-8, EPC-9, ENP-2611) is maintained through consistent CompactPCI pinout standards, though BIOS revisions must be validated against chassis firmware versions before hot-swap deployment.

The SBCP series has entered the mature/end-of-life phase. RADISYS (acquired by Reliance Industries in 2018) has discontinued active production of most SBCP variants. Industrial operators maintaining SBCP-based systems must source replacement boards through authorized secondary-market distributors. Long-term maintenance support, including board-level repair, firmware restoration, and functional burn-in testing, is available through specialized industrial spare parts suppliers.

SBCP Series Full Catalog & Functionalities (SKU List)

The following SKUs represent verified, commonly deployed modules within the RADISYS SBCP and associated series. Each entry reflects a distinct hardware configuration with specific processor, memory, and I/O characteristics.

SBCP5150: CompactPCI single-board CPU, Intel Pentium M class, dual GbE, 512MB SDRAM, primary controller board.
SBCP5120: CompactPCI SBC, lower-clock Pentium III variant, 256MB RAM, single Ethernet, legacy DCS host interface.
SBCP5160: Enhanced SBCP with extended temperature range (-40°C to +85°C), ruggedized for outdoor enclosures.
SBCP5200: Next-generation SBCP, Intel Core 2 Duo architecture, 1GB DDR2, dual GbE, PCIe expansion support.
SBCP5100: Entry-level SBCP, Celeron-class processor, 128MB RAM, single NIC, cost-optimized DCS node.
SBCP5140: Mid-range SBCP, Pentium III 933MHz, 256MB SDRAM, CompactPCI hot-swap compliant, PICMG 2.1 R2.0.
SBCP5180: High-availability variant with redundant power input, dual watchdog timers, NEBS Level 3 compliant.
SBCP5210: SBCP with onboard SATA interface, 2GB Flash, supports embedded Linux and VxWorks 6.x.
SBCP5220: Extended I/O SBCP, four serial ports (RS-232/422/485), dual USB 2.0, industrial fieldbus ready.
SBCP5230: SBCP with PMC expansion site, supports third-party mezzanine I/O cards for protocol bridging.
SBCP5240: Dual-core SBCP, Intel Atom D510, low-power profile, fanless thermal design for sealed enclosures.
SBCP5250: SBCP with ECC memory support, 2GB DDR2 ECC SDRAM, mission-critical fault-tolerant applications.
SBCP5260: SBCP with integrated IPMI 2.0 baseboard management, remote KVM and power cycling capability.
SBCP5270: Compact form-factor SBCP, 3U CompactPCI, reduced slot pitch for high-density chassis configurations.
SBCP5280: Final production SBCP variant, Intel Core i7 (embedded), 4GB DDR3, PCIe Gen2, last active catalog entry before EOL.

Sourcing Hard-to-Find & Obsolete SBCP Series Parts

DriveKNMS maintains a dedicated inventory program for end-of-life RADISYS SBCP modules. As RADISYS has ceased active manufacturing of the SBCP line, industrial facilities operating legacy DCS and PAC systems face increasing lead times and supply chain risk when sourcing replacement boards through OEM channels. DriveKNMS addresses this gap through three primary sourcing mechanisms: direct surplus acquisition from decommissioned industrial sites, cross-referencing with compatible OEM-equivalent boards from alternative manufacturers, and board-level refurbishment of functional pulls with full re-testing to original factory specifications.

All SBCP inventory held by DriveKNMS is cataloged by hardware revision, BIOS version, and physical condition grade (New Surplus, Refurbished, Tested Pull). Customers requiring specific firmware versions for chassis compatibility can request pre-configured boards with validated BIOS images. Long-term supply agreements are available for facilities requiring guaranteed annual allocation of SBCP5150 and adjacent SKUs through 2030.

Quality Control for the SBCP Range

RADISYS SBCP boards incorporate complex multi-layer PCB designs with high-density BGA processor packages, DDR memory arrays, and CompactPCI backplane interface logic that require specialized test procedures beyond standard power-on verification. DriveKNMS applies a structured QC protocol to all SBCP units prior to shipment. Each board undergoes visual inspection under 10x magnification for solder joint integrity, capacitor condition, and connector pin alignment. Functional testing is performed in a RADISYS-compatible CompactPCI chassis with validated backplane, executing a minimum 72-hour burn-in cycle under thermal load to screen for latent component failures.

Backplane communication integrity is verified using protocol analyzers monitoring CompactPCI bus transactions at the J1 and J2 connector interfaces. Ethernet ports are tested for full-duplex throughput at 1GbE line rate. Serial interfaces are loopback-tested across all supported baud rates. Memory is validated using memtest86+ extended pass sequences. BIOS POST completion and OS boot verification (embedded Linux or VxWorks image) are required before a unit is cleared for shipment. All test results are documented and available to customers upon request.