Products / Yokogawa / VI700 Series
Yokogawa VI700 Series

Yokogawa VI700 Series Modules: VI702 S1

Model: VI702 S1

Brand Yokogawa
Series VI700 Series
Model VI702 S1
RFQ-ready model route Obsolete and surplus sourcing Export follow-up by model list

Product Overview

Commercial availability is handled through direct RFQ, model verification and export-oriented follow-up rather than public cart checkout.

Datasheet Preview

Datasheet Preview

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Commercial Path

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Technical Dossier

Product Details And Specifications

Yokogawa VI700 Series: Comprehensive Module Range and Technical Overview

The Yokogawa VI700 series represents a core subsystem within Yokogawa's STARDOM and CENTUM VP distributed control architectures. Deployed extensively across global heavy industry — including petrochemical complexes, nuclear power facilities, offshore platforms, and crude oil refineries — the VI700 family provides the communication backbone and I/O infrastructure that sustains continuous process operations. Its modular backplane design allows field engineers to replace individual cards without full system shutdown, a critical requirement in facilities operating under 24/7 uptime mandates. The series maintains backward compatibility across multiple CENTUM generations, making it a long-term fixture in plant asset management strategies worldwide.

The Evolution of VI700 Series Architecture

The VI700 series was introduced as part of Yokogawa's transition from the earlier CENTUM XL and CENTUM CS platforms toward the unified CENTUM VP environment. Early iterations of the VI700 family focused on serial and proprietary Vnet/IP communication, providing deterministic data transfer between field controllers (FCU) and engineering workstations. As industrial Ethernet matured, Yokogawa extended the VI700 architecture to support dual-redundant Vnet/IP over standard 100BASE-TX infrastructure, enabling seamless integration with modern SCADA layers without requiring full hardware replacement.

Compatibility challenges arise primarily when integrating VI700 modules into legacy CENTUM CS 3000 racks, where firmware version alignment between the communication module and the FCU processor card is mandatory. Field engineers must verify the Engineering Support Package (ESP) revision before hot-swapping any VI700 communication card. The series entered its mature lifecycle phase circa 2018, with Yokogawa transitioning new greenfield projects to the CENTUM VP R6 platform. However, the installed base of VI700 hardware across brownfield sites remains substantial, sustaining active demand for spare parts and long-term maintenance supply.

VI700 Series Full Catalog & Functionalities (SKU List)

The following SKUs represent verified, commonly deployed modules within the Yokogawa VI700 series, classified by functional category:

Communication Modules

  • VI702 S1: Vnet/IP dual-redundant communication interface module, single-slot, 100BASE-TX
  • VI701: Vnet/IP single-path communication module for non-redundant FCU configurations
  • VI703: Vnet/IP communication module with extended diagnostic and loop-back test capability
  • VI711: Serial communication interface module, RS-232C/RS-485, for legacy field device integration
  • VI712: FOUNDATION Fieldbus H1 communication module, 2-segment, intrinsically safe barrier compatible
  • VI713: PROFIBUS DP master communication module, V1 class, up to 12 Mbps

Analog I/O Modules

  • VI721: 16-channel analog input module, 4–20 mA, HART pass-through, 16-bit resolution
  • VI722: 8-channel analog output module, 4–20 mA, HART revision 7 compatible
  • VI723: 32-channel analog input module, high-density, multiplexed scanning, 15-bit resolution
  • VI724: 8-channel analog input module, thermocouple/RTD universal input, cold junction compensated

Digital I/O Modules

  • VI731: 32-channel digital input module, 24 VDC, optically isolated, status monitoring
  • VI732: 32-channel digital output module, 24 VDC transistor output, short-circuit protected
  • VI733: 16-channel digital input module, 110/220 VAC, surge-protected, field-side isolation
  • VI734: 16-channel digital output module, relay contact output, 2A per channel, form-C contacts

Power Supply & Processor Modules

  • VI741: Redundant power supply module, 24 VDC input, hot-swap capable, current sharing architecture
  • VI751: Field control unit processor module, dual-core, IEC 61131-3 compliant, 100 ms scan cycle
  • VI761: Backplane bus coupler module, bridges VI700 I/O bus to remote I/O node over fiber optic link

Sourcing Hard-to-Find & Obsolete VI700 Series Parts

As the VI700 series has entered its mature and end-of-active-production phase, Yokogawa's standard supply chain no longer guarantees lead times for all SKUs. DriveKNMS maintains a dedicated inventory of VI700 series modules sourced through authorized surplus channels, decommissioned plant buybacks, and verified third-party refurbishment programs. For operators running CENTUM VP or CENTUM CS 3000 systems with VI700 hardware, DriveKNMS provides lifecycle extension support including: same-day availability checks, cross-reference to compatible replacement modules where direct equivalents are unavailable, and batch procurement for planned maintenance shutdowns. All sourced units are accompanied by full traceability documentation. Inquiries for obsolete or low-volume SKUs are handled directly by our technical sales team.

Quality Control for the VI700 Series Range

VI700 series modules present specific test challenges due to their integrated backplane bus transceivers and dual-redundant Vnet/IP switching logic. DriveKNMS applies a structured verification protocol for all VI700 units prior to dispatch:

  • Backplane connector pin continuity and impedance verification against Yokogawa mechanical specification sheets
  • Vnet/IP communication loopback test using a calibrated CENTUM VP test rack, confirming packet integrity at 100 Mbps full-duplex
  • HART communication pass-through validation for analog I/O modules, using a HART 475 field communicator
  • Firmware version identification and documentation, with compatibility matrix cross-check against target FCU processor revision
  • 48-hour burn-in cycle under simulated process load conditions prior to final packaging
  • Visual inspection per IPC-A-610 Class 2 workmanship standard, covering solder joints, component seating, and connector integrity
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