SIGMATEK LX800 Modules: 01-450-031 256MB CPU,

Technical Dossier

Product Details And Specifications

SIGMATEK LX800 Series: Comprehensive Module Range and Technical Overview

The SIGMATEK LX800 series is a high-performance CPU and I/O platform developed by SIGMATEK GmbH & Co KG (Austria), designed for deployment in demanding industrial automation environments. Based on the AMD Geode LX800 processor architecture (500 MHz, x86-compatible), the LX800 series serves as the computational backbone of SIGMATEK's LASAL X control system. It is installed across continuous-process industries including petrochemical refineries, chemical processing plants, power generation facilities, and offshore platforms where deterministic real-time control and long-term hardware availability are non-negotiable requirements. The platform supports SIGMATEK's proprietary LASAL (Language for Automation Systems and Applications) runtime environment and integrates natively with the S-DIAS and DIAS backplane bus architectures. Its fanless, solid-state design and extended operating temperature range make it suitable for panel-mount and cabinet installations in harsh industrial environments.

The Evolution of LX800 Architecture

SIGMATEK introduced the LX800-based CPU modules as a successor to earlier x86 platforms (including 486 and Pentium-class controllers) in the mid-2000s, coinciding with the commercial availability of the AMD Geode LX800 SoC. The LX800 offered a significant step forward: integrated memory controller, hardware-accelerated floating-point unit, and a power envelope under 1W — critical for fanless industrial enclosures.

Early LX800 modules shipped with 128 MB of onboard SDRAM and CompactFlash storage. Subsequent revisions expanded RAM to 256 MB (as in the 01-450-031) and introduced enhanced communication interfaces including CANopen, Ethernet, and USB. The series was designed for compatibility with SIGMATEK's DIAS backplane, allowing mixed-generation I/O modules to coexist on the same rack — a key factor in its longevity across multi-decade plant installations.

As of 2020–2026, the LX800 series has entered the mature/end-of-life phase. SIGMATEK has transitioned new projects to the S-DIAS CP series (ARM Cortex-A based) and the DIAS-Drive platform. However, the installed base of LX800 systems in legacy plants remains substantial. Lifecycle extension support — including refurbished modules, tested spares, and firmware-matched replacements — is the primary procurement mode for this series.

LX800 Full Catalog & Functionalities (SKU List)

The following SKUs represent verified, commonly referenced modules within the SIGMATEK LX800 / LASAL X ecosystem. Modules are classified by functional category.

CPU / Controller Modules

• 01-450-031: LX800 500MHz CPU module, 256MB SDRAM, CompactFlash slot, primary controller for LASAL X runtime
• 01-450-030: LX800 CPU module, 128MB SDRAM variant, earlier production revision
• 01-450-032: LX800 CPU module with extended I/O interface, 256MB, enhanced Ethernet port
• 01-450-020: LX800-based CPU, compact form factor, single-slot DIAS backplane mount
• 01-450-021: LX800 CPU with integrated CANopen master interface

Digital Input (DI) Modules

• 01-200-010: 16-channel 24VDC digital input module, DIAS bus, 3ms filter
• 01-200-011: 32-channel 24VDC digital input, high-density DIAS format
• 01-200-012: 16-channel digital input with diagnostics, short-circuit detection per channel
• 01-200-020: 8-channel 120VAC digital input module, DIAS backplane

Digital Output (DO) Modules

• 01-210-010: 16-channel 24VDC/0.5A transistor output, DIAS bus
• 01-210-011: 32-channel 24VDC digital output, high-density
• 01-210-020: 8-channel relay output module, 230VAC/2A per channel

Analog Input (AI) Modules

• 01-300-010: 8-channel analog input, 4–20mA / 0–10V selectable, 12-bit resolution
• 01-300-011: 4-channel analog input, 16-bit resolution, differential measurement
• 01-300-020: 8-channel thermocouple input module (Type J/K/T/E), DIAS bus

Analog Output (AO) Modules

• 01-310-010: 4-channel analog output, 4–20mA, 12-bit, DIAS backplane
• 01-310-011: 8-channel analog output, 0–10V / 4–20mA, 14-bit resolution

Communication / Network Modules

• 01-500-010: PROFIBUS-DP master/slave interface module, DIAS bus
• 01-500-020: CANopen master module, 1Mbit/s, DIAS backplane
• 01-500-030: Ethernet TCP/IP communication module, 10/100 Mbit

Power Supply Modules

• 01-100-010: 24VDC DIAS backplane power supply, 5A output
• 01-100-020: Redundant power supply module for LX800 rack, hot-swap capable

Sourcing Hard-to-Find & Obsolete LX800 Parts

The SIGMATEK LX800 series is no longer in active production for most module types. Lead times through official distribution channels are extended or indefinite for many SKUs. DriveKNMS maintains a dedicated inventory of tested LX800 modules sourced from decommissioned plant equipment, authorized surplus channels, and controlled refurbishment programs.

For end-users operating LX800-based LASAL X systems beyond their original design life, DriveKNMS provides: direct replacement of CPU modules (including firmware-matched units), I/O module substitution with functional equivalents, and emergency same-week dispatch for critical process shutdowns. All obsolete LX800 modules are catalogued by hardware revision and firmware compatibility to prevent integration conflicts on existing backplanes.

Quality Control for the LX800 Range

SIGMATEK LX800 modules use a proprietary DIAS backplane bus with time-critical synchronous communication. Standard bench testing is insufficient for validating backplane integrity and inter-module timing. DriveKNMS applies a dedicated test protocol for this series:

• Backplane bus signal integrity verification using oscilloscope capture at 500MHz sampling rate
• CPU module boot sequence validation under LASAL X runtime environment
• Full I/O channel functional test: each digital and analog channel exercised at rated voltage/current
• Communication module loopback testing: PROFIBUS, CANopen, and Ethernet interfaces verified at protocol level
• Thermal stress cycling: modules operated at 55°C for 4 hours to screen latent component failures
• Firmware revision logging: CPU modules shipped with documented firmware version for customer compatibility verification