DALSA CR-GEN0 Series Cameras

Technical Dossier

Product Details And Specifications

DALSA CR-GEN0 Series: Comprehensive Module Range and Technical Overview

The DALSA CR-GEN0 series represents a line of GigE Vision-compliant industrial area-scan cameras engineered for deployment in high-throughput machine vision applications across global heavy industry. These cameras are installed in semiconductor fabs, automotive assembly lines, pharmaceutical inspection systems, flat-panel display manufacturing, and food & beverage sorting lines. The CR-GEN0 platform is built on DALSA's proprietary CMOS sensor architecture and conforms to the GigE Vision 1.2 and GenICam standards, enabling plug-and-play integration with third-party frame grabbers and vision software stacks including Cognex VisionPro, Halcon, and National Instruments Vision. The series spans resolutions from 0.4 MP to 6.4 MP, with monochrome and color variants, making it a scalable backbone for both legacy inspection cells and modern Industry 4.0 deployments. DALSA (now a Teledyne company) has maintained backward-compatible mechanical and electrical interfaces across CR-GEN0 revisions, which is a critical factor for facilities operating mixed-generation equipment.

The Evolution of CR-GEN0 Architecture

The CR-GEN0 designation identifies DALSA's first-generation GigE-native camera platform, introduced as a successor to the earlier Camera Link-based Genie series. The architectural transition from Camera Link to GigE Vision eliminated the need for dedicated frame grabber hardware in standard-bandwidth applications, reducing system BOM cost and simplifying cable infrastructure in large-scale installations. Early CR-GEN0 units shipped with firmware supporting 8-bit and 10-bit pixel formats; subsequent hardware revisions added 12-bit output, expanded ROI (Region of Interest) flexibility, and hardware-triggered multi-exposure modes. The M-suffix variants (e.g., CR-GEN0-M6400R3) denote monochrome sensors, while C-suffix variants carry color (Bayer-pattern) sensors. The R3 revision designation indicates the third hardware revision of the PCB assembly, incorporating improved EMI shielding and revised power regulation circuitry for compliance with CE and FCC Class A requirements. As of 2024, the CR-GEN0 series has entered the mature/end-of-active-production phase. Teledyne DALSA has transitioned new design wins to the Genie Nano and Genie Nano-CL platforms. However, CR-GEN0 units remain in active service across installed bases with operational lifespans extending to 2030+, and DriveKNMS maintains stock and repair capability for the full CR-GEN0 range.

CR-GEN0 Full Catalog & Functionalities (SKU List)

The following SKUs represent verified, commonly deployed models within the DALSA CR-GEN0 series. Each entry includes a concise functional descriptor for rapid identification by maintenance engineers and procurement teams.

CR-GEN0-M0640R3: 0.64 MP monochrome GigE area-scan, VGA-class resolution for high-speed inspection.
CR-GEN0-C0640R3: 0.64 MP color GigE area-scan, Bayer-pattern sensor for color sorting lines.
CR-GEN0-M1400R3: 1.4 MP monochrome GigE, SXGA resolution for mid-range dimensional gauging.
CR-GEN0-C1400R3: 1.4 MP color GigE, SXGA Bayer sensor for label and print inspection.
CR-GEN0-M2000R3: 2.0 MP monochrome GigE, 1080p-class for surface defect detection.
CR-GEN0-C2000R3: 2.0 MP color GigE, 1080p Bayer for pharmaceutical blister pack inspection.
CR-GEN0-M3200R3: 3.2 MP monochrome GigE, high-resolution wafer and PCB inspection.
CR-GEN0-C3200R3: 3.2 MP color GigE, Bayer sensor for textile and web inspection.
CR-GEN0-M4000R3: 4.0 MP monochrome GigE, large-format sensor for flat-panel display AOI.
CR-GEN0-C4000R3: 4.0 MP color GigE, Bayer for high-resolution color grading applications.
CR-GEN0-M5000R3: 5.0 MP monochrome GigE, 5 MP CMOS for precision metrology cells.
CR-GEN0-C5000R3: 5.0 MP color GigE, Bayer for automotive paint and surface inspection.
CR-GEN0-M6400R3: 6.4 MP monochrome GigE, highest-resolution CR-GEN0 variant for fine-pitch inspection.
CR-GEN0-C6400R3: 6.4 MP color GigE, Bayer sensor for high-detail color defect classification.
CR-GEN0-M0640R2: 0.64 MP monochrome, R2 hardware revision, predecessor to R3 with Camera Link-era PCB layout.
CR-GEN0-M1400R2: 1.4 MP monochrome, R2 revision, compatible with R3 lens mounts and C-mount optics.
CR-GEN0-M2000R2: 2.0 MP monochrome, R2 revision, earlier EMI shielding standard.
CR-GEN0-M3200R2: 3.2 MP monochrome, R2 revision, used in legacy semiconductor inspection cells.

Sourcing Hard-to-Find & Obsolete CR-GEN0 Parts

DriveKNMS operates as a specialist distributor and repair depot for end-of-life and hard-to-find DALSA CR-GEN0 units. As Teledyne DALSA has formally discontinued active production of the CR-GEN0 platform, procurement through standard distribution channels is no longer reliable. DriveKNMS maintains a continuously updated inventory of new-surplus, refurbished, and tested-used CR-GEN0 cameras sourced from decommissioned production lines, equipment auctions, and OEM overstock. All units are catalogued by hardware revision (R2/R3), sensor type (M/C), and resolution class. For facilities requiring long-term maintenance agreements (LTMAs) covering CR-GEN0 assets, DriveKNMS offers multi-year supply commitments with guaranteed response times. Customers operating mixed-revision installed bases can request cross-revision compatibility assessments at no charge. Emergency same-day dispatch is available for in-stock units to minimize unplanned downtime in critical production environments.

Quality Control for the CR-GEN0 Range

Each CR-GEN0 unit processed by DriveKNMS undergoes a structured multi-stage inspection protocol designed around the specific failure modes of GigE Vision camera platforms. Stage 1: Visual inspection of the C-mount thread, M12 GigE connector, GPIO connector, and housing for mechanical damage. Stage 2: Power-on functional test using a calibrated 12V DC supply within the specified 10–30V operating range. Stage 3: GigE link negotiation test at 1000BASE-T to confirm PHY integrity and MAC address validity. Stage 4: Live image acquisition test using a standardized resolution target at defined illumination levels; pixel defect mapping is performed against DALSA's factory defect class specifications. Stage 5: Firmware version verification and update to the latest compatible release where applicable. Stage 6: Thermal soak test at 45°C for 2 hours to screen for intermittent solder joint failures common in R2-revision units. All test results are documented and accompany the unit as a test report. Units failing any stage are quarantined for component-level repair or parts recovery.

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