GE Fanuc PACSystems RX7i IC698RMX016-ED VMIVME-5567-100 Modules

Technical Dossier

Product Details And Specifications

GE Fanuc PACSystems RX7i Series: Comprehensive Module Range and Technical Overview

The GE Fanuc PACSystems RX7i platform is a rack-based programmable automation controller (PAC) system deployed extensively across global heavy industry verticals including petrochemical refineries, nuclear power generation facilities, offshore oil & gas platforms, and continuous-process chemical plants. The RX7i architecture is built on a VME64 backplane standard, supporting high-density I/O expansion and deterministic real-time control. Its installed base spans multiple decades of industrial infrastructure, making long-term spare parts availability a critical operational requirement for asset-intensive industries.

The IC698RMX016-ED (also referenced as VMIVME-5567-100) is a VME-to-VME Reflective Memory interface module within the RX7i rack. It enables high-speed, low-latency shared memory communication between multiple VME-based controller nodes — a topology common in redundant control architectures at nuclear and refinery installations.

The Evolution of PACSystems RX7i Architecture

GE Fanuc introduced the PACSystems platform in the early 2000s as a unified control architecture to consolidate its legacy Series 90-70 (S90-70) and Series 90-30 (S90-30) PLC product lines. The RX7i was positioned as the high-end rack controller, inheriting VME bus topology from the Series 90-70 while introducing a new firmware kernel (PACSystems runtime) and a unified programming environment (Machine Edition / Proficy Machine Edition).

Key architectural transitions:

• Series 90-70 → PACSystems RX7i: Direct VME backplane compatibility allowed many IC697-series I/O modules to be reused in RX7i racks, reducing migration costs. However, CPU modules are not interchangeable.
• RX7i → RX3i transition: GE introduced the PACSystems RX3i (IC695 series) as a mid-range platform using a proprietary Universal Backplane (UB) that supports both PCI and serial I/O modules. RX3i does not share physical module compatibility with RX7i.
• Lifecycle status: The RX7i platform has entered a mature/end-of-active-development phase. GE (subsequently Emerson after the 2018 acquisition of GE's automation division) continues to provide maintenance releases and spare parts support, but new feature development is concentrated on the RX3i and CPE400/CPL410 platforms. Operators of RX7i systems should maintain adequate spare module inventory and establish long-term maintenance contracts.

PACSystems RX7i Full Catalog & Functionalities (SKU List)

CPU & Controller Modules

• IC698CPE010: RX7i CPU, 1.0 GHz Intel Celeron, 64 MB user memory, dual Ethernet
• IC698CPE020: RX7i CPU, 1.0 GHz, 32 MB user memory, single Ethernet port
• IC698CPE030: RX7i CPU, enhanced floating-point, 64 MB, dual Ethernet, motion ready
• IC698CPE040: RX7i CPU, 1.4 GHz, 128 MB user memory, redundancy-capable
• IC698CRE020: RX7i redundancy CPU module, hot-standby configuration support

VME Interface & Reflective Memory Modules

• IC698RMX016-ED (VMIVME-5567-100): VME Reflective Memory node interface, 16 MB shared memory, fiber-optic ring topology, deterministic inter-node latency <1 µs
• IC698RMX016: Standard VME Reflective Memory module, 16 MB, copper/fiber options
• IC698VME001: VME expansion interface module for multi-rack configurations

Discrete Input Modules

• IC698MDL650: 32-channel 24 VDC discrete input module, sink/source configurable
• IC698MDL660: 16-channel 120 VAC discrete input, isolated, DIN rail compatible
• IC698MDL730: 32-channel 24 VDC discrete input, high-speed, 0.1 ms filter

Discrete Output Modules

• IC698MDL740: 32-channel 24 VDC discrete output, 0.5 A per point, short-circuit protected
• IC698MDL841: 16-channel relay output, Form C contacts, 2 A per point, 240 VAC rated

Analog I/O Modules

• IC698ALG230: 16-channel analog input, 4–20 mA / 0–10 V, 16-bit resolution
• IC698ALG233: 8-channel analog input, thermocouple/RTD universal, 16-bit
• IC698ALG728: 8-channel analog output, 4–20 mA, 16-bit, individually isolated

Communication & Network Modules

• IC698ETM001: Ethernet TCP/IP interface module, 10/100 Mbps, SRTP/Modbus TCP
• IC698PBM300: PROFIBUS DP master module, up to 125 slave nodes, 12 Mbps
• IC698CMX016: Serial communications module, RS-232/RS-485, multi-protocol

Power Supply Modules

• IC698PSA100: RX7i rack power supply, 100–240 VAC input, 90 W output
• IC698PSA350: High-capacity power supply, 350 W, redundant configuration support

Sourcing Hard-to-Find & Obsolete PACSystems RX7i Parts

As the RX7i platform matures, OEM channel availability for specific modules — particularly VME interface cards, reflective memory nodes, and legacy analog I/O — becomes increasingly constrained. DriveKNMS maintains a dedicated inventory of RX7i spare modules sourced through certified secondary market channels, including decommissioned plant equipment and authorized distributor overstock.

For the IC698RMX016-ED / VMIVME-5567-100 specifically, this module is no longer in active OEM production. DriveKNMS provides:

• Verified functional units with full test documentation
• Firmware version matching to customer's existing rack configuration
• Emergency same-day dispatch for critical plant shutdowns
• Long-term blanket order agreements for operators managing multi-site RX7i fleets

Customers requiring end-of-life support for IC698-series modules are encouraged to contact DriveKNMS with their full BOM (Bill of Materials) for a consolidated availability assessment.

Quality Control for the PACSystems RX7i Range

RX7i modules — particularly VME backplane interface cards and reflective memory nodes — require specialized test procedures that replicate the VME64 bus environment. Generic bench testing is insufficient to validate inter-module communication integrity.

DriveKNMS quality control procedures for RX7i modules include:

• VME backplane simulation: Each module is seated in a live RX7i test rack running PACSystems firmware to validate slot recognition and bus arbitration.
• Reflective Memory ring test (IC698RMX016-ED specific): The module is inserted into a two-node fiber-optic reflective memory ring. Shared memory read/write latency is measured and compared against GE specification (<1 µs node-to-node). Fiber transceiver power levels are verified.
• I/O channel-level verification: All analog and discrete I/O channels are individually stimulated and measured against datasheet accuracy specifications.
• Thermal soak: Modules are operated at rated ambient temperature (0–60°C range) for a minimum of 4 hours prior to final inspection.
• Firmware integrity check: CPU and communication modules are verified for correct firmware revision and configuration memory integrity.