Allen-Bradley 1769 CompactLogix Modules: 1769-OB16 Output Module,

Technical Dossier

Product Details And Specifications

Allen-Bradley 1769 CompactLogix Series Technical Notes

The Allen-Bradley 1769 CompactLogix series is a modular programmable logic controller (PLC) platform developed by Rockwell Automation. It is deployed across global heavy industry sectors including petrochemical refining, nuclear auxiliary systems, offshore oil & gas platforms, pulp and paper mills, and automotive assembly lines. The 1769 bus architecture supports right-side expansion up to 8 or 16 modules depending on the controller variant, with each module communicating over a high-speed serial backplane. The platform's compact form factor, combined with EtherNet/IP and DeviceNet connectivity, has made it a standard-specification controller in facilities requiring deterministic scan times and IEC 61131-3 compliant ladder/function block programming.

The 1769-OB16 is a 16-point, 24VDC sourcing (PNP) digital output module within this series. It provides 0.5A per point (8A module maximum), with a backplane current draw of 120mA at 5VDC. It is compatible with all 1769 CompactLogix controllers and is widely used for driving solenoid valves, relay coils, and indicator lamps in process control panels.

The Evolution of 1769 CompactLogix Architecture

The 1769 platform was introduced in the early 2000s as a mid-range successor to the SLC 500 and MicroLogix families, targeting applications requiring more I/O density and network flexibility than MicroLogix but not the full rack infrastructure of the ControlLogix 1756 platform. Early 1769 controllers (1769-L20, 1769-L30) used serial and DeviceNet as primary communication paths. Subsequent generations introduced EtherNet/IP natively (1769-L32E, 1769-L35E), enabling integration into modern SCADA and DCS architectures without gateway hardware.

1769 CompactLogix Full Catalog & Functionalities (SKU List)

Digital Output Modules

• 1769-OB16: 16-point 24VDC sourcing digital output, 0.5A/point, PNP
• 1769-OB32: 32-point 24VDC sourcing digital output, 0.5A/point, high-density
• 1769-OB16P: 16-point 24VDC sourcing output with individually protected outputs
• 1769-OA8: 8-point 120/240VAC triac output module, 0.5A/point
• 1769-OA16: 16-point 120VAC triac output, 0.5A/point, relay-compatible
• 1769-OW8: 8-point relay output, Form A contacts, 2A/point, 240VAC/30VDC
• 1769-OW8I: 8-point isolated relay output, Form A, individually isolated contacts

Digital Input Modules

• 1769-IQ16: 16-point 24VDC sinking/sourcing digital input, IEC Type 1/3
• 1769-IQ32: 32-point 24VDC sinking/sourcing digital input, high-density
• 1769-IA8I: 8-point 120VAC isolated digital input, individually isolated
• 1769-IA16: 16-point 120VAC digital input, group isolated
• 1769-IQ16F: 16-point 24VDC fast digital input, 0.1ms filter, for high-speed counting

Analog I/O Modules

• 1769-IF4: 4-channel analog input, 4–20mA / 0–10V, 13-bit resolution
• 1769-IF8: 8-channel analog input, 4–20mA / ±10V, 16-bit resolution
• 1769-OF4: 4-channel analog output, 4–20mA / 0–10V, 13-bit resolution
• 1769-OF8C: 8-channel current analog output, 4–20mA, 16-bit resolution
• 1769-IF4XOF2: Combination 4-in / 2-out analog module, 4–20mA / 0–10V

Specialty & Communication Modules

• 1769-SDN: DeviceNet scanner module for 1769 bus, supports 64 nodes
• 1769-ASCII: ASCII serial interface module, RS-232/RS-485, for barcode/RFID integration
• 1769-HSC: High-speed counter module, 4 channels, up to 1MHz input frequency

Quality Control for the 1769 CompactLogix Range

Each 1769 series module processed by DriveKNMS undergoes a structured verification protocol designed around the specific electrical and communication characteristics of the 1769 backplane bus. For digital output modules including the 1769-OB16, testing includes point-by-point output activation under rated load (24VDC, 0.5A), inrush current tolerance verification, and thermal cycling to confirm output driver integrity. Backplane connector pins are inspected under magnification for oxidation, mechanical deformation, and solder joint integrity.