Allen-Bradley 1769-OW16 CompactLogix 1769 Relay Output Module

Model: 1769-OW16

Series CompactLogix
Model 1769-OW16
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Technical Dossier

Product Details And Specifications

Allen-Bradley 1769 Series Technical Notes

The Allen-Bradley 1769 CompactLogix series is one of the most widely deployed modular PLC platforms in global heavy industry. Installed across petrochemical refineries, nuclear auxiliary systems, offshore platforms, pulp and paper mills, and automotive body-in-white lines, the 1769 backplane architecture provides a compact, scalable I/O expansion framework that integrates directly with CompactLogix L1x through L3x controllers. The 1769-OW16 is a 16-point relay contact output module within this series, rated for 240V AC / 30V DC switching at up to 2A per point, making it a standard selection for discrete load control in safety-relevant and high-cycle applications.

The Evolution of 1769 Architecture

The 1769 series was introduced by Rockwell Automation as the I/O expansion platform for the CompactLogix family, succeeding the fixed-I/O SLC 500 architecture and the bulkier 1746 SLC I/O chassis. Early deployments (circa 2000–2005) centered on the 1769-L20 and 1769-L30 controllers paired with analog and discrete I/O modules via the 1769 compact I/O bus. The bus architecture supports up to 30 modules per local bank (controller-dependent) and uses a proprietary high-speed serial backplane that operates independently of the EtherNet/IP network layer.

1769 Full Catalog & Functionalities (SKU List)

Relay & Discrete Output Modules

  • 1769-OW16: 16-point relay contact output, 240V AC / 30V DC, 2A/point, isolated commons
  • 1769-OW8: 8-point relay contact output, 240V AC / 30V DC, 2A/point, general-purpose discrete
  • 1769-OA8: 8-point 120V AC triac output, 0.5A/point, solid-state AC switching
  • 1769-OB16: 16-point 24V DC sourcing output, 0.5A/point, standard discrete control
  • 1769-OB32: 32-point 24V DC sourcing output, high-density discrete output expansion
  • 1769-OB8: 8-point 24V DC sourcing output, 2A/point, high-current discrete loads

Discrete Input Modules

  • 1769-IQ16: 16-point 24V DC sinking/sourcing input, standard field device interface
  • 1769-IQ32: 32-point 24V DC sinking/sourcing input, high-density discrete input
  • 1769-IA8I: 8-point 120V AC isolated input, individually isolated commons (EOL)
  • 1769-IQ6XOW4: 6-point DC input / 4-point relay output combo module, space-saving mixed I/O

Analog I/O Modules

  • 1769-IF4: 4-channel analog input, 4–20mA / 0–10V, 13-bit resolution
  • 1769-IF8: 8-channel analog input, voltage/current selectable per channel
  • 1769-OF4: 4-channel analog output, 4–20mA / 0–10V, 13-bit resolution
  • 1769-IF4XOF2: 4-channel analog input / 2-channel analog output combo module

Communication & Specialty Modules

  • 1769-SDN: DeviceNet scanner adapter, connects 1769 I/O bank to DeviceNet network (EOL)
  • 1769-ASCII: 2-port ASCII/DF1 serial communication module, RS-232/RS-485
  • 1769-HSC: High-speed counter module, 4 channels, up to 1MHz input frequency
  • 1769-SM2: 2-axis stepper/servo motion module for compact motion applications

Quality Control for the 1769 Range

The 1769 backplane uses a proprietary high-speed serial bus that requires functional validation beyond simple power-on testing. DriveKNMS applies a structured test protocol for all 1769 modules:

  • Backplane communication test: Each module is seated in a live 1769 test rack with an active CompactLogix controller. Module identity, revision, and I/O data table mapping are verified via RSLogix 5000 / Studio 5000.
  • Point-level output verification (1769-OW16): All 16 relay contacts are individually energized and de-energized under resistive load. Contact resistance is measured at <100mΩ per point. Coil drive current is confirmed within specification.
  • Analog calibration (IF/OF modules): Analog modules are calibrated against a traceable reference standard. Zero and span accuracy are verified across the full input/output range.
  • Thermal cycling: Modules flagged as refurbished undergo 4-hour thermal soak at 55°C to screen for latent solder joint failures.
  • Firmware revision logging: Module series/revision is recorded and disclosed on the packing documentation to ensure compatibility with the customer's existing controller firmware.

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