Allen-Bradley 1769 CompactLogix Modules – 1769-OW8I

Model: 2097-V33PR1

Series CompactLogix
Model 2097-V33PR1
RFQ-ready model route Obsolete and surplus sourcing Export follow-up by model list

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Technical Dossier

Product Details And Specifications

Allen-Bradley 1769 CompactLogix Series Technical Notes

The Allen-Bradley 1769 CompactLogix series is a modular I/O platform developed by Rockwell Automation, designed for integration with CompactLogix L-series controllers. It is deployed across global heavy industry sectors including petrochemical plants, nuclear power facilities, oil refineries, water treatment infrastructure, and discrete manufacturing lines. The 1769 bus architecture supports both local and distributed I/O expansion, with modules connecting directly to the controller backplane via a high-speed serial bus. The platform's compact form factor and DIN-rail mounting make it a standard choice for panel-space-constrained installations. As of 2026, the 1769 series is in a mature/end-of-active-development lifecycle phase; Rockwell Automation has transitioned new designs toward the 5069 Compact I/O platform. However, the installed base of 1769 hardware in long-lifecycle industries (refining, power generation, chemical processing) remains extensive, making spare parts availability and lifecycle extension support a critical operational requirement.

The Evolution of 1769 Architecture

The 1769 I/O platform was introduced alongside the CompactLogix L20, L30, and L35 controller families in the early 2000s as a replacement for the SLC 500 fixed I/O architecture. Early 1769 deployments used the 1769-L20 and 1769-L30 processors with limited local I/O banks (up to 8 modules per bank, 2 banks maximum). The introduction of the 1769-L32E and 1769-L35E added EtherNet/IP connectivity, enabling integration into plant-wide DCS and SCADA architectures without dedicated communication bridges.

Mid-generation revisions introduced the 1769-L23, 1769-L24, and 1769-L27 compact controllers with embedded I/O and communication ports, reducing panel footprint for smaller machine-level applications. The 1769-L3x series (L30ER, L33ER, L36ERM) added motion coordination via Integrated Motion on EtherNet/IP, supporting CIP Motion drives without a dedicated motion controller.

Compatibility constraints are a known integration challenge: 1769 I/O modules are not electrically or mechanically compatible with 1734 POINT I/O, 1756 ControlLogix I/O, or 5069 Compact I/O. Firmware version alignment between the 1769 controller and Studio 5000 Logix Designer is required; mismatched firmware revisions result in module inhibit faults. End-users maintaining legacy 1769 installations must source replacement modules from the original series — cross-series substitution is not supported without hardware redesign.

1769 Full Catalog & Functionalities (SKU List)

Relay & Discrete Output Modules

  • 1769-OW8I: 8-point isolated relay output module, 10–265V AC/DC, Form C contacts, 2A per point — the subject of this listing.
  • 1769-OW16: 16-point relay output module, non-isolated, 10–265V AC/DC, 2A per point.
  • 1769-OB16: 16-point 24V DC sourcing output module, 0.5A per point, solid-state.
  • 1769-OB32: 32-point 24V DC sourcing output module, 0.5A per point, high-density.
  • 1769-OA8: 8-point 120V AC output module, triac solid-state, 0.5A per point.
  • 1769-OA16: 16-point 120/240V AC output module, triac solid-state, 0.5A per point.

Discrete Input Modules

  • 1769-IQ16: 16-point 24V DC sinking/sourcing input module, standard density.
  • 1769-IQ32: 32-point 24V DC sinking/sourcing input module, high-density.
  • 1769-IA8I: 8-point isolated 120V AC input module, individually isolated inputs.
  • 1769-IA16: 16-point 120V AC input module, non-isolated, standard density.
  • 1769-IQ16F: 16-point 24V DC fast input module, supports high-speed counter and latch functions.

Analog I/O Modules

  • 1769-IF4: 4-channel analog input module, 4–20mA / 0–10V, 12-bit resolution.
  • 1769-IF8: 8-channel analog input module, 4–20mA / 0–10V / ±10V, 13-bit resolution.
  • 1769-OF4: 4-channel analog output module, 4–20mA / 0–10V, 12-bit resolution.
  • 1769-IF4XOF2: Combination 4-input / 2-output analog module, 12-bit, reduces slot count.

Specialty & Communication Modules

  • 1769-ASCII: 2-channel ASCII serial communication module, RS-232/RS-485, for barcode/RFID integration.
  • 1769-SDN: DeviceNet scanner module, master node for DeviceNet field device networks.
  • 1769-SM2: 2-axis stepper/servo motion module for open-loop motion control.
  • 1769-PB4: 24V DC power supply module, 4A output, for extended I/O banks.

Sourcing Hard-to-Find & Obsolete 1769 Parts

The 1769 series entered Rockwell Automation's End of Life notification process progressively from 2018 onward, with several high-density and specialty modules reaching discontinued status. For facilities operating CompactLogix L20, L30, L35, and early L3x controllers, OEM replacement modules are no longer available through standard distribution channels.

Quality Control for the 1769 Range

The 1769 platform uses a proprietary serial backplane bus for inter-module communication. Fault isolation in this architecture requires module-level functional testing rather than visual inspection alone. DriveKNMS applies the following test protocol to all 1769 modules prior to shipment:

  • Backplane communication verification: Each module is seated in a live 1769 test rack and polled by a CompactLogix controller running a standardized diagnostic routine. Module identity, revision data, and configuration response are logged.
  • Point-level I/O functional test: For discrete modules (including 1769-OW8I), each output point is energized individually and contact closure/opening is verified against a calibrated load. For relay modules, contact resistance is measured at rated current.
  • Analog accuracy test: Analog modules are tested across the full input/output range (0–20mA, 0–10V) using a calibrated signal source and measurement instrument. Linearity error and offset are recorded.
  • Thermal cycling: Modules flagged as refurbished undergo a 4-hour thermal soak at 55°C to screen for latent component failures.
  • Firmware revision documentation: Controller-dependent modules are documented with firmware version to ensure compatibility with the customer's Studio 5000 project revision.

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