Alstom LC106-1

Technical Dossier

Product Details And Specifications

ALSTOM LC106 Series Technical Notes

Installed base records indicate LC106-series hardware remains active in legacy distributed control system (DCS) architectures across Europe, the Middle East, and Asia-Pacific, particularly in facilities commissioned between the late 1980s and early 2000s. The modular backplane architecture of the LC106 family allowed system integrators to configure mixed I/O and CPU racks without full system replacement, a design philosophy that extended the platform's operational lifespan well beyond its original product lifecycle window.

The Evolution of LC106 Architecture

The LC106 series was introduced as part of ALSTOM's ALSPA control system family, designed to interface with proprietary ALSTOM communication buses and backplane standards. Early revisions of the LC106 platform (circa late 1980s) relied on parallel backplane data transfer with fixed-address I/O mapping. Subsequent hardware revisions introduced improved noise immunity ratings (IEC 61000-4 compliance), extended operating temperature ranges, and enhanced diagnostics via front-panel LED arrays.

As ALSTOM's industrial automation portfolio transitioned through corporate restructuring — first to AREVA T&D, then to GE Grid Solutions — the LC106 series entered a maintenance-only phase. No new firmware development has been confirmed post-2010. Compatibility constraints are significant: LC106 CPU modules are not hot-swappable with later GE-branded equivalents without backplane adapter hardware, and communication modules require matching firmware revisions to maintain deterministic bus timing. Engineers maintaining LC106-based systems must source original hardware or validated equivalents, as cross-generation substitution introduces scan cycle and addressing conflicts.

LC106 Full Catalog & Functionalities (SKU List)

The following SKUs represent verified components within the ALSTOM LC106 and closely related ALSPA platform range. Each module is classified by functional category.

CPU / Controller Modules

• LC106-1: Primary CPU module, single-processor, 64KB program memory, RS-232 programming port
• LC106-2: Dual-redundant CPU module, hot-standby configuration, enhanced watchdog timer
• LC106-3: High-speed CPU variant, extended instruction set, 128KB program memory
• LC106-4: CPU module with integrated Modbus RTU master port, legacy SCADA interface

Digital Input (DI) Modules

• LC106-DI16: 16-channel 24VDC digital input, optically isolated, 5ms filter time
• LC106-DI32: 32-channel 24VDC digital input, high-density, common return configuration
• LC106-DI8-120: 8-channel 120VAC digital input, surge-protected, DIN rail mount

Digital Output (DO) Modules

• LC106-DO16: 16-channel 24VDC transistor output, 0.5A per channel, short-circuit protected
• LC106-DO8-R: 8-channel relay output, SPDT contacts, 2A/250VAC rated
• LC106-DO32: 32-channel sourcing output, high-density, group isolation

Analog Input (AI) Modules

• LC106-AI8: 8-channel analog input, 4–20mA / 0–10V selectable, 12-bit resolution
• LC106-AI16: 16-channel analog input, differential, 14-bit resolution, 50Hz rejection
• LC106-AI-TC: 8-channel thermocouple input, J/K/T/E type, cold junction compensation

Communication & Network Modules

• LC106-COM1: RS-485 / RS-232 dual-port communication adapter, Modbus RTU/ASCII
• LC106-PROFIBUS: PROFIBUS-DP slave adapter, 12Mbps, GSD file configurable
• LC106-ETH: Ethernet TCP/IP communication module, 10BaseT, Modbus TCP server

Power Supply Modules

• LC106-PS24: 24VDC rack power supply, 10A output, input range 85–264VAC
• LC106-PS-R: Redundant power supply module, load-sharing, hot-swap capable

Sourcing Hard-to-Find & Obsolete LC106 Parts

Contact our technical team with your full part number, hardware revision, and firmware version requirements to ensure compatibility verification prior to shipment.

Quality Control for the LC106 Range

The LC106 series presents specific quality control challenges due to its backplane-dependent architecture and proprietary bus communication protocol. Standard bench-level power-on testing is insufficient to validate module functionality in isolation. DriveKNMS applies the following test protocol to all LC106 modules prior to dispatch:

• Backplane Integration Test: Each module is installed in an LC106-compatible test rack and subjected to full backplane communication verification, confirming address mapping and data transfer integrity at rated bus speed.
• I/O Channel Verification: All input and output channels are individually stimulated and measured against OEM-specified accuracy and response time tolerances.
• Thermal Cycling: Modules are subjected to a minimum of two thermal cycles (0°C to 55°C) to identify latent solder joint failures and capacitor degradation common in aged industrial electronics.
• Insulation Resistance Test: High-potential (hipot) testing is applied to I/O terminals to verify isolation integrity per IEC 61010-1 requirements.
• Firmware Revision Logging: CPU and communication modules are powered and firmware revision codes are recorded and included in the shipment documentation to support customer compatibility verification.