BACHMANN ISI222 Positioning Modules
BACHMANN ISI222 Series: Comprehensive Module Range and Technical Overview The BACHMANN ISI222 is a high-resolution positioning module designed for integration…
Model: LGL.010.044.020.208
Product Overview
Commercial availability is handled through direct RFQ, model verification and export-oriented follow-up rather than public cart checkout.
Datasheet Preview
Use attached product manuals when available. If the manual is not public yet, request the full file directly through RFQ.
Commercial Path
Product pages on DRIVEKNMS are designed to verify model, brand and series first, then move the buyer into one clean quotation path.
Technical Dossier
The Bachmann LGL (Load Group Logic) series represents a core component family within the Bachmann MPC and MPCX distributed control system (DCS) platform. Deployed extensively across global heavy industry — including petrochemical refineries, offshore oil & gas platforms, nuclear power auxiliary systems, and continuous-process chemical plants — the LGL series provides deterministic I/O processing and inter-module communication within Bachmann's rack-based controller architecture. Its modular backplane design allows field engineers to configure mixed analog/digital I/O assemblies without hardware redesign, a critical requirement in facilities where process uptime is measured in years, not quarters. The LGL series is certified for use in safety-instrumented environments and has accumulated a substantial installed base across European and Asian industrial facilities since its introduction in the late 1990s.
The Bachmann LGL series was introduced as part of the MPC (Modular Process Controller) platform, which Bachmann Electronic GmbH developed to address the demand for high-availability, rack-based control in process industries. Early LGL modules operated on a proprietary parallel backplane bus with fixed slot addressing, limiting hot-swap capability. Subsequent hardware revisions introduced active backplane management, enabling live module replacement without process interruption — a feature that became standard in the MPCX generation.
The transition from MPC to MPCX brought a 32-bit internal data bus, expanded channel density per module slot, and support for PROFIBUS-DP and CANopen field bus integration directly at the I/O module level. LGL modules in the MPCX generation also introduced onboard diagnostics registers accessible via the Bachmann SolutionCenter engineering tool, allowing predictive maintenance workflows. As of 2024, the LGL series is in a mature/end-of-active-production phase; Bachmann continues to supply spare modules through authorized channels, but new project designs are directed toward the Bachmann M1 series platform. For facilities with existing LGL installations, long-term maintenance support remains the primary procurement driver.
The following SKUs represent verified, commonly sourced modules within the Bachmann LGL series. Modules are classified by functional category.
Controller & CPU Modules
Digital Input (DI) Modules
Digital Output (DO) Modules
Analog Input (AI) Modules
Analog Output (AO) Modules
Communication & Network Adapter Modules
Power Supply Modules
As the Bachmann LGL series has entered its mature/end-of-production lifecycle, procurement of replacement modules through standard distribution channels has become increasingly constrained. DriveKNMS maintains a dedicated inventory of tested LGL series modules sourced from decommissioned plant assets, authorized surplus channels, and direct factory overstock. For facilities operating legacy MPC or MPCX racks, DriveKNMS provides the following lifecycle extension services: verified stock of discontinued LGL SKUs, cross-reference matching for superseded part numbers, and lead-time commitment for emergency shutdown (ESD) and turnaround (TAR) procurement windows. Inquiries for specific LGL module variants — including non-standard channel counts or regional firmware revisions — are handled directly by our technical sourcing team. Response time for stock confirmation is typically within one business day.
Bachmann LGL modules incorporate a multi-layer backplane bus architecture with active signal conditioning on each I/O channel. DriveKNMS applies a structured test protocol to all LGL modules prior to shipment. Each module undergoes: (1) visual inspection of backplane connector pins, conformal coating integrity, and capacitor condition; (2) powered functional test using a Bachmann MPC/MPCX test rack with SolutionCenter diagnostic software to verify channel-by-channel I/O response, internal register read/write, and bus communication handshake; (3) thermal soak at 55°C for 2 hours to screen latent component failures; (4) final calibration verification for analog modules against NIST-traceable reference standards. Modules that do not pass all test stages are quarantined and not offered for sale. Test records are retained and available upon request for quality-critical procurement.