GE DS200TBQDG1AFF Extension Terminal Board – Mark VI DS200 Series Modules

Name: GE DS200TBQDG1AFF Extension Terminal Board – Mark VI DS200 Series Modules
Brand: General Electric

Model: DS200TBQDG1AFF

Brand General Electric

Series Mark VI

Model DS200TBQDG1AFF

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Product Overview

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Technical Dossier

Product Details And Specifications

GE DS200 Series Technical Notes

The Evolution of DS200 Architecture

The DS200 series was introduced alongside the Mark VI platform in the mid-1990s as a replacement for the earlier Mark V (DS3800 / DS5000 series) hardware. The architecture is built around a high-density backplane bus (JA1/JB1/JC1 connectors) that carries both power and serial communication signals between terminal boards and the VCMI/VCRC controller cards seated in the VME rack.

DS200 Full Catalog & Functionalities (SKU List)

The following SKUs represent verified, commonly stocked DS200 series components. Each entry reflects a distinct functional role within the Mark VI control architecture.

Terminal & Extension Boards

DS200TBQDG1AFF: Extension terminal board for quad I/O expansion, JA1 backplane interface
DS200TBCAG1AAA: Contact input terminal board, 24 VDC discrete input conditioning
DS200TBCBG1AAA: Contact input terminal board, high-density 48-channel discrete input
DS200TBASG1A: Analog signal terminal board, 4–20 mA / 0–10 V input conditioning
DS200TBRAG1AAA: RTD input terminal board, 3-wire PT100 signal conditioning
DS200TBPAG1A: Pulse/speed input terminal board, magnetic pickup and proximity probe interface
DS200TBQCG1A: Quad contact output terminal board, relay-driven discrete outputs

I/O Modules

DS200IOCAG1A: I/O controller adapter, primary rack communication bridge
DS200SDCIG1A: DC power input module, 125 VDC bus interface
DS200SDCCG1A: DC power conditioning card, redundant supply arbitration
DS200DSPCH1A: Digital signal processor card, high-speed event capture
DS200ADGIH1A: Analog-to-digital conversion module, 16-bit resolution
DS200DTBCG1AAA: Discrete terminal board with current limiting, 24 VDC output

Communication & CPU Modules

DS200VCMIG2A: VME communication interface card, primary Mark VI network node
DS200VCRCG1A: VME controller card, real-time turbine control execution
DS200EXPSG1ADA: Expansion power supply module, auxiliary rack power distribution
DS200PCCAG1A: Process control communication adapter, Ethernet/serial gateway

Quality Control for the DS200 Range

DS200 series boards present specific test challenges due to their backplane-dependent architecture: most boards cannot be functionally verified in isolation without a live Mark VI rack environment or a dedicated test fixture that replicates the JA1/JB1/JC1 bus signals. DriveKNMS employs the following test protocol for DS200 inventory:

Visual inspection: component-level examination for corrosion, cracked solder joints, damaged connectors, and capacitor degradation
Powered bench test: boards are seated in a test rack with active Mark VI backplane simulation to verify bus communication handshake and register-level response
Signal-path verification: for terminal boards, each I/O channel is exercised with calibrated signal sources to confirm within-specification response
Firmware revision check: EEPROM firmware version is recorded and compared against OEM revision history to flag boards requiring update before deployment
Burn-in: boards are operated under load for a minimum of 24 hours to screen for early-life failures prior to shipment

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