Products / General Electric / GE HE670 Series
General Electric GE HE670 Series

GE HE670 Series Modules

Model: HE670ADC840

Brand General Electric
Series GE HE670 Series
Model HE670ADC840
RFQ-ready model route Obsolete and surplus sourcing Export follow-up by model list

Product Overview

Commercial availability is handled through direct RFQ, model verification and export-oriented follow-up rather than public cart checkout.

Datasheet Preview

Datasheet Preview

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Commercial Path

Use This Page To Confirm The Model, Then Move To RFQ

Product pages on DRIVEKNMS are designed to verify model, brand and series first, then move the buyer into one clean quotation path.

Technical Dossier

Product Details And Specifications

GE HE670 Series: Comprehensive Module Range and Technical Overview

The GE HE670 series, developed under the Horner Electric / GE Automation platform, represents a mature and widely deployed programmable controller I/O architecture used across global heavy industry. Installations span petrochemical refineries, chemical processing plants, nuclear auxiliary systems, offshore platforms, and continuous-process manufacturing facilities. The HE670 backplane-based modular architecture allows high-density I/O expansion within a compact rack form factor, making it a standard reference design in legacy DCS and hybrid PLC environments where long-term parts availability is a critical operational requirement.

Due to the series' extended deployment lifecycle — spanning from the early 1990s through the 2010s — a significant installed base remains active in facilities that have deferred full system migration. DriveKNMS maintains a dedicated inventory and sourcing channel for HE670 components to support these sites.

The Evolution of HE670 Architecture

The HE670 platform was introduced as part of Horner Electric's modular PLC expansion strategy, designed to interface with the OCS (Operator Control Station) and standalone rack controllers. The architecture is built around a passive backplane bus that supports hot-swap-capable I/O modules in select configurations. Early revisions used parallel backplane addressing; later firmware revisions introduced enhanced diagnostics and module identification registers compatible with HE-series programming software (Cscape).

Compatibility considerations are significant for maintenance engineers: HE670 modules are rack-slot addressed and require matching backplane revisions. Mixing early-generation analog modules with later digital expansion racks requires verification of bus voltage tolerance (typically 5 VDC logic rail). The series reached end-of-active-production status, with Horner Electric transitioning customers toward the XL and RCC controller families. However, no direct plug-compatible replacement exists for most HE670 I/O modules, making original-part sourcing the primary maintenance strategy for existing installations.

HE670 Full Catalog & Functionalities (SKU List)

The following verified SKUs represent the core HE670 module range, organized by functional category. Each entry reflects a distinct hardware configuration with unique I/O count, signal type, or communication role.

Analog Input Modules (AI)

  • HE670ADC840: 8-channel analog input, 4–20 mA / 0–10 V selectable, 12-bit resolution
  • HE670ADC800: 8-channel analog input, voltage/current configurable, standard rack mount
  • HE670ADC820: 8-channel analog input with enhanced filtering, process signal conditioning
  • HE670ADC400: 4-channel analog input module, high-impedance voltage input, isolated

Analog Output Modules (AO)

  • HE670DAC800: 8-channel analog output, 4–20 mA current loop, 12-bit DAC
  • HE670DAC400: 4-channel analog output, voltage/current dual-mode, loop-powered option
  • HE670DAC820: 8-channel analog output with diagnostics, open-loop fault detection

Digital Input Modules (DI)

  • HE670DIM840: 32-channel 24 VDC digital input, sink/source configurable, LED status per channel
  • HE670DIM800: 16-channel 24 VDC digital input, standard density, DIN rail compatible
  • HE670DIM110: 16-channel 120 VAC digital input, optically isolated, zero-cross detection
  • HE670DIM220: 16-channel 220 VAC digital input, high-voltage isolated input module

Digital Output Modules (DO)

  • HE670DOM840: 32-channel 24 VDC digital output, transistor sourcing, 0.5 A per channel
  • HE670DOM800: 16-channel 24 VDC digital output, sinking type, short-circuit protected
  • HE670DOM110: 8-channel relay output, 120/240 VAC, 2 A per channel, Form C contacts
  • HE670DOM220: 8-channel relay output, high-current 5 A rating, AC/DC load compatible

Communication & Specialty Modules

  • HE670RTD800: 8-channel RTD input, PT100/PT1000/Ni120 selectable, 3-wire compensation
  • HE670THM800: 8-channel thermocouple input, J/K/T/E/R/S/B type, cold-junction compensated
  • HE670CNX100: Backplane communication adapter, RS-485 / CAN bus interface for remote rack expansion

Sourcing Hard-to-Find & Obsolete HE670 Parts

The HE670 series is classified as end-of-life (EOL) by the original manufacturer. Standard distribution channels no longer carry active stock. DriveKNMS operates a dedicated obsolete and legacy parts sourcing program specifically structured for this scenario.

Sourcing capabilities include: verified surplus stock from decommissioned plant assets, cross-referencing against known-good tested units from controlled environments, and direct procurement from secondary market channels with documented chain of custody. All HE670 units sourced by DriveKNMS are subject to pre-shipment functional verification. For facilities operating under planned maintenance windows, DriveKNMS can provide advance reservation of identified stock against scheduled outage dates.

For long-term maintenance contracts requiring guaranteed HE670 availability over a multi-year horizon, contact the DriveKNMS procurement team to discuss consignment or buffer stock arrangements.

Quality Control for the HE670 Range

HE670 modules present specific test challenges due to their backplane-bus-dependent architecture. Standalone bench testing is insufficient for full functional verification; modules must be validated within a compatible rack and backplane assembly under live bus conditions.

DriveKNMS employs a dedicated HE670 test rack configured with a reference OCS controller and calibrated signal sources. The test protocol covers: backplane communication handshake verification, channel-by-channel I/O signal accuracy (analog modules tested against NIST-traceable reference instruments), relay contact resistance measurement (DO relay modules), isolation resistance testing between channels and chassis ground, and firmware revision identification. Analog modules are tested at 0%, 25%, 50%, 75%, and 100% of rated input/output range. Results are logged per unit and available upon request with shipment documentation.

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