GE IC600 Modules: IC600BF900L

Technical Dossier

Product Details And Specifications

GE Fanuc IC600 Series Technical Notes

The Evolution of IC600 Architecture

The IC600 platform was introduced by General Electric Automation in 1982 as the Series Six, succeeding the Series One and Series Three controllers. The original architecture centered on a parallel backplane bus operating at TTL logic levels, supporting up to 12 modules per rack. Early CPU modules (IC600CPU) used Intel 8086-family processors with battery-backed CMOS RAM for program retention. By the mid-1980s, GE introduced enhanced CPU variants with expanded memory addressing and floating-point coprocessor support for analog-intensive applications.

In 1986, GE Automation merged its PLC division with Fanuc Ltd. of Japan to form GE Fanuc Automation, rebranding the Series Six line under the IC600 part-numbering convention while maintaining full hardware backward compatibility. The IC600 backplane bus remained unchanged through this transition, allowing pre-merger modules to operate alongside post-merger I/O expansions without firmware modification.

Q: How are RFQ terms confirmed?
A: Quantity, required condition, documentation needs, destination and sourcing route are confirmed during RFQ review before quotation.

IC600 Full Catalog & Functionalities (SKU List)

CPU & Processor Modules

• IC600CPU900: Series Six CPU, 12K word program memory, RS-422 programmer port
• IC600CPU910: Enhanced CPU, 28K word memory, dual-port RAM for coprocessor interface
• IC600CPU915: High-capacity CPU, 56K word memory, floating-point math coprocessor
• IC600CPU940: Redundant CPU module, hot-standby switchover, dual backplane interface

PCB Boards & Backplane Assemblies

• IC600BF900L: PCB board assembly, backplane interface logic, 5-slot rack bus termination card
• IC600BF901: Backplane PCB, 10-slot rack configuration, passive bus distribution board
• IC600BF902: I/O expansion backplane board, remote rack interface, RS-422 link termination

Discrete Input Modules (DI)

• IC600BF810: 16-point 120 VAC discrete input, optically isolated, 10 ms filter
• IC600BF811: 32-point 24 VDC discrete input, sink/source configurable, 1 ms filter
• IC600BF812: 16-point 240 VAC discrete input, high-voltage isolation, CE-rated

Discrete Output Modules (DO)

• IC600BF820: 16-point 120 VAC triac output, 0.5 A per point, no external fusing required
• IC600BF821: 32-point 24 VDC transistor output, sourcing, 0.25 A per point
• IC600BF822: 8-point relay output, Form C contacts, 2 A per point, 250 VAC rated

Analog Input/Output Modules (AI/AO)

• IC600BF840: 8-channel analog input, 4–20 mA / 0–10 VDC selectable, 12-bit resolution
• IC600BF841: 4-channel analog output, 4–20 mA, 12-bit DAC, loop-powered field devices
• IC600BF842: 16-channel analog input, thermocouple/RTD types J/K/T/PT100, cold-junction compensated

Communications & Adapter Modules

• IC600CM901: Genius Bus Controller, single-channel, 153.6 kbps, up to 32 devices per bus
• IC600CM902: Ethernet TCP/IP adapter, 10BASE-T, SRTP protocol, Modbus TCP gateway
• IC600CM910: Serial communications module, RS-232/RS-422/RS-485 configurable, Modbus RTU master/slave

Power Supply Modules

• IC600PS900: 5 VDC rack power supply, 15 A output, 120/240 VAC input auto-ranging
• IC600PS901: Redundant power supply module, hot-swap capable, load-sharing with IC600PS900

Quality Control for the IC600 Range

IC600 modules present specific test challenges due to their parallel backplane bus architecture and age-related component degradation. DriveKNMS applies the following test protocol to all IC600 units prior to shipment:

• Visual inspection: PCB trace integrity, capacitor ESR check, connector pin condition assessment
• Powered bench test: Module inserted into a live IC600 test rack running a diagnostic ladder program; all I/O points exercised at rated voltage and current
• Backplane bus verification: Logic analyzer capture of backplane read/write cycles to confirm correct bus timing and address decoding
• Memory retention test (CPU modules): 72-hour battery-backed RAM retention test with power cycling at 24-hour intervals
• Thermal soak: 4-hour operation at 55°C ambient to screen latent thermal failures
• Final functional test: Full I/O point-by-point verification with pass/fail report issued per unit

Q: How is condition confirmed before quotation?
A: Available condition, photos, test records and documentation are checked according to the requested model and sourcing channel before a formal RFQ response.