GE IC670 Modules - IC670MDL240

Technical Dossier

Product Details And Specifications

GE IC670 Series Technical Notes

The GE Fanuc IC670 series — commercially designated as the Genius I/O system — represents one of the most widely deployed distributed I/O architectures in global heavy industry. Installed across petrochemical complexes, nuclear power stations, offshore platforms, and continuous-process refineries, the IC670 platform operates as the field-level I/O backbone for GE Series 90-70 and Series 90-30 PLC systems. Its token-passing Genius Bus (a single-twisted-pair serial network at 153.6 kbps) enables deterministic scan times and fault-tolerant redundancy configurations that remain operationally relevant decades after initial deployment. The installed base in critical infrastructure — where replacement of the control architecture is cost-prohibitive — sustains persistent global demand for IC670 spare parts, repair services, and lifecycle extension support.

The Evolution of IC670 Architecture

The IC670 Genius I/O system was introduced by GE Fanuc Automation in the late 1980s as a distributed I/O solution to reduce field wiring costs and improve diagnostics in large-scale process plants. The original architecture used a single Genius Bus Controller (GBC) to manage up to 32 I/O blocks per bus segment, with each block capable of independent fault reporting and hot-insertion in later hardware revisions.

Through the 1990s, GE Fanuc expanded the IC670 catalog to include analog I/O, high-speed counter modules, and bus interface units (BIUs) that bridged Genius Bus to Profibus-DP and DeviceNet. The Series 90-70 CPU (IC697 series) served as the primary host controller, with IC670 blocks deployed at field junction boxes up to 750 meters from the controller rack.

Following GE Fanuc's rebranding to GE Intelligent Platforms (circa 2011) and subsequent acquisition by Emerson (2018, rebranded as Emerson Automation Solutions), active development of the IC670 line ceased. The series entered its end-of-life phase, with GE officially discontinuing new production of most IC670 modules. Modern migration paths include the GE RX3i (IC695 series) with Genius Bus Controller modules that maintain backward compatibility with existing IC670 field blocks, allowing phased migration without full field rewiring. Despite this, the IC670 platform remains in active service at thousands of sites globally, making third-party spare parts sourcing and repair services a critical operational requirement.

IC670 Full Catalog & Functionalities (SKU List)

Discrete Input Modules

• IC670MDL240: 16-point 120VAC discrete input module, Genius Bus block, field-side isolated
• IC670MDL241: 16-point 240VAC discrete input module, high-voltage field wiring terminal
• IC670MDL640: 32-point 24VDC discrete input module, sink/source configurable, compact block
• IC670MDL641: 32-point 24VDC discrete input, extended temperature range (-40°C to +70°C)
• IC670MDL643: 16-point 125VDC discrete input module, nuclear-grade applications

Discrete Output Modules

• IC670MDL340: 16-point 120VAC discrete output, 0.5A per point, triac output type
• IC670MDL341: 16-point 240VAC discrete output, relay-isolated, 2A per point
• IC670MDL740: 32-point 24VDC discrete output, source type, 0.5A per point
• IC670MDL741: 32-point 24VDC discrete output, sink type, short-circuit protected
• IC670MDL742: 16-point relay output module, Form C contacts, 2A/point, 250VAC rated

Analog I/O Modules

• IC670ALG230: 4-channel analog input, 4–20mA / 0–10V selectable, 12-bit resolution
• IC670ALG231: 8-channel analog input, 4–20mA, 12-bit, single-ended configuration
• IC670ALG320: 2-channel analog output, 4–20mA, 12-bit, loop-powered field side
• IC670ALG321: 4-channel analog output, 0–10V / 4–20mA, 12-bit, isolated outputs

Power Supply & Bus Interface

• IC670PWR101: Genius Bus block power supply, 24VDC input, 5W output for block electronics
• IC670PWR102: 120/240VAC input power supply for IC670 bus blocks, DIN-rail mount
• IC670GBI001: Genius Bus Interface Unit (BIU), bridges Genius Bus to host backplane
• IC670GBI002: Dual-bus Genius BIU, supports redundant bus configurations

Quality Control for the IC670 Range

IC670 modules present specific test challenges due to their integrated Genius Bus communication ASIC, field-side isolation circuitry, and token-passing protocol stack. DriveKNMS applies a multi-stage verification process to all IC670 units:

• Bus Communication Test: Each module is connected to a live Genius Bus segment and verified for correct token acquisition, I/O data exchange, and fault reporting per GE Fanuc GFK-0098 specification.
• Field-Side Isolation Test: Hi-pot testing at 1500VAC between field terminals and logic-side electronics, per IEC 61131-2 requirements.
• Functional I/O Verification: All discrete points are individually exercised at rated voltage and current. Analog modules are calibrated against NIST-traceable references with ±0.1% accuracy.
• Thermal Burn-In: 48-hour powered soak at 55°C ambient to screen latent component failures before dispatch review.
• Firmware Version Audit: EPROM/firmware revision is documented and matched to customer's existing bus revision to prevent compatibility mismatches.