LAM Research 810 Series Modules: 810-234640-311 Power Supply Module —

Technical Dossier

Product Details And Specifications

LAM Research 810 Series: Comprehensive Module Range and Technical Overview

The LAM Research 810 Series represents a core hardware platform deployed across semiconductor fabrication equipment, including plasma etch and chemical vapor deposition (CVD) systems. These modules are embedded in capital equipment operating in environments with strict uptime requirements — including semiconductor fabs, flat panel display manufacturing lines, and advanced materials processing facilities. The 810 Series power supply and control modules are integral to LAM Research systems such as the Rainbow, Transformer Coupled Toroidal (TCP), and Versys platforms, which are installed in volume at Tier 1 fabs globally. Due to the long operational lifecycle of semiconductor capital equipment (often 10–20 years), the 810 Series remains in active demand for maintenance, repair, and overhaul (MRO) procurement well beyond its original production window.

The Evolution of 810 Series Architecture

The LAM Research 810 Series was developed as a modular subsystem architecture to support the increasing complexity of RF power delivery, DC bias control, and process gas management in plasma processing equipment. Early-generation 810 modules used discrete analog control circuits with limited diagnostic capability. Subsequent revisions introduced embedded microcontrollers, digital communication buses (RS-422, RS-485), and improved thermal management via conduction-cooled backplane designs. Later variants incorporated FPGA-based signal processing for real-time impedance matching feedback. Compatibility between hardware revisions is not guaranteed across all sub-series; field engineers must verify PCB revision levels and firmware versions before substitution. As LAM Research transitioned to next-generation platforms (Kiyo, Flex, Syndion), the 810 Series entered a mature/end-of-life phase. OEM new production has ceased for the majority of 810 Series part numbers. Installed base support now relies on refurbished, tested-used, and new-surplus inventory sourced through specialist distributors.

810 Series Full Catalog & Functionalities (SKU List)

The following part numbers represent verified, commonly traded SKUs within the LAM Research 810 Series. Each entry reflects a distinct functional module within the platform architecture.

Power Supply Modules

• 810-234640-311: DC power supply module; primary rail regulation for system logic and actuator loads.
• 810-234640-301: Earlier revision of the 311 power supply; functionally equivalent with PCB layout differences.
• 810-234640-321: Enhanced thermal variant; extended operating temperature range for high-duty-cycle applications.
• 810-017956-001: High-voltage power supply module; supports RF match network bias rail.
• 810-017956-002: Revised HV supply with improved ripple suppression and OVP circuit.
• 810-049228-001: Auxiliary power supply; provides isolated 24 VDC for I/O and sensor circuits.

RF & Process Control Modules

• 810-049228-002: RF power control interface module; analog setpoint input, 0–10 V command signal.
• 810-081119-001: RF generator interface board; manages forward/reflected power feedback loop.
• 810-081119-002: Updated RF interface with extended frequency range support (2 MHz / 13.56 MHz).
• 810-049229-001: Process controller module; coordinates gas flow, pressure, and RF interlock sequencing.
• 810-049229-002: Revised process controller with expanded recipe storage and faster scan rate.

I/O & Communication Modules

• 810-081120-001: Digital I/O module; 32-channel TTL-compatible input/output for endpoint detection and interlock signals.
• 810-081120-002: Isolated DI module; optocoupler-isolated inputs for high-noise environments.
• 810-049230-001: Analog input module; 16-channel, 12-bit ADC for pressure transducer and thermocouple inputs.
• 810-049230-002: Analog output module; 8-channel, 12-bit DAC for mass flow controller setpoint signals.
• 810-081121-001: Serial communication adapter; RS-422/RS-485 multi-drop bus interface for host system integration.
• 810-081121-002: Ethernet gateway module; bridges legacy 810 Series backplane bus to TCP/IP for remote diagnostics.

Sourcing Hard-to-Find & Obsolete 810 Series Parts

The majority of LAM Research 810 Series part numbers have been discontinued by the OEM. DriveKNMS maintains a dedicated inventory program for end-of-life semiconductor equipment modules, with specific coverage of the 810 Series. Sourcing channels include decommissioned fab equipment, controlled factory surplus, and tested-used modules recovered from system upgrades. All 810 Series inventory at DriveKNMS is cataloged by part number, PCB revision, and functional test status. For customers operating legacy LAM Research systems beyond OEM support windows, DriveKNMS provides long-term availability commitments, cross-reference matching for superseded part numbers, and consignment evaluation for customer-owned surplus. Procurement teams requiring bill-of-materials (BOM) fulfillment for scheduled maintenance shutdowns are encouraged to submit complete parts lists for consolidated quotation.

Quality Control for the 810 Series Range

The LAM Research 810 Series employs a multi-layer backplane bus architecture with mixed analog and digital signal routing. Standard incoming inspection procedures at DriveKNMS include visual inspection for component damage, corrosion, and PCB delamination; in-circuit testing (ICT) of passive and active components against reference schematics; functional power-on testing under controlled load conditions with calibrated bench power supplies; and communication bus verification using protocol analyzers for RS-422/RS-485 and digital I/O modules. Power supply modules including the 810-234640-311 are subjected to full-load burn-in testing at rated output current for a minimum of 4 hours, with output voltage, ripple, and thermal performance logged against OEM specifications. Modules that fail any test parameter are quarantined, documented, and either repaired to specification or scrapped. No module is shipped without a traceable test record.

© 2026 DriveKNMS. All trademarks belong to their respective owners. Specifications are for reference only and subject to change without notice. Verify all parameters against official documentation before installation.