GE F31X Series Modules – F31X139APMALG2FR00

Technical Dossier

Product Details And Specifications

GE F31X Series Technical Notes

Installed base for Mark VI and Mark VIe systems spans hundreds of facilities across North America, Europe, the Middle East, and Asia-Pacific. Many of these installations have operational lifespans exceeding 20 years, creating sustained demand for F31X replacement modules, spare parts inventory, and lifecycle extension support.

The Evolution of F31X Architecture

The F31X designation covers PC board assemblies engineered for GE's VMIVME and VME-based control backplane architectures. Early Mark VI implementations (introduced in the mid-1990s) relied on discrete I/O boards with fixed-function signal conditioning. As the platform matured into the Mark VIe generation (2000s onward), GE transitioned to an Ethernet-based I/O network (IONet) while retaining physical and functional compatibility with many F31X-series boards at the backplane level.

Key architectural transitions include: the shift from hardwired TMR (Triple Modular Redundancy) voting logic to software-configurable redundancy in Mark VIe; the introduction of PROFIBUS and Modbus gateway modules within the same F31X form factor; and the gradual migration from ISA-bus to PCI-based processor boards. Legacy F31X modules remain in active service in Mark VI installations that have not undergone full platform migration, making cross-generation compatibility a critical sourcing consideration. Replacement procurement must account for firmware revision levels, backplane slot assignments, and jumper/DIP switch configurations documented in GE's IS200, IS215, and DS200 technical reference manuals.

F31X Full Catalog & Functionalities (SKU List)

The following SKUs represent verified models within the GE F31X series, categorized by primary function. Each module is a field-replaceable unit (FRU) compatible with Mark VI or Mark VIe control enclosures.

Controller / CPU Modules

• F31X139APMALG2FR00: Mark VI processor board, application memory module, TMR-capable logic execution unit
• F31X139APMALG2: Base revision of the APMALG2 processor assembly, standard Mark VI CPU board
• F31X139APMALG1: Earlier revision processor board, compatible with first-generation Mark VI controller enclosures
• F31X134EPRBEG1: Ethernet processor board, Mark VIe IONet interface, primary controller communication module
• F31X134EPRBPG1: Revised Ethernet processor board with enhanced diagnostic firmware for Mark VIe platforms

Analog I/O Modules

• F31X131PRAANG1: Analog input module, 4–20 mA signal conditioning, 16-channel configuration for process variable acquisition
• F31X127EPSCAG1: Analog output module, precision signal conversion, used in valve positioner and actuator control loops
• F31X117PCCAPG1: Analog I/O combination board, mixed-signal processing for thermocouple and RTD inputs

Digital I/O Modules

• F31X114NBCAAG1: Digital input module, 24 VDC discrete signal acquisition, 32-channel, used for limit switch and proximity sensor interfacing
• F31X305NANANG1: Digital output module, relay-driven discrete outputs, 16-channel, for solenoid valve and alarm annunciator control
• F31X305NANARG1: Revised digital output module with enhanced contact rating for high-current relay applications

Power Supply Modules

• F31X300NAMANG1: DC power distribution board, backplane power bus interface, 28 VDC regulated output for I/O module rails
• F31X330NBNAAG1: Redundant power supply module, automatic failover, used in TMR and dual-redundant Mark VI enclosures

Communications & Network Modules

• F31X301DCCBBG1: Serial communications board, RS-232/RS-485 multi-protocol interface, Modbus RTU gateway function
• F31X301DCCANR1: Revised serial communications board with extended temperature tolerance for harsh environment enclosures
• F31X303MCCBRG1: PROFIBUS DP master module, field device integration for valve positioners and variable frequency drives

Sourcing Hard-to-Find & Obsolete F31X Parts

DriveKNMS maintains a dedicated inventory of tested F31X surplus and refurbished modules sourced from decommissioned control systems, OEM overstock, and authorized redistribution channels. Our procurement team actively tracks F31X availability across global secondary markets to fulfill emergency replacement orders, planned maintenance kits, and long-term spare parts agreements (LTSAs). We support single-unit emergency orders as well as bulk procurement for facilities maintaining multi-year spare parts buffers. All modules are shipped with full traceability documentation including part number, revision level, and test certification records.

Quality Control for the F31X Range

F31X modules present specific test challenges due to their VME backplane bus architecture, multi-layer PCB construction, and mixed analog/digital signal paths. DriveKNMS applies a structured test protocol to all F31X units prior to shipment:

• Visual inspection: Component-level examination for corrosion, solder joint integrity, capacitor condition, and connector pin alignment
• Backplane bus continuity test: Verification of VME bus signal integrity across all address, data, and control lines
• Functional power-on test: Module energization in a controlled rack environment with voltage rail monitoring at ±5 VDC, ±12 VDC, and 28 VDC supply points
• I/O channel verification: Signal injection and readback testing on all active analog and digital channels using calibrated test equipment
• Firmware revision check: Confirmation of installed firmware version against GE technical bulletins and customer-specified revision requirements
• Burn-in cycle: Extended operational test at elevated ambient temperature to screen for latent component failures prior to shipment