GE Fanuc VersaMax IC200CHS022 Modules

Technical Dossier

Product Details And Specifications

GE Fanuc VersaMax Series Technical Notes

The IC200CHS022 is a Compact I/O Carrier within this ecosystem, providing the mechanical and electrical backplane interface for VersaMax Compact I/O modules in space-constrained panel installations. It is a passive component — no firmware, no configuration — and serves as the physical mounting and bus interface between the host system and attached I/O modules.

The Evolution of VersaMax Architecture

The VersaMax platform was introduced by GE Fanuc Automation in the mid-1990s as a successor to the Series 90 Micro and a complement to the Series 90-30 rack-based systems. The architecture evolved through three distinct phases:

Phase 1 (1996–2002): Initial release of VersaMax Nano and Micro CPUs alongside first-generation I/O carriers. Serial communications (RS-232/RS-485) served as the primary programming interface. Genius Bus was the primary network for distributed I/O. The IC200 prefix was established as the standard module numbering convention.

Phase 2 (2002–2010): Introduction of Ethernet-capable NIUs (Network Interface Units) and expansion of the I/O module catalog. Profibus-DP and DeviceNet adapters were added. The Compact I/O sub-family — including the IC200CHS022 carrier — was introduced to address panel-mount and space-constrained installations. Compatibility with PACSystems RX3i CPUs via VersaMax NIUs was established, enabling hybrid architectures.

Phase 3 (2010–present): GE Intelligent Platforms (rebranded under Emerson following the 2018 acquisition) shifted primary development focus to the PACSystems RX3i and RSTi-EP platforms. VersaMax modules entered a mature/sustaining lifecycle phase. New hardware releases ceased; firmware updates became infrequent. The VersaMax NIU-to-PACSystems migration path remains a supported route for extending the operational life of existing I/O infrastructure without full system replacement. The IC200CHS022 carrier remains in service across this installed base.

VersaMax Full Catalog & Functionalities (SKU List)

The following catalog covers the primary IC200-series module families. All SKUs listed are confirmed VersaMax platform components. Modules are grouped by functional category.

Carriers & Backplanes

• IC200CHS022: Compact I/O Carrier, 2-slot, DIN-rail or panel mount, passive backplane bus interface for Compact I/O modules
• IC200CHS001: VersaMax I/O Carrier, 1-slot, standard module interface, panel mount, screw-terminal field wiring
• IC200CHS002: VersaMax I/O Carrier, 2-slot, standard module interface, panel mount, screw-terminal field wiring
• IC200CHS005: VersaMax I/O Carrier, 5-slot, standard module interface, panel mount, supports mixed I/O module types
• IC200CHS014: VersaMax I/O Carrier, 4-slot, integrated terminal block connections, reduced field wiring footprint
• IC200CHS025: Compact I/O Carrier, 5-slot, DIN-rail mount, extended capacity for Compact I/O module arrays

CPU & Controller Modules

• IC200CPUE05: VersaMax Micro CPU, 28 I/O points onboard, 16KB program memory, RS-232 programming port, standalone operation
• IC200CPUE01: VersaMax Micro CPU, 14 I/O points onboard, embedded 10/100 Mbps Ethernet, Modbus TCP support
• IC200CPU001: VersaMax CPU, standalone, 64KB user memory, serial programming port, Genius Bus master capability
• IC200CPU002: VersaMax CPU, standalone, 128KB user memory, dual serial ports, expanded I/O addressing

Digital Input (DI) Modules

• IC200MDL640: 8-point 24VDC positive logic digital input, 3ms input filter, single common group
• IC200MDL650: 16-point 24VDC positive logic digital input, 3ms input filter, two common groups
• IC200MDL660: 32-point 24VDC positive logic digital input, grouped commons, high-density panel wiring
• IC200MDL730: 8-point 120VAC digital input, isolated commons, surge protection, DIN-rail mount
• IC200MDL632: 8-point 24VDC negative logic digital input, 3ms filter, isolated commons

Digital Output (DO) Modules

• IC200MDL740: 8-point relay output, 2A per point, Form A contacts, 24–240VAC/VDC load range
• IC200MDL750: 16-point 24VDC positive logic transistor output, 0.5A per point, two common groups
• IC200MDL760: 32-point 24VDC positive logic transistor output, grouped commons, high-density output wiring
• IC200MDL741: 8-point relay output, 2A per point, Form C contacts, isolated commons

Analog Input (AI) Modules

• IC200ALG260: 4-channel analog input, 4–20mA / 0–20mA selectable, 12-bit resolution, single-ended
• IC200ALG230: 4-channel analog input, ±10V / 0–10V selectable, 12-bit resolution, differential inputs
• IC200ALG240: 8-channel analog input, 4–20mA, 12-bit resolution, single-ended, high channel density
• IC200ALG264: 4-channel analog input, thermocouple types J/K/T/E/R/S/B, cold junction compensation onboard

Analog Output (AO) Modules

• IC200ALG320: 2-channel analog output, 4–20mA, 12-bit resolution, loop-powered field devices
• IC200ALG330: 4-channel analog output, 4–20mA / 0–10V selectable per channel, 12-bit resolution

Network Interface Units (NIU) & Communications

• IC200PBI001: Profibus-DP NIU, slave mode, up to 244 bytes I/O, connects VersaMax I/O to Profibus-DP master
• IC200BEM002: Ethernet NIU, 10/100 Mbps, Modbus TCP and SRTP protocols, web-based diagnostics
• IC200GBI001: Genius Bus Interface Unit, connects VersaMax I/O to Genius Bus network, up to 128 I/O points
• IC200DBI001: DeviceNet NIU, slave mode, connects VersaMax I/O to DeviceNet master scanner

Power Supply Modules

• IC200PWR002: VersaMax Power Supply, 24VDC input, 15W output, for standard I/O carriers
• IC200PWR101: VersaMax Power Supply, 120/240VAC input, 30W output, universal input voltage range

Quality Control for the VersaMax Range

VersaMax modules present specific test challenges due to their integrated backplane connector interface and bus-dependent communication architecture. DriveKNMS applies the following protocol to IC200-series modules prior to dispatch:

• Visual Inspection: PCB examination for corrosion, capacitor bulge, burnt traces, and connector pin deformation. Carrier modules including the IC200CHS022 are inspected for backplane connector integrity and DIN-rail clip condition.
• Power-On Functional Test: Modules are installed in a live VersaMax test rack with a known-good CPU. Power rail voltages (3.3V, 5V, 24V) are verified at the carrier level prior to module insertion.
• I/O Point Verification: Each digital input and output point is exercised individually. Analog modules are calibrated against reference signals at 0%, 50%, and 100% of rated range. Thermocouple modules are verified against known cold-junction reference temperatures.
• Bus Communication Test: NIU and communications modules are tested for correct enumeration on Profibus-DP, Genius Bus, or Ethernet networks as applicable. Response time and data integrity are logged against specification.
• Burn-In: Modules are operated under load for a minimum of 4 hours to screen for early-life failures prior to packaging and dispatch.