GE IC600Y Series Modules: IC600YB842

Technical Dossier

Product Details And Specifications

GE IC600Y Series Technical Notes

The Evolution of IC600Y Architecture

The Series Six platform was introduced by GE Fanuc Automation in the early 1980s as a successor to earlier relay-logic and first-generation PLC systems. The IC600Y backplane operates on a parallel bus architecture with a fixed rack form factor, supporting up to 12 I/O slots per rack. Early CPU modules such as the IC600CB501 and IC600CB502 provided basic ladder logic execution with limited memory. Subsequent revisions introduced expanded program memory, floating-point arithmetic, and enhanced communications via the Genius Bus (GeniusBus) protocol — a token-passing serial network that allowed distributed I/O across plant floors without centralized wiring.

Compatibility across IC600Y generations is constrained by backplane bus voltage levels, firmware revision dependencies, and CPU memory map allocations. Substituting a later-generation CPU into an early-revision rack requires verification of power supply capacity and I/O module firmware compatibility. By the mid-2000s, GE Fanuc formally transitioned customers toward the Series 90-30 (IC693 series) and Series 90-70 (IC697 series) platforms, rendering the IC600Y line end-of-life for new production. However, no direct drop-in replacement exists for the IC600Y backplane form factor, making original spare parts the only viable option for sites that cannot justify a full control system migration.

IC600Y Full Catalog & Functionalities (SKU List)

Discrete Input Modules

• IC600YB840: 115VAC discrete input module, 16-point, Series Six rack-mount
• IC600YB841: 230VAC discrete input module, 16-point, high-voltage field wiring
• IC600YB842: 24VDC discrete input module, 16-point, sinking/sourcing compatible — the subject of this listing
• IC600YB843: 48VDC discrete input module, 16-point, industrial field device interface
• IC600YB844: TTL-level discrete input module, 32-point, high-density logic interface

Discrete Output Modules

• IC600YB845: 115VAC discrete output module, 16-point, triac output, 0.5A per point
• IC600YB846: 24VDC discrete output module, 16-point, transistor sourcing output
• IC600YB847: Relay output module, 16-point, Form C contacts, 2A per point
• IC600YB848: 230VAC discrete output module, 8-point, high-voltage triac

Analog I/O Modules

• IC600YB900: Analog input module, 8-channel, 4–20mA / 0–10V configurable
• IC600YB901: Analog output module, 4-channel, 4–20mA current loop output
• IC600YB902: Analog input module, 16-channel, high-resolution 12-bit ADC

CPU & Processor Modules

• IC600CB501: Series Six CPU, 6K word program memory, basic ladder logic
• IC600CB502: Series Six CPU, 12K word program memory, enhanced instruction set
• IC600CB503: Series Six CPU, 32K word program memory, floating-point support

Communications & Power

• IC600BF900: Genius Bus Controller (GBC), single-channel GeniusBus interface
• IC600PS501: Power supply module, 115/230VAC input, 5VDC/8A rack output
• IC600PS502: Power supply module, 24VDC input, 5VDC/8A rack output, battery-backed

Sourcing Hard-to-Find & Obsolete IC600Y Parts

Customers operating IC600Y systems in long-term maintenance mode are advised to establish a strategic spare parts buffer. DriveKNMS can assist with a site-specific bill of materials (BOM) review and recommended stocking quantities based on installed rack count and historical failure rates.

Quality Control for the IC600Y Range

• Visual inspection: PCB examination for corrosion, cracked solder joints, damaged edge connectors, and capacitor degradation — common failure modes in modules with 20+ years of service.
• Backplane bus simulation: Modules are seated in a Series Six test rack and subjected to full backplane communication cycles to verify bus arbitration and data integrity.
• I/O point verification: Each discrete input point on modules such as the IC600YB842 is individually stimulated and confirmed via logic analyzer. Analog modules undergo calibration verification against NIST-traceable references.
• Burn-in testing: Modules are operated under load at elevated temperature for a minimum of 24 hours to screen for latent component failures.
• Firmware revision logging: CPU and communications modules are documented with firmware version and memory configuration prior to shipment to ensure compatibility with the customer's existing rack configuration.