Products / General Electric / Genius I/O
General Electric Genius I/O

GE IC670 Genius I/O Modules

Model: IC670ALG230

Brand General Electric
Series Genius I/O
Model IC670ALG230
RFQ-ready model route Obsolete and surplus sourcing Export follow-up by model list

Product Overview

Commercial availability is handled through direct RFQ, model verification and export-oriented follow-up rather than public cart checkout.

Datasheet Preview

Datasheet Preview

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Commercial Path

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Technical Dossier

Product Details And Specifications

GE IC670 Genius I/O Series: Comprehensive Module Range and Technical Overview

The GE IC670 Genius I/O series is a distributed I/O platform developed by GE Automation & Controls (formerly GE Fanuc) for use with the Series 90-70 and Series 90-30 programmable logic controller families. Deployed extensively across global heavy industry — including petrochemical refineries, nuclear power generation facilities, offshore platforms, and continuous-process chemical plants — the IC670 block I/O architecture provides deterministic field-level communication over the Genius Bus (a proprietary serial fieldbus operating at 153.6 kbps). Installations of this series remain active in facilities with 20–30 year asset lifecycles, making spare parts availability a critical operational concern for maintenance engineers worldwide.

The Evolution of IC670 Architecture

The Genius I/O system was introduced in the mid-1980s as GE's answer to distributed field I/O, predating modern fieldbuses such as PROFIBUS and EtherNet/IP by nearly a decade. The IC670 block designation refers to the second-generation Genius I/O hardware form factor, replacing the earlier IC660 series with improved packaging density and expanded analog capability.

The IC670 communicates via the Genius Bus Interface Unit (GBIU), with each bus supporting up to 31 devices and scan times configurable from 1 ms to 7.5 ms depending on block count. The architecture is inherently non-redundant at the block level, though dual-bus configurations are supported at the controller level via redundant Bus Interface Units.

Compatibility considerations: IC670 blocks are not electrically interchangeable with IC660 blocks despite sharing the Genius Bus protocol. Field wiring terminations differ, and IC670 blocks require IC670 Bus Interface Units. Migration to modern GE RX3i (IC695) or PACSystems platforms requires a Bus Interface Module (BIM) or a full I/O migration project. As of 2024, GE Vernova (the successor entity to GE's industrial automation division) has formally classified the IC670 series as end-of-life, with no new production. Long-term maintenance support is now exclusively dependent on the aftermarket supply chain.

IC670 Full Catalog & Functionalities (SKU List)

The following SKUs represent the verified IC670 Genius I/O module catalog, organized by functional category. Each model listed below has confirmed field deployment history.

Analog Input Modules

  • IC670ALG230: 8-ch analog voltage/current input, ±10V / 4–20mA, 12-bit resolution
  • IC670ALG240: 16-ch analog current input, 4–20mA, 12-bit, high-density field I/O block
  • IC670ALG620: 4-ch RTD input module, supports PT100/PT1000, Ni120 sensor types
  • IC670ALG630: 4-ch thermocouple input, types J/K/T/E/R/S/B, cold junction compensated

Analog Output Modules

  • IC670ALG320: 4-ch analog voltage output, ±10V, 12-bit, isolated field terminals
  • IC670ALG330: 4-ch analog current output, 4–20mA, 12-bit, loop-powered configuration

Discrete Input Modules

  • IC670MDL640: 32-ch 24VDC discrete input, source/sink compatible, group isolated
  • IC670MDL641: 32-ch 24VDC discrete input, individually isolated, high-noise immunity
  • IC670MDL730: 16-ch 120VAC discrete input, zero-crossing detection, DIN rail mount
  • IC670MDL740: 16-ch 240VAC discrete input, surge-protected, industrial grade

Discrete Output Modules

  • IC670MDL940: 16-ch relay output, SPDT contacts, 2A per channel, 120/240VAC
  • IC670MDL741: 32-ch 24VDC discrete output, source type, electronic short-circuit protection
  • IC670MDL742: 32-ch 24VDC discrete output, sink type, fused per group

Bus Interface & Communication

  • IC670GBI001: Genius Bus Interface Unit (GBIU), single-bus, mounts to IC670 block assembly
  • IC670GBI002: Genius Bus Interface Unit, dual-bus redundant configuration
  • IC670CHS002: IC670 I/O block chassis, 2-slot, DIN rail or panel mount
  • IC670CHS004: IC670 I/O block chassis, 4-slot expansion

Sourcing Hard-to-Find & Obsolete IC670 Parts

GE's formal end-of-life declaration for the IC670 series has eliminated OEM new-production availability. DriveKNMS maintains a dedicated inventory program for IC670 spare parts, sourced through decommissioned plant asset recovery, authorized distributor surplus, and long-term storage stock. All units are inspected prior to listing.

DriveKNMS supports the following sourcing scenarios for IC670 operators:

  • Emergency breakdown replacement: Same-day quotation and priority dispatch for critical process uptime recovery.
  • Planned maintenance stock: Bulk procurement of identified critical spares to support 3–5 year maintenance windows.
  • Decommissioning buyback: DriveKNMS purchases surplus IC670 inventory from facilities undergoing DCS migration.
  • Cross-reference advisory: Identification of compatible substitute modules where direct replacements are unavailable.

Quality Control for the IC670 Range

IC670 modules present specific test challenges due to their integrated Genius Bus communication logic and analog signal conditioning circuitry. DriveKNMS applies the following verification protocol to all IC670 units prior to dispatch:

  • Bus communication test: Each module is connected to a live Genius Bus segment and verified for correct device ID registration, datagram response, and fault reporting behavior.
  • Analog channel calibration check: For ALG-series modules, all input and output channels are verified against NIST-traceable reference signals at 0%, 25%, 50%, 75%, and 100% of rated range.
  • Discrete I/O functional test: MDL-series modules are cycled through full ON/OFF sequences on all channels with load simulation.
  • Visual and mechanical inspection: PCB inspection for corrosion, capacitor condition, relay contact wear, and connector pin integrity.
  • Burn-in soak: Units are powered for a minimum of 24 hours under simulated load prior to final packaging.
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