GE Fanuc IC670 Series Modules | IC670CHS101C I/O Terminal Block

Technical Dossier

Product Details And Specifications

GE Fanuc IC670 Series: Comprehensive Module Range and Technical Overview

The GE Fanuc IC670 series — commercially designated as the Series 90-70 distributed I/O subsystem — represents one of the most widely deployed programmable controller I/O architectures in global heavy industry. Installed across petrochemical complexes, nuclear power generation facilities, offshore oil platforms, and continuous-process refineries, the IC670 platform established a field-proven standard for distributed I/O expansion in environments where signal integrity, backplane reliability, and long-term parts availability are non-negotiable operational requirements. Its modular terminal block and carrier architecture enabled system integrators to construct scalable I/O assemblies without rewiring field devices during module replacement — a critical advantage in facilities operating under strict change-management protocols. The IC670CHS101C I/O Terminal Block is a core mechanical and electrical interface component within this architecture, providing the field-wiring termination point for discrete and analog I/O modules mounted on IC670 carriers.

The Evolution of IC670 Architecture

The IC670 distributed I/O family was introduced as part of GE Fanuc's Series 90-70 PLC ecosystem in the late 1980s, designed to extend the Series 90-70 CPU rack's I/O capacity over a serial bus to remote drop locations. The architecture evolved through three identifiable phases. In its initial release, the IC670 system relied on the IC670ALG230 and IC670MDL640 modules communicating over a proprietary GE Genius Bus (IC660) interface, with the IC670CHS001 and IC670CHS101 carriers providing the physical mounting and backplane connectivity. The second phase introduced enhanced terminal block variants — including the IC670CHS101C — which incorporated improved field-wiring retention and higher vibration tolerance ratings suitable for rotating-machinery environments. The third phase addressed compatibility with GE's transition to the PACSystems RX7i and RX3i platforms, where IC670 I/O drops could be retained via IC695LRE001 remote expansion adapters, preserving existing field wiring investments. As of 2026, the IC670 series is classified as a mature/end-of-life product line by GE Vernova (formerly GE Digital). OEM production of most IC670 modules has ceased; however, the installed base across legacy DCS and PLC systems in refineries and power plants sustains active demand for replacement and spare parts. Long-term maintenance support — including tested surplus and refurbished units — remains the primary sourcing channel for this series.

IC670 Full Catalog & Functionalities (SKU List)

The following represents a structured index of verified IC670 series components, organized by functional category. Each entry reflects a documented, production-released part number within the GE Fanuc IC670 / Series 90-70 distributed I/O ecosystem.

Terminal Blocks & Carriers

• IC670CHS101C: 11-slot I/O terminal block carrier, field-wiring termination for discrete/analog modules
• IC670CHS001: 5-slot I/O carrier base, standard backplane for IC670 module mounting
• IC670CHS002: 10-slot I/O carrier base, extended backplane configuration
• IC670CHS101: 11-slot terminal block carrier, predecessor to IC670CHS101C revision
• IC670CHS102: 11-slot terminal block carrier with enhanced grounding rail

Discrete Input Modules

• IC670MDL640: 16-point 24VDC discrete input module, sink/source compatible
• IC670MDL641: 16-point 120VAC discrete input module, isolated inputs
• IC670MDL642: 32-point 24VDC discrete input module, high-density configuration
• IC670MDL643: 16-point 240VAC discrete input module

Discrete Output Modules

• IC670MDL740: 16-point 24VDC discrete output module, sourcing type
• IC670MDL741: 16-point 120VAC discrete output module, triac output
• IC670MDL742: 8-point relay output module, Form C contacts, 2A per point
• IC670MDL743: 16-point 24VDC discrete output module, sinking type

Analog I/O Modules

• IC670ALG230: 4-channel analog input module, 4–20mA / 0–10V configurable
• IC670ALG231: 8-channel analog input module, 12-bit resolution
• IC670ALG320: 2-channel analog output module, 4–20mA current loop
• IC670ALG321: 4-channel analog output module, voltage/current selectable

Communications & Bus Interface

• IC670GBI001: Genius Bus Interface Unit (BIU), connects IC670 drop to Genius Bus segment
• IC670GBI002: Genius Bus Interface Unit, dual-bus redundancy configuration

Sourcing Hard-to-Find & Obsolete IC670 Parts

Quality Control for the IC670 Range

IC670 modules present specific test challenges due to their backplane bus architecture and terminal block interface design. DriveKNMS applies the following verification procedures to all IC670 units processed through its facility. Carrier and terminal block assemblies — including the IC670CHS101C — are inspected for connector pin straightness, terminal screw torque retention, and backplane edge connector gold-plating condition. Discrete I/O modules are tested under live 24VDC and 120VAC signal conditions using a dedicated IC670 test rack configured with a known-good IC670GBI001 bus interface. Analog modules are calibrated against NIST-traceable reference instruments to verify channel accuracy within published GE Fanuc specifications. All units are powered through a full thermal cycle prior to final inspection. Modules exhibiting intermittent bus communication faults — a known failure mode in aged IC670 GBI units — are rejected and not offered for resale. Test records are retained for a minimum of 24 months and are available to customers upon request.

© 2026 DriveKNMS. All trademarks belong to their respective owners. Specifications are for reference only and subject to change without notice. Verify all parameters against official documentation before installation.