GE Fanuc PACSystems RX3i IC695 Modules: IC695CHS016 CPU Universal Backplane

Technical Dossier

Product Details And Specifications

GE Fanuc PACSystems RX3i IC695 Series Technical Notes

The GE Fanuc PACSystems RX3i IC695 series represents one of the most widely deployed programmable automation controller (PAC) platforms in global heavy industry. Installed across petrochemical refineries, nuclear power generation facilities, offshore oil & gas platforms, pulp and paper mills, and large-scale water treatment infrastructure, the IC695 backplane and module ecosystem has accumulated a multi-decade installed base that continues to demand active spare parts support. The RX3i architecture succeeded the earlier Series 90-30 and Series 90-70 platforms, consolidating high-speed backplane communication with a universal slot design that accepts CPU, I/O, communications, and power supply modules in a single chassis. Its adoption in safety-critical and continuous-process environments means that lifecycle management — not replacement — is the dominant procurement strategy for most end users.

The Evolution of IC695 Architecture

The IC695 module family was introduced as the hardware foundation of the PACSystems RX3i platform, launched by GE Fanuc Automation in the early 2000s. The RX3i architecture was designed around a high-speed serial backplane operating at 300 MB/s, a significant advancement over the parallel backplane used in the Series 90-70 (IC697) platform. This serial backplane design allowed the IC695 chassis to support mixed-slot configurations — CPU modules, analog and digital I/O, motion control, and communications adapters can occupy any slot without fixed slot-type restrictions.

Early IC695 deployments used the IC695CHS012 (12-slot) and IC695CHS016 (16-slot) universal backplanes paired with first-generation CPUs such as the IC695CPU310. As processing demands increased, GE introduced higher-performance CPUs including the IC695CPU320 and later the IC695CPE302 and IC695CPE330, which added embedded Ethernet ports and expanded memory. The communications layer evolved in parallel, with PROFIBUS (IC695PBM300), DeviceNet (IC695NDR001), and EtherNet/IP (IC695ETM001) adapters extending the RX3i into multi-protocol plant networks.

By the 2010s, the IC695 platform entered a mature phase. GE's industrial automation division was acquired by Emerson in 2023, and the PACSystems product line is now maintained under the Emerson brand. Firmware and hardware revisions continue for select modules, but the majority of the IC695 catalog is in a sustaining or end-of-active-development state. For facilities running original IC695 hardware, sourcing certified refurbished or new-surplus modules from specialist distributors is the primary strategy for maintaining uptime without full system migration.

IC695 Full Catalog & Functionalities (SKU List)

CPU & Controller Modules

• IC695CPU310: RX3i base CPU, 10 MB user memory, single Ethernet port
• IC695CPU320: RX3i CPU with 64 MB memory, dual Ethernet, enhanced scan performance
• IC695CPE302: Embedded dual-port Ethernet CPU, 10 MB, compact form factor
• IC695CPE330: High-performance CPU, 64 MB, dual Ethernet, USB programming port
• IC695CPE400: Advanced CPU with 128 MB memory, IEC 61131-3 multi-tasking support

Backplane / Chassis Modules

• IC695CHS012: 12-slot universal backplane, supports all IC695 module types
• IC695CHS016: 16-slot universal backplane, maximum slot density for large I/O configurations
• IC695CHS007: 7-slot universal backplane, compact installations and remote expansion

Digital I/O Modules

• IC695MDL654: 16-point 24 VDC positive logic discrete input module
• IC695MDL664: 16-point 24 VDC positive logic discrete output module
• IC695MDL740: 32-point 24 VDC discrete input, high-density configuration
• IC695MDL752: 32-point 24 VDC discrete output, high-density configuration

Analog I/O Modules

• IC695ALG600: 8-channel analog input, 4–20 mA / 0–10 V configurable per channel
• IC695ALG608: 8-channel analog input with HART protocol support
• IC695ALG704: 8-channel analog output, 4–20 mA / ±10 V selectable
• IC695ALG728: 16-channel analog input, high-channel-count process applications

Communications & Network Adapter Modules

• IC695ETM001: EtherNet/IP and SRTP communications module, dual RJ45 ports
• IC695PBM300: PROFIBUS DP master module, up to 125 slave devices
• IC695NDR001: DeviceNet master/slave communications adapter
• IC695CMM002: Serial communications module, RS-232/RS-485, Modbus RTU support

Power Supply Modules

• IC695PSA040: 40W AC/DC power supply, 120/240 VAC input, 5 VDC backplane output
• IC695PSD040: 40W DC power supply, 24 VDC input for DC-powered panel installations

Quality Control for the IC695 Range

The IC695 backplane and module architecture presents specific test requirements due to its high-speed serial backplane protocol and the interdependency between CPU firmware, backplane revision, and I/O module hardware versions. DriveKNMS applies the following test procedures to all IC695 inventory:

• Backplane continuity and slot integrity testing: Each IC695CHS012 and IC695CHS016 chassis undergoes pin-level continuity verification across all backplane connector positions to identify bent pins, oxidation, or trace damage from prior installation.
• CPU boot and firmware verification: CPU modules (IC695CPU310, IC695CPU320, IC695CPE302, IC695CPE330) are powered in a reference chassis and verified to complete POST, enumerate backplane slots, and accept a test program load via the standard programming port.
• I/O channel functional test: Analog modules are tested at full channel count using calibrated signal sources. Digital I/O modules are tested for correct logic-level switching and response time within GE specification.
• Communications module protocol handshake test: EtherNet/IP (IC695ETM001) and PROFIBUS (IC695PBM300) modules are tested for correct network enumeration and data exchange with a reference master/slave device.
• Thermal burn-in: All refurbished modules undergo a minimum 24-hour powered burn-in at elevated ambient temperature to screen for early-life component failures prior to shipment.