Products / General Electric / IS200AEBEG1A
General Electric IS200AEBEG1A

GE IS200 Series Modules

Model: IS200AEBEG1A

Brand General Electric
Series IS200AEBEG1A
Model IS200AEBEG1A
RFQ-ready model route Obsolete and surplus sourcing Export follow-up by model list

Product Overview

Commercial availability is handled through direct RFQ, model verification and export-oriented follow-up rather than public cart checkout.

Datasheet Preview

Datasheet Preview

Use attached product manuals when available. If the manual is not public yet, request the full file directly through RFQ.

Request Full Manual

Commercial Path

Use This Page To Confirm The Model, Then Move To RFQ

Product pages on DRIVEKNMS are designed to verify model, brand and series first, then move the buyer into one clean quotation path.

Technical Dossier

Product Details And Specifications

GE IS200 Series: Comprehensive Module Range and Technical Overview

The GE IS200 series is the core I/O and control module family deployed within GE's Mark VI and Mark VIe Turbine Control Systems, as well as the EX2100 excitation control platform. These systems govern gas turbines, steam turbines, combined-cycle power plants, compressor trains, and large rotating machinery across refineries, petrochemical complexes, nuclear auxiliary systems, and LNG terminals worldwide. The IS200 platform represents GE's transition from the earlier Mark V architecture to a fully distributed, triple-redundant TMR (Triple Modular Redundancy) control topology. Installed base spans hundreds of facilities across North America, the Middle East, Southeast Asia, and Europe, making IS200 modules among the most widely maintained legacy control hardware in heavy industry.

The Evolution of IS200 Architecture

The IS200 series emerged in the mid-1990s as GE Power Systems standardized turbine control around the Mark VI platform, replacing the Mark V's proprietary backplane with a more modular, VME-compatible bus structure. Early IS200 modules used parallel backplane communication; later revisions introduced the IONet Ethernet-based I/O network, enabling distributed I/O racks separated from the main controller cabinet by up to 100 meters. The Mark VIe generation (introduced circa 2005–2008) retained IS200-form-factor modules but migrated to a fully Ethernet-based architecture (IONET/ARCNET), improving diagnostics and enabling remote monitoring. Compatibility between Mark VI and Mark VIe IS200 modules is revision-dependent: hardware form factor is often identical, but firmware and backplane addressing differ. Engineers sourcing replacement modules must verify the exact revision suffix (e.g., A, B, C, D, E, F, G) to ensure backplane and firmware compatibility. The series is now in a mature/end-of-production lifecycle; GE no longer manufactures most IS200 variants, making third-party MRO suppliers the primary source for spare parts and long-term maintenance support.

IS200 Full Catalog & Functionalities (SKU List)

The following SKUs represent verified, commonly deployed modules within the GE IS200 series. Each entry includes its functional classification and a concise technical description.

Analog Input (AI) Modules

  • IS200AEBEG1A: Analog I/O terminal board; interfaces thermocouple, RTD, and 4–20 mA signals to the Mark VI controller via backplane.
  • IS200AEAAH1A: Analog input terminal board; supports differential voltage and current inputs for process variable monitoring.
  • IS200AAIAH1A: Analog input module; 16-channel 4–20 mA input board for process instrumentation loops.
  • IS200ATAAH1A: Analog terminal board; used for thermocouple and millivolt signal conditioning in turbine exhaust temperature monitoring.

Digital Input (DI) Modules

  • IS200DAIAH1A: Digital input terminal board; 24 VDC discrete input acquisition for valve position, limit switch, and relay status signals.
  • IS200DTURH1A: Digital input terminal board for turbine speed and overspeed detection; interfaces magnetic pickup sensors.
  • IS200DSVOH1A: Digital input/output servo terminal board; interfaces electrohydraulic servo valves for fuel and inlet guide vane control.
  • IS200DSPXH1A: Digital signal processor board; handles high-speed pulse counting and frequency measurement for speed probes.

Digital Output (DO) Modules

  • IS200EDCFH1A: DC power distribution and fusing board; provides protected 28 VDC output circuits for field solenoids and actuators.
  • IS200TRLYH1A: Relay output terminal board; 16-channel dry-contact relay outputs for alarm annunciation and trip logic.
  • IS200VSVOH1B: Servo output driver board; generates ±200 mA current-controlled output to electrohydraulic servo valves.

CPU / Controller Modules

  • IS200UCVEH1A: Mark VI main controller board (UCVE); executes turbine control application software, manages I/O communication via IONet.
  • IS200UCVEH2A: Revised UCVE controller; enhanced memory and processing speed for complex multi-shaft applications.
  • IS200EACFH1A: Application controller board; secondary processing module used in simplex and TMR Mark VI configurations.

Power Supply Modules

  • IS200EPSMH1A: Power supply module; converts 120/240 VAC to regulated 28 VDC and 5 VDC for Mark VI I/O rack power distribution.
  • IS200BPPCH1A: Backplane power and communication board; distributes logic power and backplane bus signals across the I/O module rack.

Communication / Network Modules

  • IS200IOCIH1A: IONet communication interface board; bridges the Mark VI controller to the Ethernet-based IONet I/O network for distributed rack communication.
  • IS200STCIH1A: Serial communication interface board; provides RS-232/RS-485 ports for Modbus RTU and legacy HMI connectivity.

Sourcing Hard-to-Find & Obsolete IS200 Parts

Quality Control for the IS200 Range

IS200 modules present specific test challenges due to their backplane-dependent architecture: most modules cannot be fully exercised without a live Mark VI backplane providing logic power, IONet communication, and application software context. DriveKNMS employs the following test protocol for IS200 hardware: (1) Visual inspection per IPC-A-610 Class 2 criteria, covering solder joint integrity, connector pin condition, and conformal coating status; (2) Powered bench test using a dedicated Mark VI backplane test fixture, verifying module enumeration, self-diagnostic pass/fail status, and LED indicator behavior; (3) Signal-level verification for I/O modules using calibrated signal sources (4–20 mA loops, thermocouple simulators, discrete 24 VDC inputs) to confirm channel accuracy within OEM specification; (4) Communication integrity test for IONet and ARCNET interface boards using protocol analyzers to verify packet transmission and error rates; (5) Burn-in cycle (minimum 48 hours at operating temperature) for modules destined for critical TMR applications. Test records are retained per unit serial number and are available to customers upon request.

WhatsApp Prefilled Inquiry Email [email protected] Phone +86 18359293191 Top Back To Top