GE IS200 Series Modules: IS200EISBH1A IS200EISBH1AAA Fiber Optic Board

Technical Dossier

Product Details And Specifications

GE IS200 Series Technical Notes

The Evolution of IS200 Architecture

The IS200 board family was introduced alongside the Mark VI turbine control system in the mid-1990s as a replacement for the earlier Mark V (IS200 predecessor boards used the IS4x and IS1x naming conventions). The architecture is built around a dual-redundant VME backplane with deterministic real-time communication via GE's proprietary IONet and ARCNET protocols. Early IS200 boards (circa 1996–2002) used through-hole and mixed SMT component technology with EPROM-based firmware. Mid-generation boards (2003–2010) transitioned to fully surface-mount designs with flash-upgradeable firmware and expanded diagnostic LED arrays. Late-generation variants introduced fiber optic isolation on high-voltage interface boards — the IS200EISBH1A being a primary example — to eliminate ground loop interference in high-EMI environments such as generator excitation panels. As GE transitioned to the Mark VIe platform (post-2008), many IS200 boards were retained in hybrid configurations, maintaining backward compatibility with existing I/O wiring while interfacing to the newer EtherNet/IP-based controller backbone. The IS200 series is now in the mature-to-end-of-life phase; GE has formally discontinued active production on the majority of variants, making third-party MRO (Maintenance, Repair & Overhaul) suppliers the primary sourcing channel for replacement units.

IS200 Full Catalog & Functionalities (SKU List)

The following SKUs represent verified, commonly deployed modules within the GE IS200 series. Modules are classified by functional category:

Fiber Optic & Communication Interface Boards

• IS200EISBH1A / IS200EISBH1AAA: Excitation I/O signal board with fiber optic isolation; interfaces EX2100 excitation system to Mark VI controller backplane.
• IS200VCRCH1B: VME communication and redundancy controller; manages IONet redundancy switching and inter-board arbitration.
• IS200BICLH1A: Fiber optic bridge interface card; converts ARCNET signals to fiber for noise-immune long-distance rack-to-rack communication.
• IS200ECTBG1A: Ethernet communication terminal board; provides 10/100 Ethernet connectivity for Mark VIe hybrid configurations.

Analog & Digital I/O Modules

• IS200AAIAH1A: Analog input board; 16-channel, 4–20 mA / 0–10 V configurable, used for process variable acquisition (pressure, temperature, flow).
• IS200AAOAH1A: Analog output board; 8-channel isolated analog output for valve positioner and actuator control signals.
• IS200DAIAH1A: Digital input board; 24 VDC / 125 VDC configurable discrete input module for contact status monitoring.
• IS200DAOBH1A: Digital output board; relay-based discrete output module, 16-channel, rated for 120/240 VAC load switching.
• IS200TRLYH1B: Triple-redundant relay output board; used in protective relay and trip circuit applications requiring 2-of-3 voting logic.

CPU & Controller Modules

• IS200UCVEH2A: Mark VI main controller board (UCVE); primary CPU module executing turbine control application logic at deterministic 10 ms scan rates.
• IS200UCVEH2B: Revised UCVE controller with expanded SRAM and updated FPGA firmware; direct drop-in replacement for H2A in most configurations.
• IS200VSVOH1B: Servo valve output board; provides high-current PWM drive signals for electrohydraulic servo valves on steam and gas turbine fuel/steam control.

Power Supply & Termination Boards

• IS200EPSMG1A: Excitation power supply module; provides regulated DC bus voltages to EX2100 excitation control boards.
• IS200TBAIH1C: Terminal board for analog inputs; field-wiring termination panel that mates with IS200AAIAH1A via ribbon cable.
• IS200TBCIH1C: Terminal board for contact inputs; screw-terminal field wiring interface for IS200DAIAH1A discrete input modules.
• IS200TBQCH1A: Quad-channel terminal board; supports four independent I/O module connections on a single termination panel, reducing panel wiring density.

Quality Control for the IS200 Range

IS200 series boards present specific test challenges due to their VME backplane interface, fiber optic transceivers, and in some cases high-voltage isolation barriers. DriveKNMS applies the following test protocol to all IS200 units prior to shipment: (1) Visual inspection: 10x magnification examination of all solder joints, capacitor bodies, and connector pins for corrosion, mechanical damage, or evidence of thermal stress. (2) Backplane functional test: Each board is seated in a live IS200-compatible VME test rack running GE ToolboxST or equivalent diagnostic software to verify correct enumeration, firmware version reporting, and I/O channel response. (3) Fiber optic transceiver test: For boards including the IS200EISBH1A, optical power output and receive sensitivity are measured with a calibrated optical power meter to confirm compliance with GE's specified link budget. (4) Isolation resistance test: High-voltage isolation barriers (where present) are verified at 500 VDC using a calibrated megohmmeter. (5) Burn-in: Units are powered continuously for a minimum of 24 hours at ambient temperature before final inspection and packaging.