MOORE APACS+ Modules 39ACM28AEN 16139-218

Model: 39ACM28AEN 16139-218

Brand Moore
Series APACS+
Model 39ACM28AEN 16139-218
RFQ-ready model route Obsolete and surplus sourcing Export follow-up by model list

Product Overview

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Commercial Path

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Technical Dossier

Product Details And Specifications

MOORE APACS+ Series Technical Notes

The Evolution of APACS+ Architecture

The APACS+ platform evolved from Moore Products' earlier APACS (Advanced Process Automation and Control System) line introduced in the late 1980s. The original APACS used a proprietary SAINET fieldbus for inter-module communication. The APACS+ generation, released in the early 1990s, introduced an enhanced backplane bus with higher throughput, improved CPU processing speed, and expanded I/O density per rack.

Key architectural milestones:

  • APACS (Gen 1, ~1988–1992): Proprietary SAINET bus, 8-slot racks, limited redundancy options.
  • APACS+ (Gen 2, ~1992–2002): Enhanced backplane, 16-slot rack support, hot-standby CPU redundancy, expanded analog I/O resolution to 16-bit.
  • APACS+ with QUADLOG (Safety Layer, ~1995–2005): Integration of SIL 2/3 safety logic solver modules on the same backplane infrastructure.
  • Siemens Migration Path (~2005–present): Following Siemens' acquisition of Moore Products, the APACS+ platform was officially designated end-of-life. Siemens offered migration to the SIMATIC PCS 7 platform. However, the high cost and complexity of migration has resulted in a large installed base continuing to operate APACS+ hardware, creating sustained demand for spare parts and replacement modules.

Compatibility note: APACS and APACS+ modules are not cross-compatible at the backplane level. APACS+ modules require APACS+ racks and power supplies. Mixing generations will result in communication faults.

APACS+ Full Catalog & Functionalities (SKU List)

CPU / Controller Modules

  • 39ACM28AEN 16139-218: Advanced Control Module, dual-port Ethernet, hot-standby redundancy capable, primary process controller for APACS+ racks.
  • 39ACM28A 16139-200: Advanced Control Module, standard variant, single Ethernet port, non-redundant configuration.
  • 39ACM28B 16139-210: Advanced Control Module Rev B, enhanced memory capacity, supports larger ladder/function block programs.
  • 39ACM28C 16139-220: Advanced Control Module Rev C, extended temperature range, improved EMI shielding.

Analog Input (AI) Modules

  • 39AIM8 16102-100: 8-channel analog input, 4–20 mA / 1–5 VDC, 16-bit resolution, HART pass-through capable.
  • 39AIM16 16102-200: 16-channel analog input, high-density configuration, 4–20 mA, field-side isolation per channel.
  • 39AIM8H 16102-150: 8-channel analog input with integrated HART communication, supports HART revision 5/6.

Analog Output (AO) Modules

  • 39AOM8 16103-100: 8-channel analog output, 4–20 mA, 16-bit DAC, loop-powered field devices supported.
  • 39AOM8H 16103-150: 8-channel analog output with HART pass-through, field device diagnostics via HART.

Digital Input (DI) Modules

  • 39DIM16 16104-100: 16-channel digital input, 24 VDC, optically isolated, configurable for sourcing or sinking.
  • 39DIM32 16104-200: 32-channel digital input, high-density, 24 VDC, group isolation.

Digital Output (DO) Modules

  • 39DOM16 16105-100: 16-channel digital output, 24 VDC, 0.5 A per channel, short-circuit protected.
  • 39DOM16R 16105-150: 16-channel relay output, SPDT contacts, 2 A @ 250 VAC, for high-current switching applications.

Communication / Network Modules

  • 39NIM 16120-100: Network Interface Module, SAINET/Ethernet bridge, connects APACS+ racks to plant-level DCS network.
  • 39RIM 16121-100: Remote I/O Module, extends I/O capacity to remote rack locations via fiber or copper link.

Power Supply Modules

  • 39PSM 16130-100: Power Supply Module, 24 VDC input, 5 VDC / 3.3 VDC backplane output, redundant pair capable.
  • 39PSM-R 16130-200: Redundant Power Supply Module, hot-swap capable, automatic failover, status LED and relay contact output.

Sourcing Hard-to-Find & Obsolete APACS+ Parts

The APACS+ platform reached official end-of-life under Siemens' product lifecycle policy. New production of APACS+ modules ceased, and OEM support contracts are no longer available through standard channels. This creates a critical supply gap for facilities that have not yet completed migration to a successor platform.

DriveKNMS maintains a dedicated inventory of APACS+ spare parts sourced through authorized secondary market channels, decommissioned plant buybacks, and certified refurbishment programs. Our inventory covers the full APACS+ module range including CPU controllers, I/O modules, network interfaces, and power supplies.

Services provided for APACS+ lifecycle extension:

  • Genuine pull-out modules tested to OEM functional specifications.
  • Condition review: Available condition, photos, test records and documentation are checked before quotation according to the requested model.
  • Emergency urgent RFQ handling for critical plant shutdowns.
  • Long-term supply agreements for facilities with multi-year maintenance plans.
  • Cross-reference support: identification of compatible substitute modules where direct replacements are unavailable.

Quality Control for the APACS+ Range

APACS+ modules present specific test challenges due to their proprietary backplane bus protocol and multi-layer PCB construction. DriveKNMS applies the following test procedures to all APACS+ inventory:

  • Backplane Communication Test: Each module is seated in a live APACS+ test rack and verified for correct backplane enumeration and data exchange with a reference ACM controller.
  • Functional I/O Verification: All analog channels are tested at 0%, 25%, 50%, 75%, and 100% of rated range. Digital channels are cycled through ON/OFF states under rated load.
  • HART Protocol Test (for HART-capable modules): HART commands 0, 1, 3, and 48 are executed to verify device descriptor, process variable, and diagnostic data transmission.
  • Power Supply Load Test: PSM modules are tested under 80% rated load for 30 minutes minimum, with output voltage ripple measured at <50 mV peak-to-peak.
  • RFQ terms review: Commercial terms are confirmed during RFQ review based on model, condition, documentation, quantity and destination.
  • Visual and Component Inspection: PCB inspection for corrosion, cold solder joints, capacitor bulge, and connector pin integrity.

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