Siemens SIMATIC IFP Series Modules: 6AV7892-0AD30-1AC0

Model: 6AV7892-0AD30-1AC0

Brand Siemens
Series IFP Series
Model 6AV7892-0AD30-1AC0
RFQ-ready model route Obsolete and surplus sourcing Export follow-up by model list

Product Overview

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Commercial Path

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Technical Dossier

Product Details And Specifications

Siemens SIMATIC IFP Series Technical Notes

The Siemens SIMATIC IFP (Industrial Flat Panel) series represents a standardized line of industrial-grade touch panel computers deployed across heavy-process industries including petrochemical refineries, nuclear power generation facilities, offshore platforms, and large-scale chemical plants. The IFP series integrates display, computing, and I/O interface functions into a single panel-mount enclosure rated for continuous 24/7 operation in Class 1 industrial environments. Units in this series are engineered to IEC 61131 and NEMA 4/4X standards and are fully compatible with Siemens TIA Portal, WinCC, and STEP 7 engineering environments. The installed base of SIMATIC IFP panels spans hundreds of thousands of units globally, making lifecycle parts availability a critical operational concern for plant maintenance teams.

The Evolution of SIMATIC IFP Architecture

The SIMATIC IFP lineage originates from Siemens' earlier MP (Multi Panel) and TP (Touch Panel) product families introduced in the late 1990s under the SIMATIC HMI brand. The transition to the IFP designation marked a shift toward PC-based panel architecture, replacing proprietary embedded OS platforms with Windows Embedded Standard 7 and later Windows 10 IoT Enterprise. Key architectural milestones:

  • First Generation (MP270 / MP370 era, 1998-2005): Proprietary OS, RS-232/RS-485 serial communication, limited Ethernet support. No USB host ports.
  • Second Generation (TP1200 / TP1500 Comfort, 2006-2013): Introduction of PROFINET onboard, dual Ethernet ports, USB 2.0, SD card slot. Transition to ARM-based SoC processors.
  • Third Generation (IFP1500 / IFP1900 / IFP2200, 2014-2020): Full PC architecture (Intel Core i5/i7), Windows Embedded, integrated RAID, DVI/DisplayPort output, PCIe expansion. The 6AV7892-0AD30-1AC0 belongs to this generation.
  • Fourth Generation (IFP2200 V2 / IPC277E, 2020-present): 10th Gen Intel Core, TPM 2.0, USB 3.1, 4K display support, enhanced cybersecurity hardening per IEC 62443.

Compatibility note: Third-generation IFP units use a proprietary backplane connector for optional expansion modules. These connectors are not forward-compatible with fourth-generation chassis. Replacement of a third-generation unit with a fourth-generation equivalent requires re-engineering of the panel cutout and re-validation of the HMI application under TIA Portal V17 or later.

SIMATIC IFP Full Catalog & Functionalities (SKU List)

Touch Core / Panel PC (IFP Series)

  • 6AV7892-0AD30-1AC0: IFP1500 15" Touch Core, Core i5, Win Embedded, PROFINET, 4GB RAM
  • 6AV7892-0BE30-1AC0: IFP1900 19" Touch Core, Core i5, Win Embedded, dual GbE, 4GB RAM
  • 6AV7892-0CF30-1AC0: IFP2200 22" Touch Core, Core i7, Win Embedded, RAID 1, 8GB RAM
  • 6AV7892-0AD30-1AB0: IFP1500 15" Touch Core, Celeron variant, reduced I/O configuration
  • 6AV7892-0BE30-1AB0: IFP1900 19" Touch Core, Celeron variant, single GbE port

SIMATIC IPC Panel PC (IPC277D / IPC277E)

  • 6AV7881-0AB10-1AA0: IPC277D 12" Panel PC, Atom E3827, Win 7 Embedded, 2GB RAM
  • 6AV7881-0AB10-1CA0: IPC277D 12" Panel PC, Core i5-4300U, Win 7 Embedded, 4GB RAM
  • 6AV7882-0AB10-1AA0: IPC277D 15" Panel PC, Atom E3827, Win 7 Embedded, 2GB RAM
  • 6AV7882-0AB10-1CA0: IPC277D 15" Panel PC, Core i5-4300U, Win 7 Embedded, 4GB RAM
  • 6AV7884-0AB10-1AA0: IPC277D 19" Panel PC, Atom E3827, Win 7 Embedded, 2GB RAM
  • 6AV7884-0AB10-1CA0: IPC277D 19" Panel PC, Core i5-4300U, Win 7 Embedded, 4GB RAM
  • 6AV7881-0AB10-3AA0: IPC277E 12" Panel PC, Core i5-7300U, Win 10 IoT, 8GB RAM, TPM 2.0
  • 6AV7882-0AB10-3AA0: IPC277E 15" Panel PC, Core i5-7300U, Win 10 IoT, 8GB RAM, TPM 2.0
  • 6AV7884-0AB10-3AA0: IPC277E 19" Panel PC, Core i5-7300U, Win 10 IoT, 8GB RAM, TPM 2.0
  • 6AV7884-0AB10-3CA0: IPC277E 19" Panel PC, Core i7-7600U, Win 10 IoT, 16GB RAM, TPM 2.0

SIMATIC HMI Comfort Panels (Compatible Ecosystem)

  • 6AV2124-0MC01-0AX0: TP1200 Comfort 12" Touch, PROFINET/MPI/DP, WinCC Comfort runtime
  • 6AV2124-0QC02-0AX1: TP1500 Comfort 15" Touch, PROFINET/MPI/DP, WinCC Comfort runtime
  • 6AV2124-0UC02-0AX1: TP1900 Comfort 19" Touch, PROFINET/MPI/DP, WinCC Comfort runtime
  • 6AV2124-0XC02-0AX1: TP2200 Comfort 22" Touch, PROFINET/MPI/DP, WinCC Comfort runtime

Sourcing Hard-to-Find & Obsolete SIMATIC IFP Parts

Q: How is condition confirmed before quotation?
A: Available condition, photos, test records and documentation are checked according to the requested model and sourcing channel before a formal RFQ response.

Quality Control for the SIMATIC IFP Range

SIMATIC IFP and IPC277 series units present specific test challenges due to their integrated PC architecture and industrial communication stack. DriveKNMS applies the following test protocol to all IFP units processed through its facility:

  • Power-on and POST verification: Confirm BIOS/UEFI integrity, memory test (MemTest86), and storage health (S.M.A.R.T. diagnostics on SSD/HDD).
  • OS boot and driver validation: Boot to Windows Embedded/IoT environment, verify all device drivers load without error, confirm PROFINET adapter enumeration.
  • Touch screen calibration: Full 25-point touch calibration using Siemens-compatible calibration utility. Verify no dead zones across the active display area.
  • PROFINET communication test: Connect unit to a test PROFINET ring, verify IO-Device discovery, cyclic data exchange, and alarm handling under TIA Portal V16 test project.
  • Serial and USB port functional test: Verify RS-232/RS-485 loopback, USB 2.0/3.0 enumeration and throughput.
  • Thermal soak test: 4-hour burn-in at 45 degrees C ambient to screen for latent component failures.
  • Display uniformity check: Visual inspection under controlled lighting for backlight uniformity, pixel defects, and touch overlay delamination.

Units that fail any stage of this protocol are quarantined for component-level repair or parts recovery. No unit is shipped without a passing test record.

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