Siemens ET 200SP Modules: 6ES7137-6EA00-0BA0 & Full Series

Technical Dossier

Product Details And Specifications

Siemens ET 200SP Series Technical Notes

The Siemens ET 200SP (SIMATIC ET 200SP) is a modular, scalable distributed I/O system designed for integration with SIMATIC S7-1500 and S7-1200 controllers via PROFINET or PROFIBUS. Since its introduction, the ET 200SP has established a dominant installed base across global heavy industry sectors including petrochemical refineries, nuclear power auxiliary systems, offshore platforms, and large-scale chemical processing plants. Its compact backplane design — with a base unit/module separation architecture — allows high-density I/O configurations in space-constrained control cabinets. The system supports up to 64 modules per station and is rated for operation in ambient temperatures from -30°C to +70°C depending on module variant, making it suitable for harsh industrial environments. The ET 200SP has progressively replaced the ET 200S in new installations and remains the current-generation standard for SIMATIC distributed I/O.

The Evolution of ET 200SP Architecture

The ET 200SP was formally introduced by Siemens in 2013 as the successor to the ET 200S platform. The architectural shift addressed three primary limitations of the ET 200S: module width (ET 200SP base units are narrower), wiring effort (push-in terminal technology replaced screw terminals as standard), and system integration depth with TIA Portal engineering software.

Generation 1 (2013–2016): Initial release focused on standard digital and analog I/O modules with PROFINET interface modules (IM 155-6 PN). Firmware versions were limited in isochronous mode support.

Generation 2 (2016–2019): Introduction of high-feature (HF) module variants with extended diagnostics, motor starter modules (MSS), and the first communication modules including IO-Link master and AS-i modules. The 6ES7137-6EA00-0BA0 (IO-Link Master CM 4xIO-Link) was introduced in this phase.

Generation 3 (2019–present): Expansion into fail-safe (F) modules, OPC UA communication modules, HART analog modules, and energy measurement modules. TIA Portal V16+ introduced advanced module parameterization. Compatibility between generations is maintained at the backplane level, though firmware alignment is required for mixed configurations.

Legacy ET 200S modules (6ES7131-4xxx, 6ES7132-4xxx series) are not physically or electrically compatible with ET 200SP base units. Migration requires full module replacement but retains PROFINET topology.

ET 200SP Full Catalog & Functionalities (SKU List)

Interface Modules (IM)

• 6ES7155-6AU30-0CN0: IM 155-6 PN HF — High-feature PROFINET interface module, supports MRP, isochronous mode, up to 64 modules.
• 6ES7155-6AA01-0BN0: IM 155-6 PN BA — Basic PROFINET interface module, standard diagnostics, cost-optimized.
• 6ES7155-6AU00-0CN0: IM 155-6 PN ST — Standard PROFINET interface, supports PROFINET IRT, media redundancy.
• 6ES7155-5AA00-0AC0: IM 155-5 DP ST — PROFIBUS DP interface module, standard variant, max 244 bytes I/O.

Communication Modules (CM)

• 6ES7137-6EA00-0BA0: CM 4xIO-Link — IO-Link master module, 4 IO-Link ports (Class A/B), supports IO-Link V1.1, max 32 bytes per port.
• 6ES7137-6AA00-0BA0: CM AS-i Master ST — AS-Interface master, supports up to 62 AS-i slaves, 31 standard or 62 A/B slaves.
• 6ES7137-6BD00-0BA0: CM PtP — Point-to-point serial communication module, RS-232/RS-422/RS-485, ASCII/Modbus RTU/USS protocols.
• 6ES7137-6AA00-0BA1: CM AS-i Master HF — High-feature AS-i master with extended diagnostics and safety slave support.

Digital Input Modules (DI)

• 6ES7131-6BF01-0BA0: DI 8x24VDC ST — 8-channel 24 VDC digital input, standard, 3.0 ms input delay.
• 6ES7131-6BH01-0BA0: DI 16x24VDC ST — 16-channel 24 VDC digital input, standard, 3.0 ms input delay.
• 6ES7131-6BF00-0CA0: DI 8x24VDC HF — 8-channel 24 VDC digital input, high-feature, isochronous mode, hardware interrupt.
• 6ES7136-6BA00-0CA0: F-DI 8x24VDC HF — Fail-safe 8-channel digital input, SIL 3 / PLe capable.

Digital Output Modules (DO)

• 6ES7132-6BF01-0BA0: DQ 8x24VDC/0.5A ST — 8-channel 24 VDC digital output, 0.5 A per channel, standard.
• 6ES7132-6BH01-0BA0: DQ 16x24VDC/0.5A ST — 16-channel 24 VDC digital output, standard.
• 6ES7132-6BD20-0BA0: DQ 4x24VDC/2A HF — 4-channel high-current output, 2 A per channel, diagnostics per channel.
• 6ES7136-6DC00-0CA0: F-DQ 4x24VDC/2A PM HF — Fail-safe 4-channel digital output, SIL 3 / PLe, power module integrated.

Analog Input Modules (AI)

• 6ES7134-6GD01-0BA1: AI 4xU/I 2-wire ST — 4-channel analog input, voltage/current, 2-wire transmitter, 16-bit resolution.
• 6ES7134-6HB00-0CA1: AI 4xRTD/TC 2-/3-/4-wire HF — 4-channel RTD/thermocouple input, high-feature, HART-capable variant available.

Analog Output Modules (AO)

• 6ES7135-6GB00-0BA1: AQ 4xU/I ST — 4-channel analog output, voltage/current, 16-bit resolution, standard.
• 6ES7135-6HD00-0BA1: AQ 2xU/I HF — 2-channel analog output, high-feature, HART pass-through, extended diagnostics.

Power / Server Modules

• 6ES7193-6BP00-0DA0: Server Module — Terminates the ET 200SP station, required at end of module row.
• 6ES7193-6PA00-0AA0: PM-E 24VDC ST — Power module for load group separation, 24 VDC, 10 A.

Sourcing Hard-to-Find & Obsolete ET 200SP Parts

While the ET 200SP remains an active product line, early-generation modules — particularly first-release interface modules and initial CM variants — have transitioned to RFQ availability review status as Siemens consolidates firmware versions and hardware revisions. The 6ES7137-6EA00-0BA0 (hardware revision BA0) represents an earlier revision of the IO-Link master; current production ships as revision BA1 or later, which may introduce minor parameterization differences in TIA Portal.

Quality Control for the ET 200SP Range

ET 200SP modules present specific test requirements due to their integrated backplane bus communication (PROFINET/PROFIBUS at the IM level, internal backplane bus at 48 Mbit/s between modules) and the base unit/module interdependency. DriveKNMS applies the following test protocol to all ET 200SP inventory:

• Backplane Bus Integrity Test: Each module is seated in a reference base unit and backplane communication is verified via TIA Portal online diagnostics. Module identity, firmware version, and hardware revision are logged.
• I/O Channel Functional Test: All input channels are stimulated with calibrated signals; all output channels are loaded and measured. For analog modules, linearity and offset error are verified against Siemens published accuracy specifications.
• IO-Link Port Test (CM 4xIO-Link): Each of the 4 IO-Link ports on the 6ES7137-6EA00-0BA0 is tested with a reference IO-Link V1.1 device. Port mode switching (SIO/IO-Link), process data exchange, and ISDU parameter read/write are verified.
• Fail-Safe Module Proof Test: F-modules undergo SIL verification using Siemens STEP 7 Safety / TIA Portal Safety Administration Editor. Safety function response time is measured and compared against module datasheet values.
• Visual and Mechanical Inspection: Connector pins, locking levers, and labeling strips are inspected. Modules with damaged push-in terminals or cracked housings are rejected.