Siemens S7-200 SMART Modules: 6ES7288-3AE04-0AA0 Analog Input Module

Technical Dossier

Product Details And Specifications

Siemens S7-200 SMART Series Technical Notes

The Evolution of S7-200 SMART Architecture

The S7-200 SMART was introduced by Siemens circa 2012 as a direct replacement for the S7-200 (Classic) series, which had been in production since the mid-1990s. The Classic series used the MPI/PPI communication protocol and relied on the STEP 7 Micro/WIN programming environment. The SMART generation introduced PROFINET Ethernet as the primary communication interface, replaced the programming environment with STEP 7 Micro/WIN SMART, and expanded the CPU's onboard I/O capacity.

Architecturally, the S7-200 SMART uses a modular backplane-less design: expansion modules connect via a direct bus connector on the left side of the CPU, forming a daisy-chain up to six expansion modules deep. This design eliminates backplane failure modes common in rack-based systems but requires strict attention to module sequencing and power budgeting. Early firmware revisions (V1.x) had known compatibility constraints with certain EM signal board combinations; V2.x and later resolved most inter-module communication timing issues. Engineers maintaining legacy V1.x CPU installations must verify firmware compatibility before substituting expansion modules from later production batches.

The S7-200 SMART series is currently in its mature/end-of-active-development phase. Siemens has positioned the S7-1200 as the strategic successor for new designs. However, the S7-200 SMART remains in active production and Siemens continues to provide spare parts and firmware support, making lifecycle extension a viable strategy for existing installations through at least 2030.

S7-200 SMART Full Catalog & Functionalities (SKU List)

The following SKUs represent verified, commonly stocked modules within the S7-200 SMART ecosystem, classified by functional category:

CPU Modules (Standard & RELAY Output)

6ES7288-1SR20-0AA0: CPU SR20 — 12 DI / 8 DO relay, 20 I/O onboard, 12KB program memory.
6ES7288-1SR30-0AA0: CPU SR30 — 18 DI / 12 DO relay, 30 I/O onboard, 18KB program memory.
6ES7288-1SR40-0AA0: CPU SR40 — 24 DI / 16 DO relay, 40 I/O onboard, 24KB program memory.
6ES7288-1SR60-0AA0: CPU SR60 — 36 DI / 24 DO relay, 60 I/O onboard, 30KB program memory.
6ES7288-1ST20-0AA0: CPU ST20 — 12 DI / 8 DO transistor (sourcing), 20 I/O onboard.
6ES7288-1ST30-0AA0: CPU ST30 — 18 DI / 12 DO transistor (sourcing), 30 I/O onboard.
6ES7288-1ST40-0AA0: CPU ST40 — 24 DI / 16 DO transistor (sourcing), 40 I/O onboard.
6ES7288-1ST60-0AA0: CPU ST60 — 36 DI / 24 DO transistor (sourcing), 60 I/O onboard.

Digital Input / Output Expansion Modules (EM DI / DO)

6ES7288-2DE08-0AA0: EM DE08 — 8-channel 24VDC digital input expansion module.
6ES7288-2DR08-0AA0: EM DR08 — 8-channel relay digital output expansion module.
6ES7288-2DT08-0AA0: EM DT08 — 8-channel transistor digital output expansion module.
6ES7288-2DR16-0AA0: EM DR16 — 8 DI / 8 DO relay mixed digital I/O expansion module.

Analog Input / Output Expansion Modules (EM AI / AO)

6ES7288-3AE04-0AA0: EM AE04 — 4-channel analog input module; supports ±10V, 0–10V, 0–20mA, 4–20mA; 12-bit resolution; current/voltage selectable per channel via DIP switch.
6ES7288-3AQ02-0AA0: EM AQ02 — 2-channel analog output module; 0–10V / 0–20mA / 4–20mA output; 12-bit resolution.
6ES7288-3AM06-0AA0: EM AM06 — 4 AI / 2 AO mixed analog I/O module; combined input/output for compact panel designs.

Communication & Specialty Modules

6ES7288-5BA01-0AA0: SB CM01 — RS485/RS232 signal board; mounts directly on CPU face; adds serial communication port without consuming expansion slot.
6ES7288-5AE01-0AA0: SB AE01 — 1-channel analog input signal board; 12-bit; mounts on CPU face.
6ES7288-5AQ01-0AA0: SB AQ01 — 1-channel analog output signal board; 12-bit; mounts on CPU face.
6ES7288-5DT04-0AA0: SB DT04 — 2 DI / 2 DO transistor signal board; mounts on CPU face.

Sourcing Hard-to-Find & Obsolete S7-200 SMART Parts

For installations where the S7-200 SMART CPU firmware is locked to a specific expansion module hardware revision, DriveKNMS can source modules by production date code upon request.

Quality Control for the S7-200 SMART Range

All S7-200 SMART modules processed by DriveKNMS undergo a structured inspection and functional verification protocol prior to dispatch:

- Visual inspection: PCB examination for corrosion, burn marks, capacitor bulge, and connector pin integrity. Bus connector pins on expansion modules are inspected under magnification for deformation.
- Power-on test: Module is powered via a calibrated 24VDC bench supply. LED status indicators are verified against Siemens diagnostic specifications.
- Functional I/O test (analog modules): For the 6ES7288-3AE04-0AA0 and similar analog modules, each channel is stimulated with a calibrated signal source (voltage and current modes independently). ADC output values are read via a test CPU and compared against Siemens published accuracy specifications (±0.5% full scale for voltage, ±0.5% for current at 25°C ambient).
- Communication bus verification: Expansion bus connector is tested for correct impedance and signal integrity using a reference CPU in loopback configuration.
- Firmware version logging: Where accessible, CPU module firmware version is recorded and disclosed to the buyer prior to shipment.