Siemens SIMADYN D Modules: 6DD2920-0AR2 6DD2920-OAR2 Supply Sensing Module

Model: 6DD2920-0AR2 6DD2920-OAR2

Brand Siemens
Series SIMADYN D
Model 6DD2920-0AR2 6DD2920-OAR2
RFQ-ready model route Obsolete and surplus sourcing Export follow-up by model list

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Technical Dossier

Product Details And Specifications

Siemens SIMADYN D Series Technical Notes

The Evolution of SIMADYN D Architecture

SIMADYN D was introduced by Siemens in the mid-1980s as the successor to the analog SIMADYN C platform. The system is built around a VMEbus-compatible backplane that supports synchronous data exchange between processor, I/O, and communication modules at cycle times as low as 1 ms. The core CPU modules (PM series) execute function block programs compiled from the STRUC G graphical programming environment.

Early deployments used the PM5 and PM6 processor modules paired with analog I/O boards for drive control. The mid-generation introduced the PM10 and PM21 processors with expanded memory and faster scan rates, enabling more complex multi-axis coordination. Later revisions added PROFIBUS-DP communication adapters (CS31, IM308) to integrate SIMADYN D racks into broader plant networks alongside SIMATIC S5 and S7 systems.

The platform entered its end-of-life phase in the early 2010s. Siemens officially discontinued new hardware production, with the recommended migration path being SINAMICS S120 drive systems combined with SIMATIC S7-400 or S7-1500 controllers. However, the complexity and cost of migration mean that a significant installed base remains in service, creating sustained demand for spare and replacement modules — particularly sensing, power supply, and I/O boards such as the 6DD2920-0AR2.

SIMADYN D Full Catalog & Functionalities (SKU List)

Processor Modules (CPU)

  • 6DD1600-0AK0: PM5 processor module, 80186 CPU, base cycle control unit
  • 6DD1601-0AK0: PM6 processor module, enhanced memory, multi-axis coordination
  • 6DD1602-0AK0: PM10 processor module, 32-bit CPU, fast scan rate execution
  • 6DD1603-0AK0: PM21 processor module, extended RAM, PROFIBUS-ready interface

Analog Input / Output Modules (AI/AO)

  • 6DD1606-0AK0: AM1 analog input module, 8-channel, ±10 V / 4–20 mA
  • 6DD1607-0AK0: AM2 analog output module, 8-channel, ±10 V / 4–20 mA
  • 6DD1608-0AK0: AM3 high-resolution analog I/O, 16-bit resolution

Digital Input / Output Modules (DI/DO)

  • 6DD1610-0AK0: DM1 digital input module, 32-channel, 24 V DC
  • 6DD1611-0AK0: DM2 digital output module, 32-channel, 24 V DC, 0.5 A per channel
  • 6DD1612-0AK0: DM3 combined digital I/O, 16 DI + 16 DO, 24 V DC

Power Supply & Sensing Modules

  • 6DD2920-0AR2 / 6DD2920-OAR2: Supply sensing module; monitors rack power bus voltage and current, provides fault signaling to the backplane supervisory circuit — the subject of this listing
  • 6DD2921-0AA0: Power supply module, 24 V DC input, internal 5 V / 15 V regulation for VMEbus rack
  • 6DD2922-0AA0: Redundant power supply module, hot-swap capable, for high-availability rack configurations

Communication & Interface Modules

  • 6DD1660-0AK0: CS31 communication module, AS-Interface bus master for distributed I/O
  • 6DD1661-0AK0: IM308-C PROFIBUS-DP master module, 12 Mbit/s, up to 125 slaves
  • 6DD1662-0AK0: Ethernet TCP/IP interface module, 10 Mbit/s, for SCADA integration
  • 6DD1663-0AK0: Fiber optic link module, point-to-point rack-to-rack synchronization

Quality Control for the SIMADYN D Range

SIMADYN D modules, particularly backplane-connected power and sensing boards such as the 6DD2920-0AR2, require functional validation beyond visual inspection. DriveKNMS applies the following test protocol to all SIMADYN D units prior to dispatch:

  • Backplane bus continuity check: VMEbus signal integrity verified across all 96-pin connector pins
  • Power rail measurement: 5 V, ±15 V, and 24 V rails measured under load using calibrated bench supply
  • Sensing circuit validation: Output fault signal behavior verified against known-good reference module
  • Thermal cycling: Module operated through 0–55 °C range to identify latent component failures
  • Firmware / configuration retention: EPROM and battery-backed RAM contents verified where applicable
  • Final burn-in: 48-hour continuous operation under nominal load before packaging

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