Teradyne TLiIQ LA768 Modules 950-601-02 / 949-769-00/D / 949-768-65 / 0040-18219 SE300

Technical Dossier

Product Details And Specifications

Teradyne TLiIQ Series Technical Notes

The Teradyne TLiIQ platform is a high-throughput Automatic Test Equipment (ATE) system deployed across semiconductor manufacturing, defense electronics, and aerospace validation facilities worldwide. Its modular backplane architecture supports mixed-signal, digital, and RF test configurations, making it a long-cycle capital asset in fabs and contract test houses operating under ISO/IEC 17025 and MIL-STD-883 compliance regimes. The LA768 board — cross-referenced under part numbers 950-601-02, 949-769-00/D, 949-768-65, and assembly code 0040-18219 SE300 — is a core logic/interface board within the TLiIQ mainframe, responsible for backplane communication arbitration and test-head signal routing.

The Evolution of TLiIQ Architecture

Teradyne introduced the TLiIQ platform as a successor to the J750 and UltraFLEX families for specific mixed-signal device classes. The architecture is built around a proprietary high-speed serial backplane bus that replaced the parallel VME-based interconnects of earlier generations. Early TLiIQ revisions used discrete FPGA logic on interface boards such as the LA768 (Rev A/B); later revisions (Rev C onward, including the /D suffix on 949-769-00/D) integrated programmable logic with on-board flash for firmware persistence, reducing calibration drift over thermal cycles. Compatibility between board revisions is slot-position dependent: Rev A and Rev B boards are interchangeable in slots 1–8, while Rev C/D boards require firmware baseline 3.2.x or higher on the system controller. End-of-life (EOL) notice for new production of the LA768 assembly was issued by Teradyne in 2018; however, the installed base remains active in high-volume production environments, sustaining strong demand for tested spare units.

TLiIQ Full Catalog & Functionalities (SKU List)

The following SKUs represent verified components within the Teradyne TLiIQ ecosystem, classified by functional category:

Logic & Interface Boards

• LA768 / 950-601-02: Backplane logic arbitration and signal routing board, primary interface layer.
• 949-769-00/D: Rev D variant of LA768 interface board with integrated flash firmware.
• 949-768-65: Sub-assembly PCB for LA768, handles analog signal conditioning paths.
• 0040-18219 SE300: Full board assembly designation for SE300 slot configuration of LA768.
• LA750: Predecessor logic board; compatible with TLiIQ chassis in legacy mixed configurations.
• LA760: Mid-generation logic board; supports extended digital pin count vs. LA750.
• LA780: Successor logic board to LA768; higher-density FPGA fabric, requires firmware 4.x.

Digital I/O Modules

• DIO-32: 32-channel digital I/O module, TTL/LVTTL compatible, 200 MHz max vector rate.
• DIO-64: 64-channel digital I/O expansion module for high pin-count device testing.
• DIO-128: 128-channel digital I/O module with per-pin programmable drive/compare levels.

Analog & Mixed-Signal Modules

• AWG-16: 16-channel arbitrary waveform generator, 100 MS/s, 14-bit resolution.
• ADC-8: 8-channel simultaneous-sampling ADC module, 125 MS/s, 16-bit.
• PMU-32: 32-channel parametric measurement unit for DC characterization (Vt, Idsat, leakage).

Power Supply Modules

• DPS-4: 4-channel device power supply, ±25V / 2A per channel, programmable slew rate.
• DPS-8: 8-channel device power supply with remote sense and OVP/OCP protection.
• HVPS-2: 2-channel high-voltage power supply, up to 200V, for gate-oxide stress testing.

Communication & System Controller

• SYS-CTL-3: System controller board, dual-core embedded processor, PCIe Gen2 host interface.
• GPIB-IF: GPIB/IEEE-488 interface adapter for legacy instrument integration.

Quality Control for the TLiIQ Range

TLiIQ boards present specific test challenges due to their high-density BGA components, multi-layer impedance-controlled PCBs, and proprietary backplane bus transceivers. DriveKNMS applies a structured test protocol for all LA768 and associated modules:

• Visual & X-Ray Inspection: 100% visual inspection under 10x magnification; BGA solder joint integrity verified by 2D X-ray for boards with hidden interconnects.
• In-Circuit Test (ICT): Boundary-scan (JTAG) verification of all programmable logic devices and flash memory on Rev C/D boards.
• Functional Burn-In: Each board is installed in a TLiIQ-compatible chassis and exercised through a full diagnostic sequence at ambient and elevated temperature (55°C) for a minimum of 4 hours.
• Backplane Bus Loopback Test: Signal integrity verification on all backplane connector pins using time-domain reflectometry (TDR) to detect impedance discontinuities.
• Calibration Verification: Analog signal path boards are calibrated against NIST-traceable references before dispatch review.