TOKYO ELECTRON TTLA08-13 F-MFC_AI_4 3880-200122-14 PCB Assembly – XC-ES30 Series

Model: TTLA08-13 F-MFC_AI_4, 3880-200122-14 PARTS 3895-120917-14 XC-ES30 / EX1.5C XC-ES30CE BHM6180M-G

Model TTLA08-13 F-MFC_AI_4, 3880-200122-14 PARTS 3895-120917-14 XC-ES30 / EX1.5C XC-ES30CE BHM6180M-G
RFQ-ready model route Obsolete and surplus sourcing Export follow-up by model list

Product Overview

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Commercial Path

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Technical Dossier

Product Details And Specifications

TOKYO ELECTRON TTLA08-13 F-MFC_AI_4 PCB Assembly: Supply Continuity Strategy for Semiconductor Procurement Teams

Procurement Specifications

Brand TOKYO ELECTRON (TEL)
Part Number TTLA08-13
Sub-Assembly Reference F-MFC_AI_4
Assembly P/N 3880-200122-14
Associated Parts 3895-120917-14
Compatible Platforms XC-ES30, EX1.5C, XC-ES30CE, BHM6180M-G
Component Type PCB Assembly (Printed Circuit Board Assembly)
Country of Origin Japan
OEM Status Discontinued / End-of-Life (EOL)
RFQ terms reviewCommercial terms are confirmed during RFQ review based on model, condition, documentation, quantity and destination.
Condition New surplus / Tested used / Refurbished (specify on RFQ)
Condition reviewAvailable condition, photos, test records and documentation are checked before quotation according to the requested model.
Minimum Order Quantity 1 unit

Spare Parts Turnover Rate: For fabs running XC-ES30 or BHM6180M-G platforms at high utilization, industry benchmarks suggest maintaining at least one cold-spare PCB assembly per tool cluster. Procurement teams that defer this decision until failure occurs consistently pay 2–4× the market price under emergency conditions.

Risk Mitigation: We offer blanket order arrangements for clients managing multi-site TEL equipment fleets, enabling price lock-in and priority allocation — a practical hedge against further supply tightening as TEL legacy platforms age out of the installed base.

  • RFQ terms review: Commercial terms are confirmed during RFQ review based on model, condition, documentation, quantity and destination.
  • Export Documentation: Full commercial invoice, packing list, and certificate of origin provided for every shipment. We support HS code classification assistance for customs clearance in EU, US, Southeast Asia, and Middle East markets.
  • Multi-Currency Payment: USD, EUR, CNY, HKD accepted. T/T (wire transfer), PayPal, and LC (letter of credit) available for qualified buyers.
  • Global Logistics: DHL Express, FedEx International Priority, and UPS available. EMS and sea freight for bulk orders. Typical transit: 3–7 business days to major industrial hubs.
  • Packaging: Anti-static ESD packaging with foam cushioning. Suitable for air freight without additional preparation.

Q: How are commercial terms confirmed?
A: Commercial terms are confirmed during RFQ review based on model, quantity, destination, documentation and sourcing route.

Q: How are RFQ terms confirmed?
A: Quantity, required condition, documentation needs, destination and sourcing route are confirmed during RFQ review before quotation.

Q: Can you support multi-unit or repeat RFQ requests?
A: Yes. Send the model list, target quantity and destination so DRIVEKNMS can review sourcing options and quote the requirement as a project RFQ.

Q: Can you source other TEL spare parts?
A: Yes. DriveKNMS specializes in hard-to-find and EOL spare parts for TOKYO ELECTRON, Applied Materials, Lam Research, AMAT, and other major semiconductor equipment OEMs. Submit your full BOM or parts list for a consolidated quote.

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