XINJE XC3 Series Modules

Technical Dossier

Product Details And Specifications

XINJE XC3 Series: Comprehensive Module Range and Technical Overview

The XINJE XC3 series is a compact, high-performance programmable logic controller (PLC) platform developed by Wuxi Xinje Electric Co., Ltd., one of China's leading industrial automation manufacturers. The XC3 series occupies a significant position in light-to-medium industrial automation deployments across chemical processing plants, water treatment facilities, textile machinery, packaging lines, and building automation systems throughout Asia and emerging markets globally.

Characterized by its modular I/O expansion architecture, onboard high-speed pulse outputs, and support for multiple communication protocols (RS-232, RS-485, CANopen), the XC3 series has been widely adopted as a cost-effective alternative to comparable Mitsubishi FX and Siemens S7-200 platforms. Its compact DIN-rail form factor and broad operating temperature range (0–55°C) make it suitable for panel-mounted industrial environments.

The Evolution of XC3 Architecture

The XC3 series represents the third generation of XINJE's XC-family compact PLC platform, succeeding the XC1 and XC2 lines. Early XC1/XC2 units featured fixed I/O configurations with limited expansion capability and RS-232-only communication. The XC3 generation introduced a modular expansion bus, enabling users to attach discrete I/O, analog, and communication expansion modules via a proprietary side-bus connector.

Key architectural milestones in the XC3 lineage include the introduction of onboard 100kHz high-speed counter inputs, support for CANopen master/slave communication, and the integration of Ethernet communication options in later sub-variants (XC3-E suffix models). The XC3 platform reached peak deployment volume in the 2010–2020 period. As of 2024, XINJE has transitioned its primary development focus to the XD and XG series platforms, positioning the XC3 as a mature/legacy series. Existing XC3 installations remain operational across thousands of deployed machines, creating sustained demand for spare parts, replacement CPUs, and I/O expansion modules.

Compatibility note: XC3 expansion modules are not cross-compatible with XC1/XC2 or the newer XD series without hardware adaptation. Firmware versions must be matched to CPU hardware revision when replacing CPU modules.

XC3 Full Catalog & Functionalities (SKU List)

CPU / Main Units

• XC3-14R-E: 14-point CPU unit, 8DI/6DO relay output, RS-232 + RS-485 onboard
• XC3-24R-E: 24-point CPU unit, 14DI/10DO relay output, dual comm ports
• XC3-32R-E: 32-point CPU unit, 18DI/14DO relay output, expandable to 256 I/O
• XC3-48R-E: 48-point CPU unit, 28DI/20DO relay output, high-speed counter support
• XC3-60R-E: 60-point CPU unit, 36DI/24DO relay output, onboard RS-232/RS-485, expandable
• XC3-32T-E: 32-point CPU unit, transistor (NPN) output, 100kHz HSC, pulse output capable
• XC3-48T-E: 48-point CPU unit, transistor output, suited for servo/stepper axis control
• XC3-60T-E: 60-point CPU unit, transistor output, high-speed pulse train output

Digital I/O Expansion Modules

• XC-E8X: 8-point digital input expansion, 24VDC sink/source compatible
• XC-E8YR: 8-point relay output expansion, 2A per point, 250VAC rated
• XC-E8YT: 8-point transistor output expansion, NPN, 0.5A per point
• XC-E16X: 16-point digital input expansion module
• XC-E16YR: 16-point relay output expansion module

Analog I/O Expansion Modules

• XC-E4AD: 4-channel analog input, 0–10V / 4–20mA selectable, 12-bit resolution
• XC-E4DA: 4-channel analog output, 0–10V / 4–20mA, 12-bit resolution
• XC-E2AD2DA: 2-channel analog input + 2-channel analog output combination module

Communication Expansion Modules

• XC-E-CAN: CANopen master/slave communication expansion module
• XC-E-ECAT: EtherCAT communication adapter for XC3 expansion bus

Sourcing Hard-to-Find & Obsolete XC3 Parts

As the XC3 series transitions into its end-of-active-production phase, procurement of specific CPU variants, I/O expansion modules, and communication adapters becomes increasingly difficult through standard distribution channels. XINJE's authorized distributors have progressively reduced XC3 stock in favor of the XD and XG series.

DriveKNMS maintains a dedicated inventory of XC3 series components sourced through verified secondary market channels, including factory-surplus stock, decommissioned equipment recovery, and long-term warehousing partnerships. All units are inspected prior to dispatch. For end-users operating XC3-based machines beyond their original design life, DriveKNMS provides lifecycle extension support including cross-reference advisory (identifying functional equivalents within the XC3 range or compatible XD-series substitutes where applicable), firmware version matching for CPU replacements, and bulk procurement for maintenance contracts.

Quality Control for the XC3 Range

XC3 series modules present specific quality verification challenges due to their integrated backplane bus architecture and mixed relay/transistor output configurations. DriveKNMS applies the following inspection protocol to all XC3 units processed through its facility:

• Power-on functional test: Each CPU unit is powered via regulated 24VDC supply and verified for normal boot sequence, RUN/STOP LED status, and communication port response.
• I/O point verification: All digital input and output points are individually exercised using a dedicated test fixture. Relay output modules are tested for contact resistance (<100mΩ) and coil actuation integrity.
• Communication port test: RS-232 and RS-485 ports are verified using loopback and cross-device communication tests with XINJE's XCPPro programming software.
• Expansion bus integrity check: For CPU units sold with expansion modules, the side-bus connector and inter-module data transfer are verified under simulated I/O load conditions.
• Analog module calibration verification: XC-E4AD and XC-E4DA modules are tested against calibrated reference signals to confirm accuracy within ±0.5% of full scale.
• Visual and mechanical inspection: PCB condition, terminal block integrity, DIN-rail clip function, and label legibility are assessed prior to packaging.