YOKOGAWA FA-M3 F3LX02-1N Interface Module

Technical Dossier

Product Details And Specifications

YOKOGAWA FA-M3 F3LX Series Technical Notes

The YOKOGAWA FA-M3 F3LX series represents a core component family within YOKOGAWA's FA-M3 Range-free Multi-controller platform — one of the most widely deployed programmable automation controller (PAC) architectures in global heavy industry. FA-M3 installations are documented across petrochemical complexes, nuclear power auxiliary systems, LNG terminals, steel rolling mills, and pharmaceutical batch processing facilities. The F3LX sub-series specifically addresses high-density I/O interfacing and inter-module communication, enabling engineers to construct scalable, deterministic control architectures with minimal rack footprint. The platform's modular backplane design allows mixed-function configurations, making it the preferred choice for brownfield upgrades where legacy signal types must coexist with modern fieldbus protocols.

The Evolution of FA-M3 F3LX Architecture

YOKOGAWA introduced the FA-M3 platform in the mid-1990s as a successor to its earlier YEWCOM and FA500 controller families. The F3LX interface module lineage evolved through three distinct generations. The first generation (F3LX01/F3LX02) established the foundational backplane communication protocol using a proprietary high-speed bus operating at deterministic scan cycles, compatible with F3SP-series CPU modules. The second generation introduced enhanced noise immunity ratings and extended operating temperature ranges to meet IEC 61131-2 environmental classifications for industrial enclosures. The third generation, represented by current production variants, added support for redundant power bus configurations and improved EMC compliance to EN 61000-4 standards.

Compatibility across generations is a critical engineering consideration. F3LX modules use a standardized 32-pin DIN backplane connector, but bus protocol versions differ between early F3SP21/F3SP25 CPUs and later F3SP66/F3SP67 high-performance CPUs. Engineers performing system expansions must verify CPU firmware revision against the F3LX module hardware revision table published in YOKOGAWA Technical Manual IM 34M06H11-01E. Mixing incompatible revisions results in bus initialization faults logged as error code E1xx on the CPU front panel.

FA-M3 F3LX Full Catalog & Functionalities (SKU List)

The following SKUs represent verified, commonly stocked modules within the YOKOGAWA FA-M3 F3LX and associated interface/expansion module range. Each entry reflects the module's primary functional role within a configured FA-M3 rack assembly.

F3LX02-1N: Expansion I/O interface module; connects remote I/O sub-racks to main CPU rack via dedicated expansion bus, supports up to 8 sub-rack connections.
F3LX01-1N: Base expansion interface module; earlier revision of F3LX02-1N with reduced sub-rack addressing capacity, compatible with F3SP21/F3SP25 CPUs.
F3LX04-1N: High-speed expansion interface; supports faster bus cycle for time-critical I/O applications in motion and press control.
F3SP66-4S: High-performance CPU module; 32-bit RISC processor, 256K step program memory, supports structured text and ladder logic per IEC 61131-3.
F3SP67-6S: Top-tier CPU module; dual-port Ethernet, built-in function block library for PID and advanced control loops.
F3SP28-3N: Standard CPU module; entry-level processing for small to mid-scale FA-M3 configurations.
F3SP35-5N: Mid-range CPU module; expanded I/O point capacity, suitable for batch process control.
F3AD04-1N: 4-channel analog input module; 4–20 mA / 1–5 V DC, 12-bit resolution, individual channel isolation.
F3AD08-1N: 8-channel analog input module; high-density analog acquisition for process variable monitoring.
F3DA04-1N: 4-channel analog output module; 4–20 mA current output, used for valve positioner and VFD setpoint control.
F3DI32-1N: 32-point digital input module; 24 V DC sink/source compatible, high-density discrete signal acquisition.
F3DO32-1N: 32-point digital output module; transistor output, 24 V DC / 0.1 A per point, for solenoid and relay driving.
F3YP24-1N: 24-point relay output module; dry contact outputs rated 2 A / 250 V AC, for motor starter and alarm annunciator circuits.
F3NC96-0N: PROFIBUS-DP communication module; master/slave configurable, supports up to 96 I/O bytes per scan.
F3LE01-5T: Ethernet communication module; 10/100BASE-TX, Modbus TCP and YOKOGAWA proprietary protocol support.
F3PU20-0S: Power supply module; 24 V DC input, 5 A output, for standard FA-M3 base unit power rail.
F3BU04-1N: 4-slot base unit; compact rack for small system configurations or remote sub-rack expansion nodes.
F3BU16-1N: 16-slot base unit; maximum-density rack for centralized I/O consolidation.

Sourcing Hard-to-Find & Obsolete FA-M3 F3LX Parts

YOKOGAWA has transitioned portions of the FA-M3 F3LX module range to limited-availability or end-of-active-production status. Modules including F3LX01-1N and early-revision F3SP28-series CPUs are no longer manufactured but remain in active service across installed base systems with operational lifespans extending to 2035 and beyond in regulated industries where control system replacement requires full safety re-validation.

Quality Control for the FA-M3 F3LX Range

FA-M3 F3LX interface modules present specific test challenges due to their role as the communication bridge between the CPU backplane bus and remote I/O sub-racks. DriveKNMS applies a structured verification protocol to all F3LX units prior to dispatch:

Backplane Bus Integrity Test: Each module is seated in a live FA-M3 test rack populated with F3SP-series CPU and representative I/O modules. Bus initialization sequence is monitored for error-free completion within the specified 500 ms power-on timeout window.
Sub-Rack Link Verification: F3LX02-1N units are tested with a connected sub-rack to confirm full address mapping and cyclic data exchange at rated bus speed.
Connector Pin Inspection: All 32-pin backplane connector pins are inspected under 10× magnification for oxidation, mechanical deformation, and solder joint integrity.
Thermal Cycling: Modules are subjected to a 0°C to 55°C thermal cycle to verify component stability across the rated operating range per IEC 61131-2 Class 3.
Firmware Revision Logging: Hardware revision markings are recorded and cross-referenced against YOKOGAWA compatibility matrices before dispatch review documentation is issued.