Tokyo Electron 2986 Series Modules | TEL 2986-411806-11
Tokyo Electron (TEL) 2986 Series: Comprehensive Module Range and Technical Overview The Tokyo Electron (TEL) 2986 Series represents a core…
Model: TTLA08-13 F-MFC_AI_4, 3880-200122-14 PARTS 3895-120917-14 XC-ES30 / EX1.5C XC-ES30CE BHM6180M-G
Product Overview
Commercial availability is handled through direct RFQ, model verification and export-oriented follow-up rather than public cart checkout.
Datasheet Preview
Use attached product manuals when available. If the manual is not public yet, request the full file directly through RFQ.
Commercial Path
Product pages on DRIVEKNMS are designed to verify model, brand and series first, then move the buyer into one clean quotation path.
Technical Dossier
The TOKYO ELECTRON (TEL) TTLA08-13 F-MFC_AI_4 PCB Assembly — cross-referenced as 3880-200122-14, with associated parts 3895-120917-14, and compatible with XC-ES30 / EX1.5C, XC-ES30CE, and BHM6180M-G platforms — is a critical control board used in TEL semiconductor and flat panel display (FPD) processing equipment. As TEL progressively phases out legacy platform support, this part has transitioned into a scarce-supply category. Procurement managers sourcing this component face a narrowing window: OEM channels are increasingly unreliable, lead times from authorized distributors stretch beyond 16–26 weeks, and unplanned downtime on a single CVD or etch tool can cost upward of $50,000 USD per day in lost wafer output.
DriveKNMS maintains an active sourcing network for end-of-life and hard-to-find TEL spare parts. Our inventory intelligence covers surplus channels, decommissioned fab equipment, and certified refurbishment pipelines — giving your maintenance team a credible alternative when OEM stock is exhausted.
| Brand | TOKYO ELECTRON (TEL) |
| Part Number | TTLA08-13 |
| Sub-Assembly Reference | F-MFC_AI_4 |
| Assembly P/N | 3880-200122-14 |
| Associated Parts | 3895-120917-14 |
| Compatible Platforms | XC-ES30, EX1.5C, XC-ES30CE, BHM6180M-G |
| Component Type | PCB Assembly (Printed Circuit Board Assembly) |
| Country of Origin | Japan |
| OEM Status | Discontinued / End-of-Life (EOL) |
| Inventory Status | Subject to availability — contact for real-time stock confirmation |
| Lead Time | Typically 3–10 business days (subject to sourcing confirmation) |
| Condition | New surplus / Tested used / Refurbished (specify on RFQ) |
| Warranty | 12 months from date of shipment |
| Minimum Order Quantity | 1 unit |
When evaluating the total cost of ownership (TCO) for a legacy TEL platform, the PCB assembly is rarely the largest line item — but it is often the highest-risk one. A single failed TTLA08-13 board that cannot be sourced within 48–72 hours can trigger a cascade: tool downtime, wafer scrap, missed delivery commitments, and emergency freight costs that dwarf the component price itself.
Spare Parts Turnover Rate: For fabs running XC-ES30 or BHM6180M-G platforms at high utilization, industry benchmarks suggest maintaining at least one cold-spare PCB assembly per tool cluster. Procurement teams that defer this decision until failure occurs consistently pay 2–4× the market price under emergency conditions.
DriveKNMS Cost Advantage: By sourcing through our surplus and refurbishment network rather than OEM spot-buy channels, clients typically achieve 30–60% cost reduction versus list price — without compromising functional reliability. All units undergo functional verification before shipment. We provide itemized cost breakdowns on request, supporting your internal capex/opex justification process.
Risk Mitigation: We offer blanket order arrangements for clients managing multi-site TEL equipment fleets, enabling price lock-in and priority allocation — a practical hedge against further supply tightening as TEL legacy platforms age out of the installed base.
Sourcing Network Depth: We maintain relationships with decommissioned fab equipment dealers, authorized surplus distributors, and certified repair centers across Japan, Taiwan, South Korea, and Europe — the primary secondary markets for TEL spare parts.
Part Number Verification: Cross-referencing errors on TEL assemblies are common due to multi-revision part numbering. Our technical team verifies compatibility against your equipment serial number and revision level before shipment — reducing the risk of receiving an incompatible board revision.
Financial Compliance: We issue VAT-compliant invoices, support third-party inspection (SGS, BV) on request, and can provide end-user certificates for export-controlled components where applicable.
Q: What payment terms are available?
A: We accept 100% T/T in advance for standard orders. For repeat customers and qualified enterprises, we offer Net 30 or 50% deposit / 50% before shipment terms. LC at sight is available for orders above USD 10,000.
Q: What does the 12-month warranty cover?
A: The warranty covers functional failure under normal operating conditions. Physical damage caused by installation error or electrical overstress is excluded. Warranty claims are handled via RMA — we arrange return freight for confirmed defective units.
Q: Are volume discounts available?
A: Yes. Quantity pricing is available for orders of 3+ units. Blanket orders with scheduled releases qualify for additional discounts and priority stock allocation. Contact us with your annual demand forecast for a framework agreement proposal.
Q: What is your return policy?
A: Returns are accepted within 30 days of receipt for units that are unused and in original packaging, or for units confirmed defective under warranty. We do not accept returns for buyer's remorse on confirmed-compatible parts.
Q: Can you source other TEL spare parts?
A: Yes. DriveKNMS specializes in hard-to-find and EOL spare parts for TOKYO ELECTRON, Applied Materials, Lam Research, AMAT, and other major semiconductor equipment OEMs. Submit your full BOM or parts list for a consolidated quote.