ABB H&B Contronic LZ Series Modules LZ02

Technical Dossier

Product Details And Specifications

ABB H&B Contronic LZ Series Technical Notes

The Evolution of H&B Contronic LZ Architecture

The Contronic LZ platform was introduced by Hartmann & Braun in the late 1970s as a modular, rack-mounted process control system designed to replace hardwired relay logic in large-scale continuous process plants. The architecture is built around a parallel backplane bus that supports hot-swappable I/O modules, a central processing unit with deterministic cycle times, and a proprietary communication layer for inter-rack data exchange.

Early LZ variants (LZ01, LZ02) established the core signal processing and logic execution framework. Mid-generation modules (LZ03, LZ04, LZ05) expanded analog input density and introduced enhanced diagnostics. Later additions (LZ06 through LZ12) addressed communication gateway requirements as fieldbus standards (PROFIBUS, HART) emerged. Following ABB's acquisition, engineering support transitioned to ABB's Process Automation division, and the platform entered a managed end-of-life phase. No direct firmware-compatible successor exists within the ABB 800xA family without hardware migration; consequently, the installed base continues to rely on original LZ-series hardware for system integrity.

Compatibility note: LZ-series modules are not electrically or logically interchangeable with ABB Advant, MOD 300, or Symphony Plus platforms. Backplane bus voltage, addressing scheme, and module form factor are specific to the Contronic LZ rack system.

H&B Contronic LZ Full Catalog & Functionalities (SKU List)

Controller & CPU Modules

• LZ02: Central logic processing unit; executes control algorithms and manages backplane I/O scan cycle.
• LZ01: First-generation CPU module; predecessor to LZ02 with reduced memory capacity and slower scan rate.
• LZ03: Enhanced CPU with expanded program memory and dual-port RAM for redundant configuration.
• LZ04: Redundancy coordinator module; manages CPU switchover in hot-standby controller pairs.

Analog Input (AI) Modules

• LZ05: 8-channel analog input, 4–20 mA, 12-bit resolution; standard process variable acquisition.
• LZ06: 16-channel analog input with multiplexed scanning; high-density temperature and pressure measurement.
• LZ07: Thermocouple input module, 8 channels; supports J, K, T, E type with cold junction compensation.
• LZ08: RTD input module, 4-channel; Pt100/Pt1000 compatible, 3-wire configuration.

Analog Output (AO) Modules

• LZ09: 4-channel analog output, 4–20 mA; drives control valves and variable-speed drives.
• LZ10: 8-channel analog output with loop diagnostics; detects open-loop and short-circuit faults.

Digital Input (DI) Modules

• LZ11: 16-channel digital input, 24 VDC; status acquisition for switches, contactors, and limit switches.
• LZ12: 32-channel digital input, 24 VDC; high-density discrete signal acquisition for large I/O counts.
• LZ13: Digital input module with pulse counting; supports flow totalizers and encoder feedback.

Digital Output (DO) Modules

• LZ14: 16-channel digital output, 24 VDC, 0.5 A per channel; solenoid valve and relay coil actuation.
• LZ15: 8-channel relay output module, SPDT contacts; rated 230 VAC / 2 A for motor starter and alarm circuits.

Communication & Gateway Modules

• LZ16: Serial communication module; RS-232/RS-485 interface for historian and SCADA connectivity.
• LZ17: PROFIBUS DP slave adapter; bridges Contronic LZ backplane to PROFIBUS field device networks.

Power Supply Modules

• LZ18: 24 VDC rack power supply, 10 A; primary power source for standard LZ I/O racks.
• LZ19: Redundant power supply module; provides N+1 power redundancy with automatic failover and fault alarm.

Quality Control for the H&B Contronic LZ Range

The Contronic LZ backplane uses a parallel bus architecture with address-decoded module slots. Quality verification for LZ modules requires rack-level functional testing rather than component-level bench testing alone. DriveKNMS applies the following test protocol to all LZ-series modules prior to shipment:

• Visual inspection: PCB condition, connector pin integrity, capacitor condition, and conformal coating assessment.
• Backplane insertion test: Module is seated in a live LZ test rack to verify bus communication, address recognition, and power rail draw within specification.
• Signal-level verification: For AI/AO modules, input and output channels are exercised across the full engineering range (0–20 mA / 1–5 V) and linearity is confirmed against factory tolerance.
• Digital I/O channel test: All DI/DO channels are individually toggled and verified for correct state reporting on the backplane data bus.
• Burn-in cycle: Modules are operated under load for a minimum of 24 hours to screen for latent component failures.
• Final documentation: Test results are recorded per module serial number and included with shipment.