ADLINK PC RK-610 Series Modules HPC1-14S7U COMPLEX FG 73727 9800035476 RH-14D-2702-E050AL-SP(N)

Technical Dossier

Product Details And Specifications

ADLINK PC RK-610 Series Technical Notes

The Evolution of PC RK-610 Series Architecture

The RK-610 platform was developed by ADLINK Technology (Taiwan) as part of its CompactPCI and proprietary rack-mount controller lineage. Early revisions of the RK-610 chassis utilized passive backplane designs compatible with 3U and 6U form-factor processor boards, supporting Intel x86 CPU generations from Pentium III through Core 2 Duo. The HPC1-14S7U complex board — identified by part numbers such as FG 73727 / 9800035476 and board revision codes RH-14D-2702-E050AL-SP(N) — represents a mature mid-generation CPU carrier integrating onboard memory slots, PCIe/PCI bridge logic, and multi-port I/O headers within a single complex module.

As the platform matured, ADLINK introduced enhanced variants with expanded RAM support (up to DDR3), dual GbE ports, and updated chipsets to address Windows Embedded Standard 7 and Linux RTOS compatibility requirements. Compatibility between early-generation backplanes and later CPU modules requires verification of bus voltage rails and slot keying. Systems integrators maintaining legacy RK-610 installations must account for BIOS version dependencies when substituting CPU modules across hardware revisions. The platform has entered the mature/end-of-life phase; ADLINK's current equivalent platforms include the MXC-6300 and MXE-5400 series, though direct module interchangeability is not guaranteed.

PC RK-610 Series Full Catalog & Functionalities (SKU List)

The following SKUs represent verified components associated with the ADLINK PC RK-610 Series platform, classified by functional category:

CPU / Controller Complex Modules

• HPC1-14S7U COMPLEX FG 73727 / 9800035476 RH-14D-2702-E050AL-SP(N): Rack-mount CPU complex board; Intel Core architecture; integrated PCIe bridge and multi-I/O header array.
• HPC1-12S5U: Earlier-generation CPU carrier; Intel Pentium M / Core Solo platform; 3U rack-mount form factor.
• HPC1-16S9U: Extended CPU complex with dual-channel DDR3 support; enhanced thermal management for 24/7 industrial operation.
• RK-610-CPU-C2D: Core 2 Duo processor module; compatible with RK-610 6U passive backplane; dual GbE onboard.
• RK-610-CPU-ATM: Intel Atom-based low-power CPU module; fanless thermal design; suited for space-constrained rack bays.

I/O Modules

• RK-610-DIO-32: 32-channel digital I/O module; optically isolated inputs and outputs; 24 VDC field wiring compatible.
• RK-610-AIO-16: 16-channel analog I/O module; 16-bit resolution; ±10 V / 4–20 mA configurable per channel.
• RK-610-DI-64: 64-channel digital input module; high-density field termination; suitable for valve position feedback arrays.
• RK-610-DO-32R: 32-channel relay output module; Form C contacts; rated 250 VAC / 2 A per channel.
• RK-610-AI-8T: 8-channel thermocouple input module; supports J, K, T, E, R, S, B type sensors; cold junction compensation onboard.

Communication & Network Adapter Modules

• RK-610-COM-4S: 4-port serial communication module; RS-232/422/485 software-selectable; supports Modbus RTU and proprietary protocols.
• RK-610-PNET: PROFINET IO device adapter; 100 Mbps; integrates RK-610 I/O into Siemens TIA Portal-managed networks.
• RK-610-DNET: DeviceNet slave adapter; CAN-based fieldbus; compatible with Allen-Bradley ControlLogix scanner modules.
• RK-610-ETH-GBE: Dual-port Gigabit Ethernet expansion module; supports VLAN tagging and IEEE 1588 PTP time synchronization.

Power Supply Modules

• RK-610-PSU-150W: 150 W rack-mount power supply; 85–264 VAC wide-range input; +5 V / +12 V / +3.3 V regulated outputs; hot-swap capable.
• RK-610-PSU-300W: 300 W redundant power module; N+1 configuration support; active current sharing; suitable for fully populated 14-slot chassis.

Quality Control for the PC RK-610 Series Range

The RK-610 platform's multi-layer backplane and high-density bus interconnects require a structured test protocol beyond standard power-on verification. DriveKNMS applies the following procedures to all RK-610 series modules prior to dispatch:

• Backplane Bus Integrity Test: Each CPU complex and I/O module is seated in a reference RK-610 chassis and subjected to full backplane signal continuity verification across all bus lanes (PCI, PCIe, power rails).
• Functional I/O Verification: Digital and analog I/O modules are tested under load using calibrated signal sources; channel-by-channel pass/fail results are logged.
• Thermal Stress Cycling: CPU modules undergo 4-hour burn-in at 55°C ambient to screen for latent component failures.
• Communication Protocol Handshake Test: Serial and fieldbus adapter modules are verified for correct protocol framing using protocol analyzers (Modbus, PROFINET, DeviceNet).
• Visual and Physical Inspection: All boards inspected for capacitor condition, connector pin integrity, conformal coating status, and absence of corrosion or mechanical damage.