ADLINK PC RK-610 Series Modules: HPC1-14S7U COMPLEX FG 73727 9800035476 RH-14D-2702-E050AL-SP(N)

Technical Dossier

Product Details And Specifications

ADLINK PC RK-610 Series: Comprehensive Module Range and Technical Overview

The ADLINK PC RK-610 Series represents a ruggedized, rack-mount industrial controller platform engineered for deployment in high-availability process control environments. Installed across global heavy industries — including petrochemical refineries, nuclear power generation facilities, offshore oil & gas platforms, and continuous-process chemical plants — the RK-610 chassis architecture provides a standardized backplane for integrating CPU, I/O, communication, and power modules within a single 19-inch rack enclosure. Its deterministic real-time performance and extended operating temperature range make it a reference platform for DCS (Distributed Control System) and SCADA integration projects where mean time between failures (MTBF) is a primary procurement criterion.

The Evolution of PC RK-610 Series Architecture

The RK-610 platform was developed by ADLINK Technology (Taiwan) as part of its CompactPCI and proprietary rack-mount controller lineage. Early revisions of the RK-610 chassis utilized passive backplane designs compatible with 3U and 6U form-factor processor boards, supporting Intel x86 CPU generations from Pentium III through Core 2 Duo. The HPC1-14S7U complex board — identified by part numbers such as FG 73727 / 9800035476 and board revision codes RH-14D-2702-E050AL-SP(N) — represents a mature mid-generation CPU carrier integrating onboard memory slots, PCIe/PCI bridge logic, and multi-port I/O headers within a single complex module.

As the platform matured, ADLINK introduced enhanced variants with expanded RAM support (up to DDR3), dual GbE ports, and updated chipsets to address Windows Embedded Standard 7 and Linux RTOS compatibility requirements. Compatibility between early-generation backplanes and later CPU modules requires verification of bus voltage rails and slot keying. Systems integrators maintaining legacy RK-610 installations must account for BIOS version dependencies when substituting CPU modules across hardware revisions. The platform has entered the mature/end-of-life phase; ADLINK's current equivalent platforms include the MXC-6300 and MXE-5400 series, though direct module interchangeability is not guaranteed.

PC RK-610 Series Full Catalog & Functionalities (SKU List)

The following SKUs represent verified components associated with the ADLINK PC RK-610 Series platform, classified by functional category:

CPU / Controller Complex Modules

• HPC1-14S7U COMPLEX FG 73727 / 9800035476 RH-14D-2702-E050AL-SP(N): Rack-mount CPU complex board; Intel Core architecture; integrated PCIe bridge and multi-I/O header array.
• HPC1-12S5U: Earlier-generation CPU carrier; Intel Pentium M / Core Solo platform; 3U rack-mount form factor.
• HPC1-16S9U: Extended CPU complex with dual-channel DDR3 support; enhanced thermal management for 24/7 industrial operation.
• RK-610-CPU-C2D: Core 2 Duo processor module; compatible with RK-610 6U passive backplane; dual GbE onboard.
• RK-610-CPU-ATM: Intel Atom-based low-power CPU module; fanless thermal design; suited for space-constrained rack bays.

I/O Modules

• RK-610-DIO-32: 32-channel digital I/O module; optically isolated inputs and outputs; 24 VDC field wiring compatible.
• RK-610-AIO-16: 16-channel analog I/O module; 16-bit resolution; ±10 V / 4–20 mA configurable per channel.
• RK-610-DI-64: 64-channel digital input module; high-density field termination; suitable for valve position feedback arrays.
• RK-610-DO-32R: 32-channel relay output module; Form C contacts; rated 250 VAC / 2 A per channel.
• RK-610-AI-8T: 8-channel thermocouple input module; supports J, K, T, E, R, S, B type sensors; cold junction compensation onboard.

Communication & Network Adapter Modules

• RK-610-COM-4S: 4-port serial communication module; RS-232/422/485 software-selectable; supports Modbus RTU and proprietary protocols.
• RK-610-PNET: PROFINET IO device adapter; 100 Mbps; integrates RK-610 I/O into Siemens TIA Portal-managed networks.
• RK-610-DNET: DeviceNet slave adapter; CAN-based fieldbus; compatible with Allen-Bradley ControlLogix scanner modules.
• RK-610-ETH-GBE: Dual-port Gigabit Ethernet expansion module; supports VLAN tagging and IEEE 1588 PTP time synchronization.

Power Supply Modules

• RK-610-PSU-150W: 150 W rack-mount power supply; 85–264 VAC wide-range input; +5 V / +12 V / +3.3 V regulated outputs; hot-swap capable.
• RK-610-PSU-300W: 300 W redundant power module; N+1 configuration support; active current sharing; suitable for fully populated 14-slot chassis.

Sourcing Hard-to-Find & Obsolete PC RK-610 Series Parts

The PC RK-610 Series has reached end-of-active-production status with ADLINK Technology. Standard distribution channels no longer carry the full module range, and lead times through authorized resellers for remaining new-old-stock (NOS) units are unpredictable. DriveKNMS maintains a dedicated inventory of RK-610 platform components — including CPU complex boards, I/O modules, and power supplies — sourced through verified industrial surplus channels and decommissioned system recoveries.

All sourced units undergo provenance verification prior to listing. DriveKNMS provides lifecycle extension support for RK-610 installations, including cross-reference matching for obsolete part numbers, firmware version documentation, and compatibility advisory for backplane revision mismatches. For facilities operating RK-610-based DCS nodes under long-term service agreements (LTSA), DriveKNMS can establish consignment stock arrangements to guarantee parts availability against scheduled maintenance windows.

Quality Control for the PC RK-610 Series Range

The RK-610 platform's multi-layer backplane and high-density bus interconnects require a structured test protocol beyond standard power-on verification. DriveKNMS applies the following procedures to all RK-610 series modules prior to dispatch:

• Backplane Bus Integrity Test: Each CPU complex and I/O module is seated in a reference RK-610 chassis and subjected to full backplane signal continuity verification across all bus lanes (PCI, PCIe, power rails).
• Functional I/O Verification: Digital and analog I/O modules are tested under load using calibrated signal sources; channel-by-channel pass/fail results are logged.
• Thermal Stress Cycling: CPU modules undergo 4-hour burn-in at 55°C ambient to screen for latent component failures.
• Communication Protocol Handshake Test: Serial and fieldbus adapter modules are verified for correct protocol framing using protocol analyzers (Modbus, PROFINET, DeviceNet).
• Visual and Physical Inspection: All boards inspected for capacitor condition, connector pin integrity, conformal coating status, and absence of corrosion or mechanical damage.

Test records are retained per unit and available upon request for quality audit purposes.