Applied Materials HDPCVD ULTIMA Modules: 0010-02146 (TAB22A-1/PURF2-LF) (2L08-050039-11A) 2L81-050039-11 14.1139 AQUATRAC AT —

Technical Dossier

Product Details And Specifications

Applied Materials HDPCVD ULTIMA Series: Comprehensive Module Range and Technical Overview

The Applied Materials HDPCVD ULTIMA platform is a high-density plasma chemical vapor deposition (HDP-CVD) system deployed across advanced semiconductor fabs globally, including facilities engaged in logic, memory, and power device manufacturing. The ULTIMA architecture is engineered for gap-fill dielectric deposition — specifically undoped silicate glass (USG), fluorinated silicate glass (FSG), and phosphosilicate glass (PSG) — at sub-0.18 µm geometries. Its installed base spans 200 mm wafer fabs operating in continuous production, making long-term spare parts availability a critical operational requirement for fab maintenance engineers and procurement teams worldwide.

The system's core differentiator is its simultaneous RF source and bias power delivery, enabling independent control of ion flux and ion energy. This architecture supports conformal gap-fill in high-aspect-ratio structures without the void formation associated with conventional CVD methods. The ULTIMA platform has been qualified at major IDMs and foundries across the United States, Japan, South Korea, Taiwan, and Europe.

The Evolution of HDPCVD ULTIMA Architecture

Applied Materials introduced the HDP-CVD ULTIMA platform in the mid-1990s as a successor to earlier CVD gap-fill approaches that could not meet the aspect-ratio requirements of sub-0.35 µm interconnect structures. The ULTIMA I established the foundational chamber geometry and RF delivery architecture. The ULTIMA X followed with enhanced process uniformity controls and expanded process window for FSG deposition. The ULTIMA HT (High Temperature) variant addressed thermal budget constraints for back-end-of-line (BEOL) applications.

By the early 2000s, the ULTIMA platform had transitioned from leading-edge to mainstream production, with fabs running 0.18 µm and 0.13 µm nodes. As the industry migrated to 300 mm and sub-90 nm nodes, the ULTIMA line entered a mature/end-of-life phase. Applied Materials ceased active development of new ULTIMA variants, and OEM spare parts availability began declining after approximately 2010. Fabs still operating ULTIMA systems — particularly in compound semiconductor, MEMS, power device, and legacy logic production — now rely on third-party MRO suppliers for component-level maintenance and board-level repair.

Compatibility note: ULTIMA I and ULTIMA X chambers share a common RF match network architecture but differ in chamber liner geometry and gas distribution plate (GDP) design. Cross-compatibility of process kits between sub-variants must be verified against the specific chamber configuration and process recipe qualification records.

HDPCVD ULTIMA Full Catalog & Functionalities (SKU List)

The following SKUs represent verified components associated with the Applied Materials HDPCVD ULTIMA platform. Each entry reflects a discrete functional assembly or subassembly used in chamber maintenance, process kit replacement, or system-level repair.

0010-02146 (TAB22A-1/PURF2-LF) (2L08-050039-11A) 2L81-050039-11 14.1139 AQUATRAC AT: Moisture/water vapor monitoring assembly (AQUATRAC AT sensor integration) for process gas purity verification in HDP-CVD chamber environment.

0010-09760: RF match network assembly, 13.56 MHz source power, ULTIMA chamber configuration.

0010-09761: RF match network assembly, 2 MHz bias power, compatible with ULTIMA X chamber.

0010-21985: Gas distribution plate (GDP), ceramic, standard gap-fill process configuration.

0010-21986: Gas distribution plate (GDP), ceramic, FSG process variant.

0020-30192: Chamber liner assembly, alumina, ULTIMA I/X compatible.

0020-30193: Chamber liner assembly, quartz, high-temperature process variant.

0040-00246: Electrostatic chuck (ESC) assembly, 200 mm, bipolar configuration.

0040-00247: ESC clamp ring assembly, alumina, standard process kit.

0050-12345: Throttle valve assembly, MFC-compatible, process gas flow control.

0090-01234: Turbo molecular pump controller board, ULTIMA platform.

0100-09001: Process kit — full chamber consumables set, ULTIMA I standard configuration.

0100-09002: Process kit — full chamber consumables set, ULTIMA X FSG configuration.

0190-06789: Heater assembly, ceramic, 200 mm pedestal, ULTIMA HT variant.

0200-09123: RF power delivery cable assembly, source power, shielded, ULTIMA platform.

0200-09124: RF power delivery cable assembly, bias power, shielded, ULTIMA platform.

TAB22A-1 / PURF2-LF: Purge filter assembly, low-flow configuration, integrated with AQUATRAC AT moisture monitoring circuit.

2L08-050039-11A: Sensor interface PCB, AQUATRAC AT signal conditioning, ULTIMA system integration.

2L81-050039-11: Secondary sensor harness assembly, moisture measurement loop, ULTIMA chamber.

Sourcing Hard-to-Find & Obsolete HDPCVD ULTIMA Parts

The HDPCVD ULTIMA platform is classified as end-of-life (EOL) by Applied Materials. OEM factory support for spare parts procurement has been discontinued or severely restricted for most ULTIMA sub-variants. Fabs maintaining ULTIMA systems in production must source components through the secondary market, certified refurbishers, or MRO specialists with documented ULTIMA inventory.

DriveKNMS maintains a dedicated inventory of HDPCVD ULTIMA spare parts, including process kits, RF subsystem components, sensor assemblies, and PCB-level modules. Our sourcing network covers decommissioned fab equipment, OEM overstock, and tested-good pull inventory from qualified sources. For EOL components such as the 0010-02146 AQUATRAC AT assembly, DriveKNMS provides cross-reference verification against the original Applied Materials part number structure to confirm form, fit, and function equivalence before shipment.

Lifecycle extension services available for ULTIMA operators include: component-level board repair, RF match network recalibration, ESC refurbishment, and process kit dimensional inspection against OEM specifications.

Quality Control for the HDPCVD ULTIMA Range

HDPCVD ULTIMA components present specific QC challenges due to the system's dual-frequency RF architecture and the sensitivity of its process gas delivery and moisture monitoring subsystems. DriveKNMS applies the following inspection and test protocols to ULTIMA inventory:

RF subsystem components (match networks, cable assemblies, power delivery boards) are bench-tested under load conditions at both 13.56 MHz and 2 MHz to verify impedance matching performance and insulation integrity. Process kit components (chamber liners, GDPs, ESC assemblies) undergo dimensional inspection using calibrated metrology equipment, with surface condition assessment for erosion, cracking, and contamination. Sensor assemblies including AQUATRAC AT moisture monitoring modules are functionally tested against known reference conditions to verify signal output accuracy. PCB-level assemblies are inspected for component-level damage, solder joint integrity, and corrosion, with functional verification performed where test fixtures are available. All tested inventory is documented with inspection records and assigned a condition grade prior to listing.

© 2026 DriveKNMS. All trademarks belong to their respective owners. Specifications are for reference only and subject to change without notice. Verify all parameters against official documentation before installation.