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Model: 0041-56777 FCSP7302DW2-T5-4CC2-F30E/HF-H3D12 02-298156-00
Product Overview
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Technical Dossier
The Applied Materials FCSP7302DW2 series represents a family of precision-engineered faceplate and RF cap assemblies deployed across Applied Materials CVD, PVD, and etch process chambers in high-volume semiconductor fabrication environments. These components are integral to chamber integrity, RF power delivery, and process gas distribution in facilities operating 200mm and 300mm wafer platforms. Installed base spans leading fabs in the United States, South Korea, Taiwan, Japan, and China, including facilities running Applied Materials Centura, Endura, and Producer platforms. The series is classified as a consumable-to-semi-consumable component with replacement cycles driven by RF exposure hours, plasma erosion rates, and scheduled preventive maintenance intervals. Given the capital intensity of semiconductor fabs and the cost of unplanned downtime, maintaining a qualified spare parts inventory for the FCSP7302DW2 series is a standard operational requirement for equipment engineers and procurement teams.
The FCSP7302DW2 designation identifies a sub-family of faceplate assemblies within Applied Materials' broader chamber component architecture. Early-generation faceplates in this lineage were designed for 200mm chamber configurations with aluminum alloy substrates and anodized surface treatments. As process nodes advanced below 65nm, material specifications evolved to incorporate yttria-coated aluminum and quartz-composite variants to withstand higher plasma densities and more aggressive chemistries (NF3, HF, Cl2). The T5-4CC2 and F30E suffix designations indicate specific geometric configurations — centerhole diameter, hole pattern pitch, and RF grounding contact geometry — that are chamber-model-specific and not interchangeable across platform generations without engineering validation. The HF-H3D12 sub-designation references the RF cap interface standard, which aligns with Applied Materials' internal hardware revision control system. Compatibility between FCSP7302DW2 variants and chamber bodies must be verified against the chamber's hardware revision level (HRL) documented in the equipment's configuration management records. Procurement teams sourcing replacement parts for legacy 200mm tools must account for the fact that several FCSP7302DW2 configurations have been discontinued by Applied Materials and are available exclusively through qualified secondary market suppliers.
The following SKUs represent documented components within the Applied Materials FCSP7302DW2 series and related faceplate/RF cap assemblies. Each entry reflects a distinct configuration defined by geometry, material grade, or interface specification.
0041-56777 FCSP7302DW2-T5-4CC2-F30E/HF-H3D12 02-298156-00: Faceplate assembly, 23MIL centerhole pattern, RF cap interface, HF-H3D12 revision, 300mm chamber compatible.
0041-56778 FCSP7302DW2-T5-4CC2-F30E/HF-H3D12: Faceplate assembly, standard centerhole, RF cap, alternate revision suffix, Centura CVD platform.
0041-56779 FCSP7302DW2-T6-4CC2-F30E/HF-H3D12: Faceplate, T6 geometry variant, 23MIL hole pitch, RF grounding cap, Producer platform.
0041-56780 FCSP7302DW2-T5-4CC3-F30E/HF-H3D12: Faceplate, 4CC3 hole array configuration, RF cap, etch chamber application.
0041-56781 FCSP7302DW2-T5-4CC2-F32E/HF-H3D12: Faceplate, F32E gas distribution variant, 23MIL centerhole, RF cap assembly.
0041-56782 FCSP7302DW2-T5-4CC2-F30E/HF-H3D14: Faceplate, H3D14 RF cap revision, updated grounding contact geometry, 300mm.
0041-56783 FCSP7302DW2-T7-4CC2-F30E/HF-H3D12: Faceplate, T7 substrate thickness variant, RF cap, high-power RF process application.
0041-56784 FCSP7302DW2-T5-4CC4-F30E/HF-H3D12: Faceplate, 4CC4 extended hole array, RF cap, high-density plasma CVD chamber.
0041-56785 FCSP7302DW2-T5-4CC2-F30E/HF-H3D16: Faceplate, H3D16 RF cap, latest grounding revision, 300mm Centura platform.
0041-56786 FCSP7302DW2-T5-4CC2-F30E/QZ-H3D12: Faceplate, quartz-composite substrate, RF cap, fluorine-chemistry process chambers.
0041-56787 FCSP7302DW2-T5-4CC2-F30E/YT-H3D12: Faceplate, yttria-coated aluminum, RF cap, high-erosion plasma environments.
0041-56788 FCSP7302DW2-T5-4CC2-F30E/HF-H3D12-200: Faceplate, 200mm chamber configuration, RF cap, legacy tool support.
0041-56789 FCSP7302DW2-T5-4CC2-F30E/HF-H3D12-R1: Faceplate, refurbishment-grade specification, RF cap, certified secondary market.
0041-56790 FCSP7302DW2-T5-4CC2-F30E/HF-H3D12-KIT: Faceplate kit assembly, includes RF cap, O-ring set, and mounting hardware, 300mm.
0041-56791 FCSP7302DW2-T5-4CC2-F30E/HF-H3D12-PM: Faceplate, preventive maintenance kit variant, RF cap, scheduled replacement cycle component.
Faceplate and RF cap assemblies in the FCSP7302DW2 series require inspection protocols that address the specific failure modes of plasma-exposed chamber components. DriveKNMS applies the following verification procedures to all units processed through its inventory program. Dimensional inspection: centerhole diameter and pitch are measured against OEM drawings using calibrated CMM equipment to verify conformance to the 23MIL specification and hole array geometry. Surface condition assessment: anodized, yttria-coated, and quartz-composite surfaces are inspected under UV and white light for micro-cracking, delamination, and erosion depth exceeding OEM wear limits. RF contact integrity: the HF-H3D12 and variant RF cap interfaces are tested for contact resistance and mechanical seating force to confirm RF grounding continuity within specification. Leak integrity: gas distribution hole arrays are pressure-tested to verify no cross-contamination pathways exist between process gas zones. Documentation: each unit ships with a condition report referencing the part number, revision, inspection date, and technician certification. Units that do not pass all inspection criteria are quarantined and not offered for sale.
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