Applied Materials RAYMID10LTCB3 0190-17458 ACRTC-A HIMV-307A 04876401 16692 Infrared Thermometer Comm Box

Technical Dossier

Product Details And Specifications

Applied Materials RAYMID10LTCB3 Series: Comprehensive Module Range and Technical Overview

The Applied Materials RAYMID10LTCB3 infrared thermometer communication box is an OEM-integrated pyrometry subsystem deployed across Applied Materials semiconductor process equipment platforms, including CVD, etch, and rapid thermal processing (RTP) chambers. This communication interface module bridges the Raytek MID10L series non-contact infrared temperature sensor with the host process controller, enabling real-time wafer temperature feedback critical to process uniformity and yield control.

Installed across global semiconductor fabs — including facilities operating 200mm and 300mm wafer lines — the RAYMID10LTCB3 platform is embedded in equipment generations spanning the late 1990s through the 2010s. Its continued presence in legacy tool fleets at chemical vapor deposition (CVD) stations, diffusion furnaces, and RTP systems makes it a high-demand spare part for fab maintenance engineers managing long-lifecycle capital equipment.

Cross-reference part numbers for this unit include: 0190-17458, ACRTC-A, HIMV-307A, 04876401, and 16692. These identifiers appear across Applied Materials service documentation, Raytek OEM records, and third-party MRO databases.

The Evolution of RAYMID10LTCB3 Architecture

The RAYMID10LTCB3 communication box is derived from the Raytek MID10L OEM pyrometer platform, which Raytek (now Fluke Process Instruments) developed for integration into semiconductor OEM equipment. Applied Materials adopted this sensor family for wafer temperature measurement in process chambers where contact-based thermometry is impractical.

Early-generation deployments used analog signal output (4–20 mA or 0–5 V) routed through the comm box to the equipment's process controller. Later revisions introduced RS-232 and RS-485 serial communication interfaces, enabling digital temperature data transmission and remote configuration of emissivity, response time, and alarm thresholds. The ACRTC-A board revision reflects one such interface upgrade iteration.

As Applied Materials transitioned to newer equipment platforms (e.g., Centura, Producer, Endura series), the RAYMID10LTCB3 subsystem was progressively replaced by integrated pyrometry solutions with direct fieldbus connectivity. However, the installed base of legacy tools — many operating well beyond their original design life — continues to require RAYMID10LTCB3 assemblies and sub-components for corrective and preventive maintenance.

Compatibility considerations: The HIMV-307A PCB assembly within the comm box is specific to the MID10L sensor head. Substitution with non-OEM boards requires verification of signal conditioning parameters and power supply compatibility (typically +5 VDC and ±15 VDC rails).

RAYMID10LTCB3 Full Catalog & Functionalities (SKU List)

The following SKUs represent the RAYMID10LTCB3 series and its directly associated Raytek MID10L OEM components as deployed in Applied Materials equipment. Each entry reflects a distinct functional role within the pyrometry subsystem.

RAYMID10LTCB3: Complete infrared thermometer communication box assembly, OEM-integrated for Applied Materials process chambers.
0190-17458: Applied Materials internal part number for the RAYMID10LTCB3 comm box assembly.
ACRTC-A: Analog/digital interface board revision A; handles signal conditioning and serial output formatting.
HIMV-307A: Main PCB assembly within the comm box; integrates power regulation and sensor signal processing.
04876401: Raytek OEM assembly reference number for the MID10L communication interface unit.
16692: Alternate Raytek catalog reference for the MID10L comm box in Applied Materials OEM configuration.
RAYMID10L: Base Raytek MID10L infrared thermometer sensor head; non-contact, fixed-mount, 8–14 µm spectral response.
RAYMID10LT: MID10L variant with integrated target temperature output; used in RTP and CVD chamber configurations.
0190-17459: Applied Materials part number for the MID10L sensor head assembly paired with RAYMID10LTCB3.
0190-20456: Replacement cable assembly connecting MID10L sensor head to the RAYMID10LTCB3 comm box.
HIMV-308A: Alternate PCB revision for the comm box; associated with later firmware and RS-485 interface support.
ACRTC-B: Revision B interface board; introduced enhanced EMI shielding for high-RF process environments.
0190-35612: Applied Materials spare kit for RAYMID10LTCB3 including HIMV-307A board and connector hardware.
RAYTEKMID10-PSU: Dedicated power supply module for MID10L comm box; provides regulated ±15 VDC and +5 VDC rails.
0190-09876: Applied Materials fiber optic interface adapter for MID10L sensor in high-EMI chamber environments.
HIMV-310A: Updated main board revision with extended temperature range calibration (up to 1000°C).
0190-22341: Applied Materials mounting bracket and enclosure kit for RAYMID10LTCB3 comm box field replacement.

Sourcing Hard-to-Find & Obsolete RAYMID10LTCB3 Parts

The RAYMID10LTCB3 series has entered the mature-to-obsolete phase of its product lifecycle. Raytek (Fluke Process Instruments) no longer actively markets the MID10L OEM platform for new equipment integrations, and Applied Materials has transitioned current-generation tools to alternative pyrometry architectures. This creates a supply gap for fabs operating legacy equipment that cannot be cost-effectively upgraded.

DriveKNMS maintains a dedicated inventory program for RAYMID10LTCB3 assemblies and sub-components, sourced through certified secondary market channels, decommissioned equipment recovery, and long-term storage stock. All units are cataloged by part number, revision level, and functional test status prior to listing.

For end-of-life support, DriveKNMS provides: (1) direct replacement of complete RAYMID10LTCB3 comm box assemblies; (2) component-level sourcing of HIMV-307A and ACRTC-A boards for in-house repair programs; (3) cross-reference matching for Applied Materials internal part numbers (0190-XXXXX series) to Raytek OEM references; and (4) consignment evaluation of surplus RAYMID10LTCB3 units from fab decommissioning projects.

Customers operating Applied Materials Precision 5000, Centura (legacy configurations), or P5000 platforms with MID10L pyrometry integration are the primary user base for this inventory program.

Quality Control for the RAYMID10LTCB3 Range

Each RAYMID10LTCB3 communication box processed by DriveKNMS undergoes a structured functional verification protocol prior to shipment. The test sequence addresses the specific failure modes documented for this assembly in semiconductor fab maintenance records.

Visual and mechanical inspection: enclosure integrity, connector pin condition (DB-9 and proprietary sensor interface connectors), PCB surface inspection for corrosion, cold solder joints, and component damage on the HIMV-307A and ACRTC-A boards.

Power supply verification: confirmation of regulated output rails (+5 VDC ±5%, ±15 VDC ±5%) under load conditions representative of MID10L sensor head operation.

Signal output validation: analog output linearity check across the calibrated temperature range; serial communication port (RS-232/RS-485) loopback test to verify data framing, baud rate configuration, and command response integrity.

Sensor interface simulation: bench-level simulation of MID10L sensor head signal inputs to verify comm box signal conditioning, emissivity compensation logic, and alarm output relay function.

Calibration traceability: where applicable, temperature output calibration is verified against NIST-traceable reference standards. Calibration certificates are available upon request for units requiring documented traceability for fab metrology programs.