Bachmann Electronic MX213

Technical Dossier

Product Details And Specifications

Bachmann MX200 Series Technical Notes

The Evolution of MX200 Architecture

The MX200 platform was introduced as a successor to Bachmann's earlier M1 controller family, consolidating CPU performance, I/O density, and fieldbus integration into a unified backplane standard. Early MX200 deployments used the MX207 and MX210 processors, which provided single-core execution with CAN-based I/O expansion. As industrial Ethernet became the dominant fieldbus standard, Bachmann introduced the MX213 and MX220 processors with integrated Ethernet ports, PROFIBUS master capability, and expanded SDRAM for larger application programs.

The architecture transitioned through three distinct generations: (1) CAN-primary I/O expansion with serial fieldbus adapters; (2) dual-Ethernet CPU modules with onboard PROFIBUS and CANopen master; (3) current-generation modules with IEC 62443-compliant security features and OPC UA server integration. Compatibility between generations is maintained at the backplane level — MX200 I/O modules from early production runs remain electrically compatible with current CPU modules, provided firmware versions are aligned. This backward compatibility is a primary reason the MX200 platform remains active in brownfield upgrade projects where full system replacement is not economically viable.

MX200 Full Catalog & Functionalities (SKU List)

CPU / Processor Modules

• MX207: Entry-level MX200 CPU; single Ethernet port; 32 MB SDRAM; CAN master.
• MX210: Mid-range processor; dual CAN master; onboard PROFIBUS DP master; 64 MB SDRAM.
• MX213: Standard MX200 CPU; dual 100 Mbit Ethernet; PROFIBUS DP master; 128 MB SDRAM; IEC 61131-3 runtime.
• MX220: High-performance CPU; dual Gigabit Ethernet; redundancy-capable; 256 MB SDRAM; OPC UA server.
• MX240: Redundant CPU module; hot-standby failover; dual Ethernet; designed for SIL-2 applications.

Digital Input Modules

• DI232: 32-channel 24 VDC digital input module; 0.2 ms filter time; group isolation.
• DI216: 16-channel 24 VDC digital input; individually configurable filter times; diagnostic per channel.
• DIO248: 48-channel mixed digital I/O; 32 DI + 16 DO; compact high-density format.

Digital Output Modules

• DO232: 32-channel 24 VDC digital output; 0.5 A per channel; short-circuit protection.
• DO216: 16-channel relay output module; 2 A per channel; suitable for motor starter control.

Analog I/O Modules

• AI208: 8-channel analog input; ±10 V / 0–20 mA selectable; 16-bit resolution.
• AO208: 8-channel analog output; ±10 V / 4–20 mA; 16-bit DAC; short-circuit protected.
• AIO288: 8 AI + 8 AO combined module; 16-bit resolution; configurable per channel.
• TMP208: 8-channel thermocouple/RTD input; supports PT100, PT1000, Type J/K/T; cold-junction compensation.

Communication & Specialty Modules

• NT255: Network time synchronization module; GPS/DCF77 input; NTP server for MX200 rack.
• GMP232: Grid measurement and protection module; power quality analysis; IEC 61850 compatible.
• ISI222: Incremental encoder interface; 2-channel; 5 V/24 V encoder supply; max 1 MHz input frequency.
• CNT204: 4-channel high-speed counter module; 32-bit counters; gate time measurement.
• EXC208: LVDT/RVDT excitation and measurement module; 8-channel; used in turbine position sensing.
• CANopen Master Module: Dedicated CANopen master for distributed I/O expansion over CAN bus.

Sourcing Hard-to-Find & Obsolete MX200 Parts

DriveKNMS maintains a dedicated inventory of tested surplus and refurbished MX200 modules sourced from decommissioned plant equipment, system integrator overstock, and controlled factory returns. All units are catalogued by firmware revision and hardware revision code to ensure compatibility with the customer's existing rack configuration. For obsolete CPU modules, DriveKNMS provides firmware version documentation to assist the customer's engineering team in validating software compatibility before installation.

Quality Control for the MX200 Range

MX200 modules undergo a structured multi-stage inspection process at DriveKNMS before dispatch. The MX200 backplane uses a proprietary high-speed parallel bus for inter-module communication; contamination or connector wear on the backplane edge connector is a primary failure mode for field-returned units. Each module is visually inspected under magnification for connector pin deformation, PCB corrosion, and capacitor condition before electrical testing begins.