Bachmann Electronic MX213

Bachmann MX200 Series Modules

Model: MX213

Brand Bachmann Electronic
Series MX213
Model MX213
RFQ-ready model route Obsolete and surplus sourcing Export follow-up by model list

Product Overview

Commercial availability is handled through direct RFQ, model verification and export-oriented follow-up rather than public cart checkout.

Datasheet Preview

Datasheet Preview

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Commercial Path

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Technical Dossier

Product Details And Specifications

Bachmann MX200 Series: Comprehensive Module Range and Technical Overview

The Bachmann MX200 series is a modular programmable logic controller (PLC) platform engineered by Bachmann Electronic GmbH (Austria) for deployment in high-availability industrial environments. The platform holds a documented installation base across heavy-process industries including petrochemical refineries, offshore oil and gas platforms, hydroelectric power stations, nuclear auxiliary systems, and large-scale wind turbine control infrastructure. Its deterministic real-time execution, redundancy-capable architecture, and IEC 61131-3 compliance make it a reference platform for safety-critical automation projects requiring long operational lifecycles. The MX200 rack-based backplane supports hot-swap module replacement, enabling maintenance without full system shutdown — a critical requirement in continuous-process facilities where unplanned downtime carries significant financial and safety consequences.

The Evolution of MX200 Architecture

The MX200 platform was introduced as a successor to Bachmann's earlier M1 controller family, consolidating CPU performance, I/O density, and fieldbus integration into a unified backplane standard. Early MX200 deployments used the MX207 and MX210 processors, which provided single-core execution with CAN-based I/O expansion. As industrial Ethernet became the dominant fieldbus standard, Bachmann introduced the MX213 and MX220 processors with integrated Ethernet ports, PROFIBUS master capability, and expanded SDRAM for larger application programs.

The architecture transitioned through three distinct generations: (1) CAN-primary I/O expansion with serial fieldbus adapters; (2) dual-Ethernet CPU modules with onboard PROFIBUS and CANopen master; (3) current-generation modules with IEC 62443-compliant security features and OPC UA server integration. Compatibility between generations is maintained at the backplane level — MX200 I/O modules from early production runs remain electrically compatible with current CPU modules, provided firmware versions are aligned. This backward compatibility is a primary reason the MX200 platform remains active in brownfield upgrade projects where full system replacement is not economically viable.

MX200 Full Catalog & Functionalities (SKU List)

CPU / Processor Modules

  • MX207: Entry-level MX200 CPU; single Ethernet port; 32 MB SDRAM; CAN master.
  • MX210: Mid-range processor; dual CAN master; onboard PROFIBUS DP master; 64 MB SDRAM.
  • MX213: Standard MX200 CPU; dual 100 Mbit Ethernet; PROFIBUS DP master; 128 MB SDRAM; IEC 61131-3 runtime.
  • MX220: High-performance CPU; dual Gigabit Ethernet; redundancy-capable; 256 MB SDRAM; OPC UA server.
  • MX240: Redundant CPU module; hot-standby failover; dual Ethernet; designed for SIL-2 applications.

Digital Input Modules

  • DI232: 32-channel 24 VDC digital input module; 0.2 ms filter time; group isolation.
  • DI216: 16-channel 24 VDC digital input; individually configurable filter times; diagnostic per channel.
  • DIO248: 48-channel mixed digital I/O; 32 DI + 16 DO; compact high-density format.

Digital Output Modules

  • DO232: 32-channel 24 VDC digital output; 0.5 A per channel; short-circuit protection.
  • DO216: 16-channel relay output module; 2 A per channel; suitable for motor starter control.

Analog I/O Modules

  • AI208: 8-channel analog input; ±10 V / 0–20 mA selectable; 16-bit resolution.
  • AO208: 8-channel analog output; ±10 V / 4–20 mA; 16-bit DAC; short-circuit protected.
  • AIO288: 8 AI + 8 AO combined module; 16-bit resolution; configurable per channel.
  • TMP208: 8-channel thermocouple/RTD input; supports PT100, PT1000, Type J/K/T; cold-junction compensation.

Communication & Specialty Modules

  • NT255: Network time synchronization module; GPS/DCF77 input; NTP server for MX200 rack.
  • GMP232: Grid measurement and protection module; power quality analysis; IEC 61850 compatible.
  • ISI222: Incremental encoder interface; 2-channel; 5 V/24 V encoder supply; max 1 MHz input frequency.
  • CNT204: 4-channel high-speed counter module; 32-bit counters; gate time measurement.
  • EXC208: LVDT/RVDT excitation and measurement module; 8-channel; used in turbine position sensing.
  • CANopen Master Module: Dedicated CANopen master for distributed I/O expansion over CAN bus.

Sourcing Hard-to-Find & Obsolete MX200 Parts

Several MX200 modules — including the MX207, MX210, DI216, DO216, and NT255 — have reached end-of-production status. Bachmann Electronic no longer manufactures replacement units for these part numbers, and OEM lead times for equivalent new-generation substitutes can exceed 26 weeks for project-specific configurations.

DriveKNMS maintains a dedicated inventory of tested surplus and refurbished MX200 modules sourced from decommissioned plant equipment, system integrator overstock, and controlled factory returns. All units are catalogued by firmware revision and hardware revision code to ensure compatibility with the customer's existing rack configuration. For obsolete CPU modules, DriveKNMS provides firmware version documentation to assist the customer's engineering team in validating software compatibility before installation.

Customers operating MX200 systems beyond the OEM support window can engage DriveKNMS for lifecycle extension contracts, which include priority stock reservation, advance exchange programs, and failure analysis reporting for returned modules.

Quality Control for the MX200 Range

MX200 modules undergo a structured multi-stage inspection process at DriveKNMS before dispatch. The MX200 backplane uses a proprietary high-speed parallel bus for inter-module communication; contamination or connector wear on the backplane edge connector is a primary failure mode for field-returned units. Each module is visually inspected under magnification for connector pin deformation, PCB corrosion, and capacitor condition before electrical testing begins.

CPU modules (MX213, MX220, MX240) are powered in an isolated test rack and subjected to a full boot cycle, Ethernet port link negotiation test, and PROFIBUS master scan. Analog modules (AI208, AO208, AIO288, TMP208) are calibrated against a traceable reference standard and linearity-tested across the full input/output range. Digital I/O modules are tested for channel-by-channel switching integrity and isolation resistance. Specialty modules such as GMP232 and EXC208 are tested using application-specific signal simulators. All test results are documented and available upon request.

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