EUPEC BSM Series IGBT Power Modules: BSM300GA120DN2S

Technical Dossier

Product Details And Specifications

EUPEC BSM Series: Comprehensive Module Range and Technical Overview

The EUPEC BSM (Bipolar Switch Module) series represents one of the most widely deployed families of IGBT power modules in global heavy industry. Manufactured by EUPEC GmbH — subsequently acquired by Infineon Technologies — BSM series modules are installed across chemical processing plants, nuclear power auxiliary systems, petroleum refinery drive systems, steel mill rolling drives, and high-voltage DC transmission converter stations. Their robust press-pack and base-plate construction, combined with standardized footprints, made them the de facto reference design for medium-voltage variable frequency drives (VFDs) and industrial UPS systems throughout the 1990s and 2000s. The BSM300GA120DN2S specifically — rated at 300 A collector current and 1200 V blocking voltage — is a dual IGBT module in the standard 62 mm package, widely used in three-phase inverter bridge configurations for drives in the 75–200 kW range.

The Evolution of BSM Series Architecture

The BSM series originated under EUPEC (European Power Electronics Center), a joint venture between Siemens and other European semiconductor manufacturers. Early-generation BSM modules (circa 1988–1995) used bipolar transistor technology before transitioning to NPT (Non-Punch-Through) IGBT cells in the mid-1990s. The DN2 and DN2S suffixes denote the second-generation dual-switch topology with integrated freewheeling diodes — a critical advancement that eliminated external diode assemblies in inverter designs.

Following Infineon's acquisition of EUPEC in 2002, the BSM series was progressively superseded by the FF (FZ) series and the EconoPACK family. However, the BSM footprint and gate-drive characteristics remain sufficiently distinct that direct substitution requires careful evaluation of gate threshold voltage (VGE(th)), switching loss profiles (Eon/Eoff), and thermal resistance (Rth(j-c)). Many installed base systems in refineries and power plants continue to operate on BSM-series modules due to the prohibitive cost of full drive replacement, making long-term spare parts availability a critical operational requirement.

Key compatibility considerations: BSM modules use a 62 mm standard package with M6 power terminals. Gate drive requirements are typically ±15 V with a gate resistor (RG) in the 4.7–10 Ω range. Thermal interface material (TIM) specification and torque values for base-plate mounting must be observed precisely to maintain rated thermal resistance.

BSM Series Full Catalog & Functionalities (SKU List)

The following SKUs represent verified, commonly stocked models within the EUPEC BSM series. Each entry reflects a distinct current/voltage/topology combination used in industrial drive and power conversion applications.

BSM300GA120DN2S: 300A / 1200V dual IGBT module, 62mm package, standard DN2S topology, three-phase inverter bridge use.
BSM200GA120DN2S: 200A / 1200V dual IGBT, reduced current rating for 45–110 kW drive applications.
BSM150GA120DN2S: 150A / 1200V dual IGBT, compact inverter and chopper circuits in industrial drives.
BSM100GA120DN2S: 100A / 1200V dual IGBT, widely used in servo drive output stages.
BSM75GA120DN2S: 75A / 1200V dual IGBT, suitable for low-power VFD and UPS inverter legs.
BSM50GA120DN2S: 50A / 1200V dual IGBT, auxiliary converter and DC-DC stage applications.
BSM300GA170DN2S: 300A / 1700V dual IGBT, elevated blocking voltage for medium-voltage drive input stages.
BSM200GA170DN2S: 200A / 1700V dual IGBT, traction and high-voltage industrial converter use.
BSM150GA170DN2S: 150A / 1700V dual IGBT, offshore and marine drive systems requiring higher isolation.
BSM100GA170DN2S: 100A / 1700V dual IGBT, grid-tie inverter and active front-end rectifier stages.
BSM300GA120DLC: 300A / 1200V dual IGBT, DLC package variant with lower inductance for high-frequency switching.
BSM200GA120DLC: 200A / 1200V dual IGBT, DLC topology for reduced EMI in sensitive industrial environments.
BSM400GA120DN2S: 400A / 1200V dual IGBT, high-current variant for large-frame motor drives above 200 kW.
BSM500GA120DN2S: 500A / 1200V dual IGBT, parallel inverter leg configurations in megawatt-class drives.
BSM75GA170DN2S: 75A / 1700V dual IGBT, auxiliary power supply and snubber-less converter topologies.
BSM50GA170DN2S: 50A / 1700V dual IGBT, isolated DC bus applications in modular drive architectures.
BSM300GA120DN2: 300A / 1200V dual IGBT, first-generation DN2 variant (predecessor to DN2S), legacy system maintenance.

Sourcing Hard-to-Find & Obsolete BSM Series Parts

The EUPEC BSM series entered end-of-life (EOL) status progressively between 2005 and 2015 as Infineon consolidated production onto the FF/FZ and EconoPACK platforms. As of 2026, new production of BSM-series modules has ceased. However, the installed base in long-lifecycle industrial assets — particularly in chemical plants and power generation facilities with 20–40 year equipment service horizons — continues to generate active demand for replacement units.

DriveKNMS maintains a dedicated inventory program for BSM series modules sourced from verified industrial surplus channels, OEM overstock, and controlled decommissioning projects. All units are subject to date-code verification, visual inspection, and electrical parameter testing prior to dispatch. For systems where the original BSM module is confirmed unavailable, DriveKNMS can provide cross-reference analysis to identify compatible Infineon FF/FZ series equivalents, with full documentation of parameter deviations for engineering review.

Quality Control for the BSM Series Range

BSM series modules present specific test challenges due to their integrated dual-switch topology and the age profile of available stock. DriveKNMS applies the following test protocol to all BSM series units:

Static parameter verification: VCE(sat) measurement at rated IC and VGE = +15 V; VGE(th) measurement at IC = 1 mA; leakage current (ICES) at rated VCE with VGE = 0 V. Diode characterization: Forward voltage (VF) of integrated freewheeling diodes at rated current; reverse recovery behavior assessment. Isolation test: Hi-pot test at 2500 V AC (50 Hz, 1 min) between power terminals and base plate, per IEC 60747-9. Thermal resistance check: Rth(j-c) estimation via transient thermal impedance measurement to confirm base-plate bond integrity. Visual and mechanical inspection: Bond wire continuity, silicone gel condition, terminal thread integrity, and base-plate flatness (≤ 50 μm deviation per 100 mm).

Test records are retained per unit and available upon request for critical infrastructure procurement.