EUPEC BSM200GB170DLC IGBT Module: Specs, Series Models & Availability

Technical Dossier

Product Details And Specifications

EUPEC BSM GB DLC Series: Comprehensive Module Range and Technical Overview

The EUPEC BSM GB DLC series represents one of the most widely deployed families of press-pack and transfer-molded IGBT power modules in global heavy industry. Manufactured by EUPEC GmbH (subsequently acquired by Infineon Technologies), these modules are installed across high-demand environments including petrochemical refineries, nuclear auxiliary power systems, offshore platform variable-speed drives, steel mill rolling mill drives, and large-scale traction inverters. The BSM200GB170DLC specifically operates at a 1700 V blocking voltage with a 200 A continuous collector current rating, placing it in the medium-to-high power segment used extensively in industrial motor drives and UPS systems rated above 100 kW. The DLC package designation indicates a dual-switch (half-bridge) topology in a standard 62 mm baseplate module format, compatible with standard heatsink mounting systems used across major drive platforms from ABB, Siemens, and Rockwell Automation.

The Evolution of BSM GB DLC Architecture

EUPEC's BSM GB DLC lineage traces to the early 1990s, when the transition from bipolar Darlington transistors to IGBT technology began reshaping industrial power conversion. The first-generation BSM modules used aluminum wire bonding on silicon chips with relatively high saturation voltages (Vce(sat) ≈ 3.5 V at rated current). By the mid-1990s, EUPEC introduced trench-gate IGBT cells that reduced conduction losses by approximately 20%, reflected in the second-generation DLC modules. The 1700 V voltage class (GB170 designation) was introduced to address the growing demand for 690 VAC drive systems, which require higher blocking voltage headroom than the earlier 1200 V class (GB120). Following Infineon's acquisition of EUPEC in 2002, the BSM GB DLC series entered a managed lifecycle phase. Infineon continued production under the EUPEC brand for legacy compatibility while introducing the FZ and FF series as forward-looking replacements. Compatibility between BSM DLC modules and their Infineon successors requires careful verification of gate threshold voltage, thermal resistance (Rth(j-c)), and stray inductance parameters, as direct pin-for-pin substitution is not always guaranteed across generations.

BSM GB DLC Full Catalog & Functionalities (SKU List)

The following SKUs represent verified, commonly sourced models within the EUPEC BSM GB DLC and closely related DLC-package IGBT series. Each entry reflects a distinct current/voltage rating combination or topology variant:

BSM100GB120DLC: 100 A / 1200 V half-bridge IGBT module, standard 62 mm package, widely used in 55–75 kW drives.
BSM150GB120DLC: 150 A / 1200 V half-bridge, common in 90–110 kW inverter stages.
BSM200GB120DLC: 200 A / 1200 V half-bridge, deployed in 132 kW industrial motor drives.
BSM100GB170DLC: 100 A / 1700 V half-bridge, suited for 690 VAC bus architectures in medium drives.
BSM150GB170DLC: 150 A / 1700 V half-bridge, used in 90–110 kW 690 V class inverters.
BSM200GB170DLC: 200 A / 1700 V half-bridge, core module for 132–160 kW 690 V drives and UPS systems.
BSM300GB120DLC: 300 A / 1200 V half-bridge, high-current variant for 200–250 kW drive stages.
BSM300GB170DLC: 300 A / 1700 V half-bridge, used in large traction and crane drive inverters.
BSM400GA120DN2: 400 A / 1200 V dual IGBT, alternative package for high-power parallel configurations.
BSM50GB120DLC: 50 A / 1200 V half-bridge, entry-level DLC module for sub-37 kW drives.
BSM75GB120DLC: 75 A / 1200 V half-bridge, used in 45 kW pump and fan drive applications.
BSM75GB170DLC: 75 A / 1700 V half-bridge, 690 V bus compatible for smaller high-voltage drives.
BSM50GB170DLC: 50 A / 1700 V half-bridge, low-power 690 V class module for auxiliary inverters.
BSM25GB120DLC: 25 A / 1200 V half-bridge, used in servo drive output stages and small inverters.
BSM35GB120DLC: 35 A / 1200 V half-bridge, deployed in compact variable frequency drives below 22 kW.
BSM200GB170DN2: 200 A / 1700 V dual IGBT in DN2 package, alternative topology for specific OEM platforms.

Sourcing Hard-to-Find & Obsolete BSM GB DLC Parts

The BSM GB DLC series entered end-of-life (EOL) status progressively between 2008 and 2015 as Infineon consolidated production onto the FZ and FF platform families. However, the installed base of equipment using BSM DLC modules remains substantial. Facilities operating legacy ABB ACS600, Siemens MASTERDRIVES, and Rockwell PowerFlex 700H platforms continue to require BSM DLC replacements for unplanned maintenance events. DriveKNMS maintains a dedicated inventory of BSM GB DLC modules sourced from verified OEM overstock, controlled decommissioning projects, and authorized distributor closeouts. All units are stored in climate-controlled conditions at 18–25°C with humidity below 60% RH to prevent electrostatic and moisture-related degradation of the IGBT gate oxide. For facilities requiring long-term maintenance agreements (LTMAs) covering BSM DLC modules across multi-year service windows, DriveKNMS offers reserved stock allocation programs with guaranteed delivery lead times. Contact the procurement team with your equipment model, drive serial number, and annual consumption estimate to receive a tailored supply proposal.

Quality Control for the BSM GB DLC Range

IGBT modules in the BSM GB DLC series present specific test challenges due to their integrated freewheeling diode topology and dual-switch configuration. DriveKNMS applies a multi-stage verification protocol to every unit processed: (1) Visual inspection under 10× magnification for bond wire integrity, baseplate flatness deviation (<50 µm tolerance), and silicone gel condition; (2) Static parameter testing using a curve tracer to verify Vce(sat) within ±10% of datasheet nominal at Ic = 200 A, Tj = 25°C; (3) Gate threshold voltage (Vge(th)) measurement to confirm IGBT cell uniformity and absence of gate oxide degradation; (4) Leakage current (Ices) measurement at rated blocking voltage to screen for partial breakdown or contamination; (5) Thermal resistance spot-check using transient thermal impedance measurement on sampled units to verify Rth(j-c) compliance. Units failing any parameter are quarantined and not returned to serviceable stock. Test records are retained for 5 years and available to customers upon request.