GE PACSystems RX3i Modules
GE PACSystems RX3i Series: Comprehensive Module Range and Technical Overview The GE PACSystems RX3i platform is one of the most…
Model: IC697ADC701
Product Overview
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Datasheet Preview
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Commercial Path
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Technical Dossier
The GE Series 90-70 (IC697 prefix) is a rack-based programmable logic controller platform developed by GE Fanuc Automation, deployed extensively across global heavy industry sectors including petrochemical refineries, nuclear power generation facilities, offshore oil & gas platforms, pulp and paper mills, and large-scale water treatment infrastructure. Its VMEbus-based backplane architecture, introduced in the late 1980s, established a modular expansion standard that allowed facilities to scale control systems from single-rack configurations to multi-rack distributed architectures spanning thousands of I/O points. The Series 90-70 remains one of the most widely installed legacy DCS/PLC platforms in continuous process industries, with installed base units still operating under long-term maintenance contracts well into the 2020s.
The Series 90-70 platform launched commercially circa 1988 under GE Fanuc Automation, a joint venture between General Electric and FANUC Ltd. The original CPU lineup (IC697CPU731, IC697CPU771) used Intel 80386-class processors and communicated via the proprietary Genius Bus (IC660 series field devices). By the mid-1990s, GE Fanuc introduced Ethernet TCP/IP communication modules (IC697CMM742) and expanded the analog I/O catalog to support thermocouple, RTD, and high-speed analog inputs. The platform transitioned through several ownership changes: GE Fanuc → GE Intelligent Platforms (2011) → Emerson Automation Solutions (2018, rebranded as PACSystems). Current Emerson documentation classifies the IC697 Series 90-70 hardware as End-of-Life (EOL), with no new manufacturing. Replacement migration paths include the GE PACSystems RX7i (IC698 prefix), which maintains physical rack and I/O module compatibility with select Series 90-70 modules, enabling phased migration without full system replacement. Compatibility constraints exist between early-generation CPUs (pre-IC697CPU789) and later high-density I/O modules; firmware version alignment is mandatory for mixed-generation rack configurations.
CPU & Controller Modules
Analog Input Modules
Analog Output Modules
Digital Input Modules
Digital Output Modules
Communication & Network Modules
Power Supply Modules
All IC697-series modules processed by DriveKNMS undergo a structured inspection and functional verification protocol prior to dispatch. The procedure addresses the specific failure modes documented in GE Fanuc service bulletins for this platform generation: VMEbus backplane connector wear (P1/P2 connector pin inspection and continuity verification), electrolytic capacitor degradation on analog I/O boards (ESR measurement, visual inspection for bulge/leakage), EEPROM and battery-backed SRAM integrity checks on CPU modules, and optical isolator degradation testing on AC digital I/O modules. Analog modules including the IC697ADC701 are bench-tested under load across all output channels with calibrated measurement equipment, verifying output accuracy within ±0.1% of full scale. Communication modules are tested for full protocol handshake and data throughput on live network test benches. Each unit ships with a test report and 12-month operational warranty.