YOKOGAWA FA-M3 F3LC11-1N Modules

Model: F3LC11-1N

Brand Yokogawa
Model F3LC11-1N
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Technical Dossier

Product Details And Specifications

YOKOGAWA FA-M3 Series Technical Notes

The YOKOGAWA FA-M3 (also marketed under the STARDOM platform for hybrid DCS/PLC applications) is one of the most widely deployed programmable controller platforms in global heavy industry. Installed across petrochemical complexes, nuclear power auxiliary systems, LNG terminals, offshore platforms, and continuous-process refineries, the FA-M3 architecture is recognized for its deterministic scan-cycle performance, high-density I/O backplane design, and long-term vendor support commitment. The F3LC11-1N Computer Link Module is a core communication component within this ecosystem, enabling RS-232C/RS-422/RS-485 serial communication between the FA-M3 CPU rack and host computers, SCADA systems, or third-party field devices using YOKOGAWA's proprietary Computer Link protocol.

The Evolution of FA-M3 Architecture

The FA-M3 platform was introduced in the mid-1990s as YOKOGAWA's answer to the growing demand for a unified controller capable of handling both discrete and continuous process control. The original F3 series established a modular backplane architecture (up to 16 slots per base unit, expandable via extension racks) that has remained backward-compatible across three decades of hardware revisions.

Generation 1 (F3SP05/F3SP08 era): Early CPU modules with limited memory and ladder-only programming. Communication was handled exclusively via dedicated link modules such as the F3LC01 and F3LC11 families using RS-232C point-to-point topology.

Generation 2 (F3SP21/F3SP28/F3SP35 era): Expanded instruction sets, SFC/FBD support, and the introduction of Ethernet-capable CPU variants. The F3LC11-1N remained relevant as a cost-effective serial link for legacy SCADA integration.

Generation 3 (F3SP53/F3SP58/F3SP67/F3SP71 era): High-speed CPUs with USB programming ports, expanded tag-based addressing, and dual-port Ethernet. Serial communication modules transitioned to a maintenance/legacy role, but remain essential in brownfield sites where host systems use fixed RS-232C or RS-422 interfaces.

Compatibility note: The F3LC11-1N is compatible with all FA-M3 base units (F3BU04-0N, F3BU06-0N, F3BU13-0N) and requires no firmware configuration — protocol parameters are set via ladder program system registers. It is not compatible with the STARDOM FCN/FCJ controller family, which uses a separate Ethernet-native architecture.

FA-M3 Full Catalog & Functionalities (SKU List)

Communication & Computer Link Modules

  • F3LC11-1N: RS-232C/RS-422/RS-485 Computer Link module, 1-channel, non-isolated, for host SCADA serial integration.
  • F3LC11-2N: RS-232C/RS-422/RS-485 Computer Link module, 2-channel, non-isolated, dual-port serial host communication.
  • F3LC12-1N: RS-232C Computer Link module, 1-channel, isolated, for noise-sensitive industrial environments.
  • F3LE01-5T: 10BASE-T Ethernet communication module, TCP/IP, for LAN-based SCADA connectivity.
  • F3LE11-1T: 100BASE-TX Ethernet module, supports MODBUS/TCP and YOKOGAWA proprietary protocol.
  • F3LP02-0N: PROFIBUS-DP slave communication module, for integration with Siemens and third-party DP masters.
  • F3LR02-0N: DeviceNet slave module, for Allen-Bradley and open DeviceNet network integration.

CPU Modules

  • F3SP21-0N: Standard CPU, 14K steps, ladder/SFC, 512 I/O points, for mid-scale process control.
  • F3SP28-3N: Enhanced CPU, 60K steps, multi-task, 2048 I/O points, supports FBD programming.
  • F3SP35-5N: High-performance CPU, 120K steps, 4096 I/O points, with built-in data logging.
  • F3SP53-4H: Advanced CPU, 250K steps, dual Ethernet ports, USB programming interface.
  • F3SP58-6S: High-speed CPU, 500K steps, 8192 I/O points, for large-scale DCS replacement applications.
  • F3SP67-6S: Top-tier CPU, 1M steps, redundancy-ready, for safety-critical continuous process plants.
  • F3SP71-4N: Latest-generation CPU, tag-based addressing, IEC 61131-3 full compliance, Ethernet/IP support.

Digital I/O Modules

  • F3XD32-3N: 32-point DC 24V digital input module, sink/source compatible, high-density rack mounting.
  • F3YD32-3N: 32-point DC 24V transistor output module, 0.1A per point, for solenoid and relay driving.
  • F3XD64-3N: 64-point DC 24V digital input module, ultra-high-density, for large I/O count applications.

Analog I/O Modules

  • F3AD04-0N: 4-channel analog input, 4–20mA / 0–10V, 12-bit resolution, for process variable acquisition.
  • F3AD08-0N: 8-channel analog input, 4–20mA / 1–5V, 12-bit, standard process instrumentation interface.
  • F3DA04-0N: 4-channel analog output, 4–20mA / 0–10V, 12-bit, for control valve and positioner driving.

Power Supply Modules

  • F3PU20-0S: AC 100–240V input power supply module, 20W output, for standard FA-M3 base units.
  • F3PU30-0S: AC 100–240V input power supply module, 30W output, for high-density I/O configurations.

Quality Control for the FA-M3 Range

FA-M3 modules present specific test challenges due to their backplane bus architecture and proprietary inter-module communication protocol. DriveKNMS applies the following verification procedures to all FA-M3 units prior to dispatch:

  • Backplane bus integrity test: Each module is seated in a live FA-M3 test rack and scanned for correct slot recognition, bus arbitration response, and absence of bus fault flags in the CPU diagnostic registers.
  • Communication link verification (for F3LC series): The F3LC11-1N and related link modules are tested under active Computer Link protocol sessions using a reference host PC, verifying correct framing, baud rate switching (1200–19200 bps), and error-response behavior across RS-232C and RS-422 modes.
  • I/O channel functional test: All analog and digital I/O modules are tested point-by-point using calibrated signal sources and loads. Analog modules are verified against factory accuracy specifications (±0.1% FS for current channels).
  • Firmware and label verification: Hardware revision codes and firmware version labels are cross-referenced against YOKOGAWA's published compatibility matrices to confirm correct application pairing.
  • Burn-in and thermal cycling: Refurbished units undergo a minimum 24-hour powered burn-in at ambient temperature before final inspection and packaging.

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