YOKOGAWA FA-M3 F3X Series Modules – F3XD64-3F

Technical Dossier

Product Details And Specifications

YOKOGAWA FA-M3 F3X Series Technical Notes

The F3X module designation covers the full range of discrete and analog I/O, CPU, communication, and specialty function modules designed for the FA-M3 backplane. These modules operate within a deterministic scan-cycle architecture and are compatible with YOKOGAWA's ToolBox and WideField3 engineering environments. The platform's modular slot-based design allows incremental expansion without system shutdown, a critical attribute for continuous-process industries.

The Evolution of FA-M3 F3X Architecture

The FA-M3 platform was introduced by YOKOGAWA in the mid-1990s as a successor to the FACTORY ACE series, consolidating discrete PLC functionality with process-oriented I/O handling. The original F3SP-series CPU modules established the base instruction set and ladder/function-block programming model that persists across all subsequent generations.

Through the late 1990s and 2000s, YOKOGAWA expanded the F3X catalog to include high-density digital I/O (32- and 64-point modules), analog input/output modules with 16-bit resolution, and dedicated communication adapters for PROFIBUS-DP, DeviceNet, FL-net, and Ethernet/IP. The F3XD64-3F — a 64-point digital I/O module — represents the high-density discrete I/O tier of this architecture, designed for applications requiring maximum point count per slot.

By the 2010s, the FA-M3 platform entered a mature lifecycle phase. YOKOGAWA continued to support existing installations while directing new project designs toward the STARDOM FCN/FCJ platform and the ProSafe-RS safety system. As a result, many F3X modules are now in the end-of-sale or end-of-life phase, making third-party spare parts sourcing a primary maintenance strategy for installed-base operators.

Compatibility note: F3X modules are slot-addressed and backplane-specific. Mixing module generations within a single base unit requires verification against the FA-M3 hardware compatibility matrix. CPU firmware version also governs which I/O module types are recognized.

FA-M3 F3X Series Full Catalog & Functionalities (SKU List)

Digital Input Modules

• F3XD32-1F: 32-point DC digital input, 24 VDC sink/source, standard density
• F3XD32-2F: 32-point DC digital input, 24 VDC, enhanced noise immunity variant
• F3XD64-3F: 64-point DC digital input/output, high-density mixed I/O, 24 VDC logic
• F3XD16-1F: 16-point DC digital input, 24 VDC, low-density slot-efficient configuration

Digital Output Modules

• F3YD32-1F: 32-point transistor output, 24 VDC, 0.1 A per point, sink type
• F3YD32-2F: 32-point transistor output, source type, short-circuit protection
• F3YR16-1F: 16-point relay output, 2 A per point, Form A contacts, 250 VAC rated
• F3YR32-1F: 32-point relay output, 1 A per point, high-density relay configuration

Analog Input Modules

• F3AD04-1F: 4-channel analog input, 4–20 mA / 1–5 V, 16-bit resolution
• F3AD08-1F: 8-channel analog input, 4–20 mA / 0–10 V, 16-bit resolution
• F3AD04-0F: 4-channel analog input, thermocouple/RTD universal input, 16-bit

Analog Output Modules

• F3DA04-1F: 4-channel analog output, 4–20 mA, 16-bit resolution, loop-powered
• F3DA08-1F: 8-channel analog output, 4–20 mA / 0–10 V, high-channel-count configuration

CPU / Controller Modules

• F3SP28-3S: Standard CPU module, 60K step program capacity, Ethernet port integrated
• F3SP38-6F: High-performance CPU, 250K step capacity, dual Ethernet, motion control support
• F3SP59-4S: Advanced CPU, 500K step, redundancy-capable, WideField3 compatible

Communication & Network Modules

• F3LP02-0N: FL-net (OPCN-2) communication module, peer-to-peer network adapter
• F3LE01-5T: Ethernet communication module, 100BASE-TX, Modbus TCP / SLMP support
• F3LR02-0N: PROFIBUS-DP slave communication adapter, 12 Mbps

Power Supply Modules

• F3PU20-0S: 24 VDC input power supply module, 20 W output, standard base unit
• F3PU30-0S: 24 VDC input power supply module, 30 W output, expanded I/O base

Sourcing Hard-to-Find & Obsolete FA-M3 F3X Parts

A significant portion of the FA-M3 F3X module catalog has transitioned to end-of-sale status. YOKOGAWA's official support policy for discontinued modules typically covers spare parts availability for a defined period post-discontinuation, after which operators must source from the secondary market or certified third-party distributors.

Quality Control for the FA-M3 F3X Range

FA-M3 F3X modules use a proprietary backplane bus protocol for inter-module communication. Standard bench power-up testing is insufficient to validate module integrity; functional verification requires simulation of the FA-M3 backplane communication cycle.

DriveKNMS applies the following test protocol to all F3X series modules prior to dispatch:

• Backplane bus simulation: Each module is seated in a live FA-M3 test rack and polled by a reference CPU to confirm slot recognition and register read/write integrity.
• Point-level I/O verification: For digital modules (including F3XD64-3F), all 64 I/O points are individually exercised using automated test fixtures. Open-circuit, short-circuit, and leakage current are measured per point.
• Analog calibration check: Analog modules are tested against NIST-traceable reference signals across the full input/output range. Offset and gain errors are documented.
• Communication module loopback: Network adapters (Ethernet, PROFIBUS, FL-net) undergo loopback and protocol handshake testing to confirm physical layer and data link layer integrity.
• Thermal cycling: Modules flagged as refurbished undergo a 4-hour thermal soak at 55°C to screen for latent component failures.
• Visual and component inspection: PCB inspection for corrosion, capacitor condition, relay contact wear, and connector pin integrity is performed under magnification prior to packaging.