GE DS200 Series Modules: DS200PCCAG8ACB

Model: DS200PCCAG8ACB

Series DS200 Series
Model DS200PCCAG8ACB
RFQ-ready model route Obsolete and surplus sourcing Export follow-up by model list

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Technical Dossier

Product Details And Specifications

GE DS200 Series Technical Notes

The Evolution of DS200 Architecture

The DS200 hardware platform was introduced as part of GE's Mark VI Speedtronic turbine control system in the mid-1990s, succeeding the earlier Mark V (DS3800 / DS3820 series) architecture. Mark VI introduced a triple-redundant TMR (Triple Modular Redundancy) control topology, with the DS200 boards serving as the physical layer for I/O, power, and communication functions within the VCMI, VTUR, VPRO, and VSVO controller racks.

With the transition to Mark VIe in the 2000s, GE migrated toward an Ethernet-based IONet architecture, replacing the older serial backplane communication used in Mark VI. Many DS200 boards remained mechanically and electrically compatible across both generations, though firmware dependencies and backplane connector pinouts differ between Mark VI and Mark VIe rack configurations. Plants operating mixed-generation fleets must verify board revision levels and firmware compatibility before substitution.

As of 2026, the DS200 series is in the mature-to-end-of-life phase of its product lifecycle. GE (now part of GE Vernova) has transitioned active development to the Mark VIeS and Mark VIeR platforms. OEM new production of most DS200 part numbers has ceased, making the secondary market and specialist distributors the primary sourcing channel for replacement boards.

DS200 Full Catalog & Functionalities (SKU List)

The following represents a structured index of verified DS200 series part numbers, organized by functional category. All models listed are confirmed members of the DS200 family used within Mark VI / Mark VIe control systems.

Power Supply & Conditioning Boards

  • DS200PCCAG8ACB: Inductor board for power conditioning within Mark VI control racks; filters and stabilizes DC bus voltage supplied to downstream logic boards.
  • DS200PCDAG1AEB: DC power conditioning board; provides regulated voltage rails to I/O and processor modules in VCMI rack configurations.
  • DS200PSDAG1ADB: Power supply distribution board; routes and monitors internal rack power across multiple board slots.

CPU & Processor Boards

  • DS200VPROG1AEB: VPRO processor board; primary control execution module for Mark VI TMR systems, runs turbine protection logic.
  • DS200VCMIG2AEB: VCMI communication and I/O management board; interfaces between the IONet Ethernet bus and field I/O terminal boards.
  • DS200DTBCG1AEB: Diagnostic and test board for CPU rack; used during commissioning and fault isolation procedures.

Analog Input (AI) Boards

  • DS200TCQAG1AEB: Thermocouple input board; accepts Type J, K, and T thermocouple signals for exhaust temperature monitoring.
  • DS200TCEAG1AEB: Enhanced thermocouple input board; 16-channel configuration with cold junction compensation.
  • DS200AAHAG1AEB: Analog input board; processes 4–20 mA and 0–10 V field signals from pressure transmitters and flow meters.
  • DS200RTBAG1AEB: RTD input board; accepts Pt100 and Pt1000 resistance temperature detector signals.

Digital Input (DI) Boards

  • DS200SDCIG2AEB: Digital contact input board; monitors discrete field contact states for valve position, breaker status, and permissive logic.
  • DS200TBCIG1AEB: Terminal board for contact inputs; provides field wiring termination for DI signal conditioning boards.

Analog Output (AO) & Digital Output (DO) Boards

  • DS200DSPXG1AEB: Digital signal processing output board; generates PWM and analog command signals to servo valve drivers.
  • DS200SVDAG1AEB: Servo driver board; provides high-current analog output to electrohydraulic servo valves for fuel and inlet guide vane control.
  • DS200TBAIG1AEB: Terminal board for analog I/O; field wiring interface for analog input and output signal conditioning modules.

Communication & Network Boards

  • DS200IOCSG1AEB: I/O communication and sequencing board; manages data exchange between field I/O boards and the VCMI processor over the internal rack bus.
  • DS200EXPSG1AEB: Expansion communication board; extends IONet connectivity to remote I/O enclosures in distributed plant configurations.

Quality Control for the DS200 Range

DS200 boards present specific testing challenges due to their integration with proprietary GE backplane communication protocols and multi-layer PCB construction. DriveKNMS applies the following verification procedures to all DS200 units prior to shipment:

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