GE DS200 Modules – DS200SDCCG4AGD

Technical Dossier

Product Details And Specifications

GE DS200 Series Technical Notes

The Evolution of DS200 Architecture

The DS200 module family was introduced as part of GE's Speedtronic Mark V control system, which succeeded the Mark IV platform in the early 1990s. Mark V represented a transition from relay-based logic to fully digital, microprocessor-driven turbine control. The DS200 board set was engineered around a VME-derived backplane with proprietary GE communication protocols (IONet and ARCNET variants), enabling high-speed inter-module data exchange within the and core racks.

DS200 Full Catalog & Functionalities (SKU List)

The following catalog covers verified DS200 series modules organized by functional category. Each entry represents a distinct, confirmed part number within the GE Speedtronic DS200 ecosystem.

Control & Processor Modules

• DS200SDCCG4AGD: Drive control board; manages speed and load regulation signals within the turbine control loop.
• DS200SDCCG1AGA: Earlier revision of the SDCC drive control board; functionally equivalent with minor firmware differences.
• DS200DSPCH1ADA: Digital signal processor card; executes real-time turbine protection and sequencing algorithms.
• DS200DMCBG1ARA: Digital motor control board; interfaces with excitation and generator control subsystems.

I/O Modules — Analog & Digital Input

• DS200TCQAG1BHF: Thermocouple input module; processes up to 16 channels of Type K/J/T thermocouple signals for exhaust temperature monitoring.
• DS200TCRAG1AAA: RTD and thermocouple analog input card; used in temperature-critical measurement loops.
• DS200DCFBG1BNA: DC feedback input board; conditions 4–20 mA and voltage feedback signals from field transmitters.
• DS200SDCIG1ABA: Servo drive control interface board; manages LVDT position feedback from fuel control valves.
• DS200SDCIG2AEB: Revised servo drive control interface; enhanced noise immunity for high-EMI environments.
• DS200ADGIH1AAA: Analog-to-digital input board; 12-bit resolution, used for pressure and flow signal conditioning.

I/O Modules — Digital Output & Relay

• DS200CTBAG1ADD: Contact input/output terminal board; provides dry-contact I/O termination for discrete field devices.
• DS200TCPSG1AME: Terminal board for pulse and speed signal inputs; interfaces with magnetic pickup units on turbine shafts.
• DS200SHVMG1AFE: High-voltage monitoring board; supervises 125 VDC bus integrity and trip relay status.

Communication & Network Adapters

• DS200AAHAH1AKD: Analog output and communication hybrid board; bridges local I/O with the IONet communication backbone.
• DS200PCCAG9ACB: PC communication adapter card; provides RS-232/RS-485 interface for HMI and historian connectivity.

Power Supply Modules

• DS200SLCCG3AGH: System-level control and power conditioning card; regulates backplane voltages and monitors power supply health across the DS200 rack.

Sourcing Hard-to-Find & Obsolete DS200 Parts

For obsolete DS200 part numbers not listed in current distributor catalogs, DriveKNMS provides: direct cross-reference matching against superseded GE part numbers; access to refurbished units that have passed full functional test protocols; and long-lead procurement support for critical spares with documented traceability. Facilities operating Mark V and early Mark VI systems under extended maintenance agreements can register their DS200 module requirements with DriveKNMS for priority allocation from incoming inventory.

Quality Control for the DS200 Range

DS200 modules present specific test challenges due to their multi-layer PCB construction, proprietary ASIC components, and backplane-dependent communication protocols. DriveKNMS applies the following test procedures to all DS200 units processed through our facility:

• Visual and physical inspection: Component-level examination for capacitor degradation, solder joint fatigue, and connector pin integrity.
• Backplane communication verification: Each module is seated in a live DS200-compatible test rack and verified for correct IONet/ARCNET handshake and data throughput.
• Functional I/O test: Signal injection at rated input ranges (4–20 mA, 0–10 V, thermocouple, RTD) with output verification against GE published specifications.
• Burn-in cycle: 48-hour powered operation under thermal cycling to screen for latent component failures.
• Firmware revision check: EPROM and flash firmware versions are documented and matched to customer site requirements where applicable.

Q: How is condition confirmed before quotation?
A: Available condition, photos, test records and documentation are checked according to the requested model and sourcing channel before a formal RFQ response.