GE DS200 Series Modules: DS200SLCCG1ACC

Model: DS200SLCCG1ACC

Series DS200 Series
Model DS200SLCCG1ACC
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Technical Dossier

Product Details And Specifications

GE DS200 Series Technical Notes

The GE DS200 series represents a core hardware platform deployed across GE's Mark VI, EX2100, and LM series turbine and generator control systems. These modules are installed in critical heavy-industry environments including petrochemical refineries, nuclear power stations, offshore platforms, combined-cycle gas turbine plants, and large-scale chemical processing facilities. The DS200 platform provides the I/O backbone, communication infrastructure, and processing logic for GE's distributed control architecture, with an installed base spanning multiple decades across North America, Europe, the Middle East, and Asia-Pacific. The DS200SLCCG1ACC is a Serial Link Communication Card used within this architecture to manage serial data exchange between control racks and peripheral devices.

The Evolution of DS200 Architecture

The DS200 hardware family was introduced alongside GE's Mark VI Turbine Control System in the mid-1990s, replacing the earlier Mark V (DS3800 / DS3820 series) platform. The Mark VI system introduced a triple-redundant I/O architecture (TCEA/TCEB/TCEC voting logic) and a dedicated high-speed IONet (Industrial Ethernet derivative) for inter-module communication. DS200 modules were designed to slot into the Mark VI I/O core (VCMI, VCRC, VCCA racks) and interface directly with field instrumentation via hardwired terminal boards.

DS200 Full Catalog & Functionalities (SKU List)

Communication & Serial Link Modules

  • DS200SLCCG1ACC: Serial Link Communication Card; manages serial data exchange between Mark VI control racks and external devices.
  • DS200SLCCG1AEA: Serial Link Communication Card, revision AEA; alternate firmware revision for specific Mark VI rack configurations.
  • DS200DSPCH1A: High-speed serial communication processor; handles protocol conversion for legacy serial field devices.
  • DS200TCQCG1AEA: Quad Communication Card; supports four independent serial communication channels in a single slot.

Analog Input / Output Modules

  • DS200IIBDG1A: Analog Input Board; 16-channel 4–20 mA input module for process variable acquisition.
  • DS200AIDAG1AEA: Analog Input/Output Daughter Board; provides supplemental analog I/O expansion within the Mark VI rack.
  • DS200AAHAG1AEA: Analog Output Module; 8-channel voltage/current output for actuator and valve positioner control.
  • DS200TCCAG1BHF: Thermocouple Input Card; 16-channel cold-junction-compensated thermocouple acquisition module.

Digital Input / Output Modules

  • DS200DSPXG1AEA: Digital Signal Processor Expansion; handles discrete I/O logic and ladder-based interlocking.
  • DS200DIDAG1AEA: Digital Input Daughter Board; 32-channel 24 VDC discrete input acquisition module.
  • DS200DODAG1AEA: Digital Output Daughter Board; 32-channel relay/transistor output module for solenoid and contactor control.
  • DS200TCEAG1BHF: Turbine Control I/O Module (TCEA); primary I/O voting card in triple-redundant Mark VI architecture.

Processor / CPU Modules

  • DS200TCPSG1AEA: Turbine Control Processor; main CPU card executing control logic and sequence programs in the Mark VI controller.
  • DS200TCQAG1BHF: Quad-Core Processor Card; enhanced processing module for high-scan-rate applications in large turbine trains.
  • DS200VPBLG1AEA: VME Processor Board; handles supervisory logic and HMI communication within the Mark VI rack.

Power Supply Modules

  • DS200PCCAG1AEA: Power Converter Card; DC-DC regulated power supply module for Mark VI I/O rack internal bus.
  • DS200PSDAG1AEA: Power Supply Daughter Board; auxiliary power distribution card for high-density I/O configurations.
  • DS200TPSG1AEA: Turbine Power Supply Card; primary 28 VDC regulated supply for Mark VI turbine control racks.

Quality Control for the DS200 Range

DS200 modules present specific test challenges due to their VME-based backplane architecture, proprietary IONet communication protocol, and multi-layer PCB construction. DriveKNMS applies a structured inspection and functional verification process to all DS200 units prior to dispatch:

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